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ST72F63BH2T1

STMicroelectronics

ST72F63BH2T1 by STMicroelectronics

ST72F63BH2T1 microcontroller from STMicroelectronics features an 8-bit CPU, operates at a max voltage of 5.5V, and supports up to 24 MHz clock frequency. With 8192 ROM words and integrated ADC/DMA channels, it's ideal for embedded applications. Its compact design ensures efficient performance in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,163 parts In-Stock

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5,163

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Anansix

USA . 2,826 parts In-Stock

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2,826

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Digiode

USA . 2,382 parts In-Stock

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2,382

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 108 parts In-Stock

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$8.170

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-

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108

$8.170

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AZTECH Wire

Italy . 359 parts In-Stock

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$10.570

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359

$10.570

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IDEA Electronic Components Group

UK . 1,578 parts In-Stock

1+ parts

$28.194

100+ parts

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$25.375

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1,578

$28.194

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$25.375

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MKK Technologies

India . 697 parts In-Stock

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$53.018

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697

$53.018

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DigiPath Technology Company

USA . 697 parts In-Stock

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$53.018

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697

$53.018

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Component Stockers USA

USA . 204 parts In-Stock

1+ parts

$99.990

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204

$99.990

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Vigor

Singapore . 7,820 parts In-Stock

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7,820

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Corphita

USA . 3,368 parts In-Stock

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3,368

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Parana Technologies

USA . 943 parts In-Stock

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$33.711

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943

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$33.711

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Overview

Unlock innovation with the ST72F63BH2T1 microcontroller from STMicroelectronics, a leader in high-quality semiconductor solutions. Designed for versatility, this compact powerhouse excels in a variety of applications, from consumer electronics to industrial automation. With robust performance and low power consumption, it ensures reliability and efficiency. Experience seamless integration and superior functionality that drive your projects forward, maximizing value and minimizing complexity.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for a more compact design and efficient use of PCB space.

Maximum Supply Voltage: 5.5 V

This voltage tolerance ensures compatibility with a wide range of power supply options, simplifying circuit design.

Package Shape: SQUARE

A square package shape optimizes space on the PCB, allowing for more efficient layout designs.

Bit Size: 8

An 8-bit architecture is ideal for many embedded applications, offering a good balance between performance and power consumption.

Power Supplies (V): 5

Standard 5 V supply makes it easy to integrate with commonly used systems and power sources.

No. of Terminals: 48

A higher number of terminals provides increased functionality and the ability to connect multiple peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Low profile design minimizes height on the PCB, benefiting compact device designs and improving aesthetics.

Minimum Supply Voltage: 4 V

This lower limit allows for operation in various voltage environments, enhancing versatility.

Maximum Operating Temperature: 70 °C

Operating up to 70 °C indicates robustness for use in warm environments, ensuring reliability.

CPU Family: ST72

ST72 CPU family provides established reliability and optimizations for a range of applications.

Minimum Operating Temperature: 0 °C

Wide temperature range adaptability ensures performance in diverse environmental conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This finish provides excellent corrosion resistance and reliable electrical connections, enhancing longevity.

ADC Channels: YES

Built-in ADC channels enable direct sensing capabilities, making it suitable for data acquisition applications.

DMA Channels: YES

DMA capability increases efficiency of data processing by allowing direct memory access, reducing CPU load during operations.

Terminal Position: QUAD

Quad terminal positioning allows for better soldering reliability and helps in maintaining strong connections.

ROM Words: 8192

With 8192 ROM words, ample storage for code and data is available, allowing for complex applications.

Maximum Seated Height: 1.6 mm

A low seated height enhances design flexibility and compatibility with various PCB layouts.

Width: 7 mm

Compact width enables dense placement on PCBs, optimizing space usage.

Maximum Clock Frequency: 24 MHz

24 MHz clock speed ensures sufficient processing power for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 40

Controlled reflow temperature handling increases reliability during the assembly process.

Peak Reflow Temperature °C: 260

High reflow temperature tolerance integrates well with modern soldering techniques.

Length: 7 mm

Similar to width, a compact length is advantageous for fitting into small form factor designs.

Temperature Grade: COMMERCIAL

Commercial grade ensures product performance within typical operating conditions for general applications.

Peripheral IC Type: MICROCONTROLLER

Designed specifically as a microcontroller, it is well-suited for control applications and embedded systems.

RAM Bytes: 384

384 bytes of RAM allows for data handling and temporary storage needed in many embedded applications.

Technology: CMOS

CMOS technology provides low power consumption, making it ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals offer enhanced solderability, improving production yields.

Maximum Supply Current: 13 mA

Low maximum supply current allows for energy-efficient operation in portable applications.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V is both standard and accessible, facilitating integration into existing systems.

PWM Channels: YES

PWM capability enables control of motors, lights, and other devices, broadening application versatility.

ROM Programmability: FLASH

FLASH programmability allows for easy updates and reprogramming post-deployment, enhancing flexibility.

Terminal Pitch: 0.5 mm

Fine pitch terminals support high-density designs and maintain performance in compact layouts.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating ensures safe handling and storage during manufacturing and assembly processes.

Speed: 8 rpm

Operational speed suitable for many control systems, making it effective for slow-moving applications.

No. of I/O Lines: 27

A versatile number of I/O lines supports various peripherals and extensive functionality in applications.

Technical Specifications

Microcontrollers ST72F63BH2T1 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

27

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

384

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

13 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7 mm

Peripheral IC Type:

Trade Compliance

ST72F63BH2T1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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