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ST72F63BK4M1

STMicroelectronics

ST72F63BK4M1 by STMicroelectronics

ST72F63BK4M1 microcontroller from STMicroelectronics features an 8-bit CPU, operates at a max voltage of 5.5V, and includes ADC and PWM channels. With 16KB ROM and 512B RAM, it's ideal for embedded applications requiring efficient processing. Its compact design suits space-constrained environments.

Median Price

$19.300

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DF Sales Co.

USA . 50 parts In-Stock

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$19.300

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50

$19.300

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DF Sales Co.

USA . 50 parts In-Stock

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$19.300

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50

$19.300

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Vyrian

USA . 8,301 parts In-Stock

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8,301

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Digiode

USA . 4,550 parts In-Stock

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4,550

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Anansix

USA . 1,910 parts In-Stock

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Bristol Electronics

USA . 623 parts In-Stock

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Atlantic Semiconductor

USA . 623 parts In-Stock

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623

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First Choice Components Inc.

USA . 70 parts In-Stock

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70

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Inventory MP

USA . 28 parts In-Stock

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Distributors (Availability)

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Benley Electronics

USA . 2 parts In-Stock

1+ parts

$2.000

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2

$2.000

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AZTECH Wire

Italy . 786 parts In-Stock

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$11.090

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786

$11.090

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IDEA Electronic Components Group

UK . 847 parts In-Stock

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$56.017

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$50.415

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847

$56.017

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$50.415

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Component Stockers USA

USA . 284 parts In-Stock

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$99.990

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284

$99.990

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MKK Technologies

India . 859 parts In-Stock

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$105.336

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859

$105.336

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DigiPath Technology Company

USA . 859 parts In-Stock

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$105.336

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Pacific Micro-Tech

USA . 12,075 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,687 parts In-Stock

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Corphita

USA . 3,558 parts In-Stock

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Kepictronics

USA . 3,300 parts In-Stock

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Vigor

Singapore . 2,736 parts In-Stock

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Parana Technologies

USA . 1,960 parts In-Stock

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$66.977

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1,960

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$66.977

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Assy Fe

Spain . 1,000 parts In-Stock

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Perfect Parts

USA . 103 parts In-Stock

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GreenTree Electronics

Israel . 56 parts In-Stock

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Overview

Unlock your project’s potential with the ST72F63BK4M1 microcontroller from STMicroelectronics. Renowned for its quality and reliability, STMicroelectronics delivers a powerful 8-bit solution tailored for diverse applications. With features like integrated ADC and versatile I/O options, it enhances efficiency while ensuring seamless performance. Experience unparalleled value and innovation that drive your designs forward—choose ST72F63BK4M1 for exceptional quality and performance!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protects the microcontroller from environmental factors, making it suitable for various applications.

Surface Mount: YES

Being surface mount allows for smaller designs and the ability to be easily integrated into modern PCB layouts.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, the microcontroller is versatile and compatible with a wide range of power sources.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on the PCB, making it easier to fit into compact designs.

Bit Size: 8

An 8-bit architecture provides a good balance of performance and power consumption for small to medium-sized tasks.

Power Supplies (V): 5

Operating at 5V offers compatibility with standard digital logic levels, facilitating integration with other components.

No. of Terminals: 34

Having 34 terminals allows for extensive I/O capabilities, enabling multiple connections to sensors and other peripherals.

Package Style (Meter): SMALL OUTLINE

The small outline package style reduces space requirements, ideal for compact devices and embedded systems.

Minimum Supply Voltage: 4 V

A minimum supply voltage of 4 V increases its versatility in various power supply scenarios.

Maximum Operating Temperature: 70 °C

Operating at up to 70 °C provides reliability in warm environments, extending the range of applications.

CPU Family: ST72

The ST72 family is known for its robust performance in a range of applications, ensuring dependability.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0 °C, this microcontroller can function well in varying environmental conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The gold terminal finish enhances the durability and reliability of connections, serving to minimize corrosion.

ADC Channels: YES

Integrated ADC channels enable the microcontroller to interface with analog signals directly, broadening its application scope.

DMA Channels: YES

Having DMA channels facilitates efficient data handling and reduces CPU load, enhancing overall system performance.

Terminal Position: DUAL

Dual terminal positioning allows for more flexible PCB layout options, accommodating more complex designs.

ROM Words: 16384

With 16,384 words of ROM, ample space is available for program storage, supporting complex applications.

Maximum Seated Height: 2.642 mm

A low seated height helps maintain a slim profile in electronics, making it ideal for space-constrained applications.

Width: 7.5 mm

A compact width enhances PCB layout flexibility and supports miniaturization of electronic designs.

Maximum Clock Frequency: 24 MHz

A maximum clock frequency of 24 MHz ensures that the microcontroller can handle moderate processing tasks efficiently.

Maximum Time At Peak Reflow Temperature (s): 30

The ability to withstand peak reflow temperatures makes this microcontroller suitable for modern assembly processes.

Peak Reflow Temperature °C: 260

A high peak reflow temperature rating allows for compatibility with lead-free soldering processes, enhancing environmental compliance.

Length: 17.894 mm

The specific length contributes to the compact design, making it versatile for a variety of electronic applications.

Temperature Grade: COMMERCIAL

A commercial temperature grade allows for reliability in consumer products while maintaining cost-effectiveness.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it provides integrated functionalities suitable for many embedded systems and control applications.

RAM Bytes: 512

512 bytes of RAM allow for reasonable temporary data storage during operations, supporting various applications.

Technology: CMOS

Using CMOS technology offers low power consumption, making the microcontroller energy-efficient for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminals are easy to solder and provide reliable connections, beneficial for manufacturing processes.

Maximum Supply Current: 13.5 mA

A maximum supply current of 13.5 mA allows for extended battery life in portable applications.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V ensures compatibility with commonly used electrical components.

PWM Channels: YES

The inclusion of PWM channels enables advanced control over devices like motors and lights, expanding the microcontroller's usability.

ROM Programmability: FLASH

Using Flash memory for ROM makes the microcontroller easily reprogrammable, facilitating quick prototyping and updates.

Terminal Pitch: 1.016 mm

A terminal pitch of 1.016 mm provides a good balance for soldering techniques used in assembly, enhancing reliability.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates that the microcontroller can be handled with standard precautions during assembly.

Speed: 8 rpm

While the speed rating may seem low, it ensures compatibility with low-speed applications, enhancing control in those contexts.

No. of I/O Lines: 19

Having 19 I/O lines allows for complex interfacing possibilities, making it suitable for various projects.

Technical Specifications

Microcontrollers ST72F63BK4M1 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G34

JESD-609 Code:

e4

Length:

17.894 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

19

No. of Terminals:

34

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP34,.4,40

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

512

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

2.642 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

13.5 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.016 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Peripheral IC Type:

Trade Compliance

ST72F63BK4M1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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