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ST72F623F2M1

STMicroelectronics

ST72F623F2M1 by STMicroelectronics

ST72F623F2M1 microcontroller from STMicroelectronics features an 8-bit CPU, operates at a max voltage of 5.5V, and includes ADC channels. With 8192 ROM words and 384 RAM bytes, it's ideal for embedded applications requiring efficient processing. Its compact design suits space-constrained environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 8,700 parts In-Stock

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Vyrian

USA . 7,985 parts In-Stock

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7,985

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Anansix

USA . 2,252 parts In-Stock

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Digiode

USA . 2,241 parts In-Stock

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Mentor Electronics Marketing, LLC

USA . 2,156 parts In-Stock

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Distributors (Availability)

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Microchip USA

USA . 226 parts In-Stock

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$6.801

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226

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AZTECH Wire

Italy . 1,120 parts In-Stock

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$13.310

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$13.310

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IDEA Electronic Components Group

UK . 1,963 parts In-Stock

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$59.211

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$53.290

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1,963

$59.211

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$53.290

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MKK Technologies

India . 1,740 parts In-Stock

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$111.343

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DigiPath Technology Company

USA . 1,740 parts In-Stock

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$111.343

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Assy Fe

Spain . 6,997 parts In-Stock

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Kepictronics

USA . 6,692 parts In-Stock

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Corphita

USA . 3,478 parts In-Stock

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Vigor

Singapore . 2,705 parts In-Stock

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Parana Technologies

USA . 2,085 parts In-Stock

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$70.796

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A-Z Elektronik GmbH

Germany . 2,007 parts In-Stock

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Perfect Parts

USA . 34 parts In-Stock

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Overview

Unlock the potential of your projects with the ST72F623F2M1 microcontroller from STMicroelectronics, a leader in innovation and reliability. This compact powerhouse is designed for seamless integration into diverse applications, from consumer electronics to industrial automation. With exceptional quality and performance, it ensures efficient operation and longevity, empowering you to create cutting-edge solutions with confidence. Experience the difference that STMicroelectronics brings to your designs!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and reliability in various applications.

Surface Mount: YES

Surface mount technology ensures efficient space management on PCBs, allowing for compact designs.

Maximum Supply Voltage: 5.5 V

A higher supply voltage tolerance allows for flexibility in design and ensures compatibility with various power sources.

Package Shape: RECTANGULAR

The rectangular shape aids in easier placement on PCBs and optimal use of space.

Bit Size: 8

An 8-bit architecture is suitable for basic processing tasks while keeping costs low.

Power Supplies (V): 5

5V operation is a standard voltage level, facilitating easy integration with common components.

No. of Terminals: 20

20 terminals offer ample I/O connections for a variety of peripheral interfaces.

Package Style (Meter): SMALL OUTLINE

The small outline package style helps save space on PCBs without compromising performance.

Minimum Supply Voltage: 4 V

A low minimum supply voltage makes it energy-efficient and adaptable to battery-operated devices.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this microcontroller can be used in a wide range of environments.

CPU Family: ST72

The ST72 family is known for its reliability and is widely supported in the industry.

Minimum Operating Temperature: 0 °C

The operating temperature range allows for usage in various ambient conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This terminal finish provides excellent conductivity and corrosion resistance, enhancing longevity.

ADC Channels: YES

Integrated ADC channels allow for easy interfacing with analog sensors.

Terminal Position: DUAL

Dual terminal positioning supports flexible layout options on circuit boards.

ROM Words: 8192

With 8192 ROM words, users have sufficient memory for storing programs and data.

Maximum Seated Height: 2.65 mm

A low seated height is advantageous for use in thin-profile devices.

Width: 7.5 mm

The compact width contributes to space-saving designs, ideal for small devices.

Maximum Clock Frequency: 12 MHz

A clock frequency of 12 MHz allows for efficient processing without excessive power consumption.

Maximum Time At Peak Reflow Temperature: 30 s

This specification ensures compatibility with standard soldering processes for surface mount devices.

Peak Reflow Temperature: 260 C

A high peak reflow temperature supports reliable solder connections during manufacturing.

Length: 12.8 mm

The length is optimal for compact circuit designs without sacrificing functionality.

Temperature Grade: COMMERCIAL

Commercial temperature grade means suitability for general consumer and industrial applications.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, it is versatile, handling various control applications efficiently.

RAM Bytes: 384

384 bytes of RAM enable basic processing and data handling for applications.

Technology: CMOS

CMOS technology ensures low power consumption, making it suitable for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and reliable connections for assembly.

Maximum Supply Current: 24 mA

A low maximum supply current aids in energy-efficient designs, extending battery life.

Nominal Supply Voltage: 5 V

Operating at a nominal voltage of 5V simplifies compatibility with other digital circuits.

PWM Channels: YES

PWM capability allows for precise control of motors and other actuators, enhancing application performance.

ROM Programmability: FLASH

FLASH ROM allows for easy updates and modifications to the firmware, increasing product flexibility.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm strikes a balance between density and ease of soldering.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate humidity sensitivity, requiring proper storage and handling.

Speed: 8 rpm

A speed of 8 rpm is typical for microcontroller applications, ensuring stable performance.

No. of I/O Lines: 11

11 I/O lines provide versatility for connecting multiple devices and sensors, enhancing functionality.

Technical Specifications

Microcontrollers ST72F623F2M1 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

12 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

11

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

384

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

2.65 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

24 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Peripheral IC Type:

Trade Compliance

ST72F623F2M1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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