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ST72F622L2M1

STMicroelectronics

ST72F622L2M1 by STMicroelectronics

ST72F622L2M1 microcontroller from STMicroelectronics features an 8-bit CPU with a max clock frequency of 12 MHz, operating b/w 4-5.5 V. It includes 8192 ROM words and supports ADC and PWM channels, making it ideal for embedded applications in commercial environments. Its compact SO package ensures efficient space utilization in designs.

Median Price

$5.000

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 495 parts In-Stock

1+ parts

$5.000

100+ parts

$3.505

1k+ parts

$3.063

10k+ parts

-

495

$5.000

$3.505

$3.063

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,522 parts In-Stock

1+ parts

$6.232

100+ parts

-

1k+ parts

-

10k+ parts

-

1,522

$6.232

-

-

-

Vyrian

USA . 2,001 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,001

-

-

-

-

Anansix

USA . 1,684 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,684

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,330 parts In-Stock

1+ parts

$5.904

100+ parts

-

1k+ parts

-

10k+ parts

-

4,330

$5.904

-

-

-

IDEA Electronic Components Group

UK . 1,727 parts In-Stock

1+ parts

$57.199

100+ parts

-

1k+ parts

$51.479

10k+ parts

-

1,727

$57.199

-

$51.479

-

MKK Technologies

India . 1,991 parts In-Stock

1+ parts

$107.559

100+ parts

-

1k+ parts

-

10k+ parts

-

1,991

$107.559

-

-

-

DigiPath Technology Company

USA . 1,991 parts In-Stock

1+ parts

$107.559

100+ parts

-

1k+ parts

-

10k+ parts

-

1,991

$107.559

-

-

-

A-Z Elektronik GmbH

Germany . 6,906 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,906

-

-

-

-

Kepictronics

USA . 1,972 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,972

-

-

-

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Perfect Parts

USA . 1,374 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

1,374

-

-

-

-

Parana Technologies

USA . 888 parts In-Stock

1+ parts

-

100+ parts

$68.390

1k+ parts

-

10k+ parts

-

888

-

$68.390

-

-

Overview

Elevate your projects with the ST72F622L2M1 microcontroller from STMicroelectronics, a trusted leader in innovation and quality. This versatile, high-performance chip excels in embedded applications, delivering reliable operation in various environments. With low power consumption and seamless integration capabilities, it's perfect for everything from consumer electronics to industrial automation. Experience enhanced efficiency and design flexibility that drive your success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material ensures durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for a more compact design, enabling easier integration into modern electronic devices.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V provides flexibility, making the microcontroller compatible with standard power sources.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient space utilization in circuit designs.

Bit Size: 8

An 8-bit size is suitable for a wide range of low-power applications, offering a balance of performance and simplicity.

Power Supplies (V): 5

The compatibility with a standard 5 V power supply simplifies circuit design and reduces component count.

No. of Terminals: 34

With 34 terminals, this microcontroller offers ample connectivity options for various peripherals and input/output needs.

Package Style (Meter): SMALL OUTLINE

The small outline package style facilitates compact designs and reduces space requirements on PCBs.

Minimum Supply Voltage: 4 V

A low minimum supply voltage requirement allows for operation in low-power applications, extending battery life.

Maximum Operating Temperature: 70 °C

The ability to operate at temperatures up to 70 °C makes this microcontroller suitable for commercial applications.

CPU Family: ST72

The ST72 CPU family is known for its reliability and efficient performance, making it a trusted choice for developers.

Minimum Operating Temperature: 0 °C

With a low minimum operating temperature, this microcontroller can function effectively in a variety of environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish enhances durability and improves solderability, ensuring reliable connections.

ADC Channels: YES

The presence of ADC channels allows for analog signal processing, making it versatile for sensor applications.

Terminal Position: DUAL

Dual terminal positioning aids in space-efficient layout and simplifies PCB design.

ROM Words: 8192

With 8192 ROM words, there is ample storage for firmware and application code, allowing for complex functionality.

Maximum Seated Height: 2.642 mm

A low seated height allows for a more compact assembly in electronic devices.

Width: 7.5 mm

The narrow width enhances design flexibility and allows for smaller PCB footprints.

Maximum Clock Frequency: 12 MHz

A maximum clock frequency of 12 MHz ensures sufficient processing speed for many applications while keeping power consumption low.

Maximum Time At Peak Reflow Temperature (s): 30

A peak reflow time of 30 seconds allows for compatibility with standard manufacturing processes.

Peak Reflow Temperature °C: 260

A high peak reflow temperature ensures reliability during the soldering process.

Length: 17.885 mm

The compact length supports efficient space-saving designs in printed circuit boards.

Temperature Grade: COMMERCIAL

Commercial temperature grade indicates suitability for standard environments, enhancing reliability in everyday applications.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it is designed specifically for controlling peripherals, making it an ideal choice for embedded systems.

RAM Bytes: 384

384 bytes of RAM allows for reasonable data processing and storage for small applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, essential for battery-operated devices.

Terminal Form: GULL WING

The gull-wing terminal form design enhances solderability and ensures stable connections on the PCB.

Maximum Supply Current: 24 mA

A maximum supply current of 24 mA ensures the microcontroller can operate adequately during peak load conditions.

Nominal Supply Voltage: 5 V

The nominal operating voltage of 5 V standardizes power requirements, simplifying circuit design.

PWM Channels: YES

The inclusion of PWM channels allows for motor control and signal modulation, expanding the application range.

ROM Programmability: FLASH

With FLASH ROM, the microcontroller supports easy firmware updates and reprogramming for evolving applications.

Terminal Pitch: 1.016 mm

A terminal pitch of 1.016 mm supports a range of PCB designs while maintaining compatibility with standard mount techniques.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates that the microcontroller is appropriate for certain manufacturing processes, provided proper handling is observed.

Speed: 8 rpm

A speed rating of 8 rpm makes it suitable for low-speed applications, ideal for energy-efficient designs.

No. of I/O Lines: 23

With 23 I/O lines, this microcontroller provides substantial interfacing capacity for various applications, enhancing its versatility.

Technical Specifications

Microcontrollers ST72F622L2M1 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

12 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G34

JESD-609 Code:

e4

Length:

17.885 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

23

No. of Terminals:

34

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP34,.4,40

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

384

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

2.642 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

24 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.016 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Peripheral IC Type:

Trade Compliance

ST72F622L2M1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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