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ST72F63BK1B1

STMicroelectronics

ST72F63BK1B1 by STMicroelectronics

ST72F63BK1B1 microcontroller from STMicroelectronics features an 8-bit CPU with a max clock frequency of 24 MHz, supporting up to 19 I/O lines. It operates b/w 4-5.5 V and includes ADC and PWM channels for versatile applications. Ideal for commercial use in embedded systems, it offers reliable performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,891 parts In-Stock

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7,891

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Digiode

USA . 1,354 parts In-Stock

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1,354

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Anansix

USA . 340 parts In-Stock

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340

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 330 parts In-Stock

1+ parts

$6.638

100+ parts

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330

$6.638

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AZTECH Wire

Italy . 426 parts In-Stock

1+ parts

$12.340

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426

$12.340

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IDEA Electronic Components Group

UK . 1,217 parts In-Stock

1+ parts

$45.587

100+ parts

-

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$41.028

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1,217

$45.587

-

$41.028

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MKK Technologies

India . 1,871 parts In-Stock

1+ parts

$85.723

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1,871

$85.723

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DigiPath Technology Company

USA . 1,871 parts In-Stock

1+ parts

$85.723

100+ parts

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1,871

$85.723

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Vigor

Singapore . 5,963 parts In-Stock

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5,963

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Corphita

USA . 3,011 parts In-Stock

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3,011

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Parana Technologies

USA . 2,085 parts In-Stock

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$54.506

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2,085

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$54.506

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Overview

Unlock the power of innovation with the ST72F63BK1B1 microcontroller from STMicroelectronics—a leader in cutting-edge semiconductor solutions. This versatile device is perfect for a wide range of applications, offering unmatched reliability and performance at a low power consumption. With robust features like advanced ADC and PWM channels, it empowers engineers to create smarter, more efficient designs. Trust in STMicroelectronics' legacy of quality to elevate your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and protection against environmental factors, making it suitable for various applications.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, this microcontroller can operate safely within common voltage ranges used in many electronic projects.

Package Shape: RECTANGULAR

The rectangular shape is standard in many designs, facilitating ease of integration into most circuit layouts.

Bit Size: 8

An 8-bit architecture is ideal for simple control tasks and efficient processing in embedded systems.

Power Supplies (V): 5

Operating at a nominal power supply of 5V makes this microcontroller compatible with a wide range of peripherals and sensors.

No. of Terminals: 32

Having 32 terminals provides ample connectivity options for various inputs and outputs, enhancing versatility in projects.

Package Style (Meter): IN-LINE, SHRINK PITCH

The in-line, shrink pitch design allows for compact placement and integration on circuit boards.

Minimum Supply Voltage: 4 V

The low minimum supply voltage of 4 V supports efficient power consumption, which is vital for battery-operated devices.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C means this microcontroller can perform reliably in a variety of environments.

CPU Family: ST72

Being part of the ST72 family means access to recognized quality and performance, with a strong community for support.

Minimum Operating Temperature: 0 °C

A minimum operating temperature of 0 °C ensures functionality in low-temperature environments, enhancing its application range.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides good solderability and resistance to oxidation, ensuring reliable electrical connections.

ADC Channels: YES

The presence of ADC channels allows for the reading of analog signals, making it suitable for sensor integration.

DMA Channels: YES

DMA channels enhance data transfer efficiency, reducing CPU overhead in applications with heavy data processing needs.

Terminal Position: DUAL

Dual terminal positioning enhances mounting options and simplifies PCB layout design.

ROM Words: 4096

With 4096 ROM words, it provides substantial program storage capacity for efficient embedded application development.

Maximum Seated Height: 5.08 mm

The low maximum seated height helps in space-constrained designs, making it ideal for compact devices.

Width: 15.24 mm

Its width allows for flexibility in PCB design, helping to optimize space usage.

Maximum Clock Frequency: 24 MHz

Operating at 24 MHz ensures a good balance between performance and power consumption for many embedded applications.

Length: 27.94 mm

Compact length makes it viable for both standard and miniaturized circuit boards.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures wider use in typical industrial and consumer applications.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it is specifically designed to control various devices and processes with high efficiency.

RAM Bytes: 384

384 bytes of RAM supports moderate data handling capabilities, suitable for many small to medium tasks.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, beneficial for battery-powered applications.

Terminal Form: THROUGH-HOLE

Through-hole mounting is advantageous for easy assembly and modification, especially in prototyping scenarios.

Maximum Supply Current: 13.5 mA

A maximum supply current of 13.5 mA allows for efficient power usage in low-power applications.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V is a common standard, making it easy to integrate into existing systems.

PWM Channels: YES

The inclusion of PWM channels offers enhanced control options for applications requiring variable signal outputs.

ROM Programmability: FLASH

Flash programmability allows for easy updating and rewriting of the program memory, promoting flexibility in development.

Terminal Pitch: 1.778 mm

A terminal pitch of 1.778 mm supports a compact layout without compromising on connectivity options.

Speed: 8 rpm

While this specification may seem low for some applications, it indicates consistent performance in controlled speed environments.

No. of I/O Lines: 19

A total of 19 I/O lines provides substantial interface options for various peripherals and signal processing needs.

Technical Specifications

Microcontrollers ST72F63BK1B1 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PDIP-T32

JESD-609 Code:

e3

Length:

27.94 mm

No. of I/O Lines:

19

No. of Terminals:

32

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SDIP32,.4

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

384

ROM Words:

4096

ROM Programmability:

FLASH

Maximum Seated Height:

5.08 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

13.5 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.778 mm

Terminal Position:

DUAL

Width:

15.24 mm

Peripheral IC Type:

Trade Compliance

ST72F63BK1B1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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