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ST72F60E2M1

STMicroelectronics

ST72F60E2M1 by STMicroelectronics

ST72F60E2M1 microcontroller from STMicroelectronics features an 8-bit CPU with a max clock frequency of 24 MHz, operating voltage range of 4-5.5 V, and 8192 ROM words. Ideal for embedded applications, it supports USB connectivity and includes timers and PWM channels. Its compact design (15.4x7.5 mm) ensures efficient integration in various devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

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Avnet

USA . 8,000 parts In-Stock

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8,000

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Vyrian

USA . 8,327 parts In-Stock

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8,327

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Anansix

USA . 2,410 parts In-Stock

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2,410

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Digiode

USA . 1,373 parts In-Stock

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1,373

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Distributors (Availability)

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Microchip USA

USA . 412 parts In-Stock

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$7.700

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-

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-

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412

$7.700

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AZTECH Wire

Italy . 509 parts In-Stock

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$15.180

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-

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509

$15.180

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IDEA Electronic Components Group

UK . 1,321 parts In-Stock

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$65.246

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-

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$58.722

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1,321

$65.246

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$58.722

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MKK Technologies

India . 374 parts In-Stock

1+ parts

$122.692

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374

$122.692

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DigiPath Technology Company

USA . 374 parts In-Stock

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$122.692

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374

$122.692

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Vigor

Singapore . 7,770 parts In-Stock

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7,770

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A-Z Elektronik GmbH

Germany . 7,116 parts In-Stock

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7,116

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Corphita

USA . 3,296 parts In-Stock

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Perfect Parts

USA . 836 parts In-Stock

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836

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Kepictronics

USA . 96 parts In-Stock

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96

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Parana Technologies

USA . 70 parts In-Stock

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$78.012

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70

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$78.012

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Overview

Unlock limitless possibilities with the ST72F60E2M1 microcontroller from STMicroelectronics! Renowned for its exceptional quality and reliability, this 8-bit powerhouse is perfect for a wide range of applications, from consumer electronics to industrial automation. Experience seamless connectivity, versatile peripherals, and energy efficiency, all designed to elevate your projects. Trust in STMicroelectronics’ expertise to enhance performance and drive innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and resistance to environmental factors, ensuring long-term reliability.

Surface Mount: YES

Surface mount design allows for compact PCB layouts, making it suitable for space-constrained applications.

Maximum Supply Voltage: 5.5 V

The moderate maximum supply voltage ensures compatibility with a wide range of power sources and circuits.

Package Shape: RECTANGULAR

The rectangular shape optimizes layout and placement on PCBs, facilitating effective use of space.

Bit Size: 8

An 8-bit architecture is ideal for simple control tasks and cost-effective solutions in embedded systems.

Power Supplies (V): 5

Operating at 5V is common in embedded systems, allowing seamless integration with existing components.

No. of Terminals: 24

Having 24 terminals provides a good balance between I/O capabilities and board space efficiency.

Package Style (Meter): SMALL OUTLINE

The small outline package reduces the footprint on PCBs, making it ideal for compact electronic designs.

Minimum Supply Voltage: 4 V

With a minimum supply voltage of 4V, the microcontroller can operate safely within standard voltage levels.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C allows for operations in varying environments, enhancing flexibility.

CPU Family: ST72

Part of the ST72 family, known for its reliability and performance in various industrial applications.

Minimum Operating Temperature: 0 °C

This range allows the device to be used in low-temperature environments, increasing its application scope.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The high-quality terminal finish enhances solderability and resistance to corrosion, ensuring better performance.

DMA Channels: YES

Direct Memory Access (DMA) capability leads to efficient data transfer, minimizing CPU load and improving performance.

Terminal Position: DUAL

Dual terminal positions enhance connection versatility with different PCB designs and layouts.

ROM Words: 8192

With 8192 ROM words, it supports substantial program code, allowing for more complex applications.

Maximum Seated Height: 2.65 mm

The low seated height allows for thin device designs which are essential in modern compact electronics.

Width: 7.5 mm

A narrow width facilitates efficient routing and placement in densely populated boards.

Peripherals: TIMER(2)

Two timers provide flexibility in managing time-related functions in embedded applications.

Maximum Clock Frequency: 24 MHz

A maximum clock frequency of 24 MHz ensures efficient processing for moderate complexity tasks.

Maximum Time At Peak Reflow Temperature (s): 30

Adequate tolerance during reflow soldering ensures reliability of the solder joints without damage.

Peak Reflow Temperature °C: 250

A high peak reflow temperature indicates compatibility with most modern soldering processes including lead-free solder.

Length: 15.4 mm

A compact length is suitable for a wide array of small embedded applications.

Temperature Grade: COMMERCIAL

Commercial temperature grade implies general-purpose use, fitting for many standard applications.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, it integrates processing capabilities with peripheral functionalities, making it versatile.

RAM Bytes: 384

384 bytes of RAM allows for sufficient temporary data storage for basic processing tasks in embedded systems.

Technology: CMOS

CMOS technology offers low power consumption, making it ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easy mounting and ensure good electrical connections.

Maximum Supply Current: 13 mA

Low supply current is beneficial for power-sensitive applications, prolonging battery life.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V aligns well with many standard electronic components.

PWM Channels: YES

Presence of PWM channels makes it ideal for motor control and other applications requiring variable power.

Connectivity: SCI, USB

Integrated connectivity options like SCI and USB facilitate communication with other devices and systems easily.

ROM Programmability: FLASH

Flash ROM allows for reprogramming, making it suitable for development and iterative design processes.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm is standard for many PCB layouts, simplifying integration into existing designs.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, suitable for a range of handling procedures.

Speed: 8 rpm

An 8 rpm speed is suitable for certain low-speed motor control applications.

On Chip Program ROM Width: 8

An 8-bit program ROM width ensures compatibility with a wide range of software tools and libraries.

No. of I/O Lines: 14

With 14 I/O lines, it provides sufficient interfacing capabilities for various sensors and actuators.

Technical Specifications

Microcontrollers ST72F60E2M1 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

NO

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

15.4 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

14

No. of Terminals:

24

On Chip Program ROM Width:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

384

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

2.65 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

13 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SCI, USB

Peripherals:

TIMER(2)

Trade Compliance

ST72F60E2M1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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