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ST72F60E1M1

STMicroelectronics

ST72F60E1M1 by STMicroelectronics

ST72F60E1M1 microcontroller from STMicroelectronics features a 24 MHz clock, 4-5.5 V supply range, and 4096 ROM words. With dual timers and PWM channels, it's ideal for embedded applications requiring efficient control. Its compact design ensures versatility in various projects.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,089 parts In-Stock

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4,089

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Digiode

USA . 2,459 parts In-Stock

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2,459

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Anansix

USA . 1,833 parts In-Stock

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1,833

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Distributors (Availability)

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Microchip USA

USA . 468 parts In-Stock

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$4.176

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468

$4.176

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AZTECH Wire

Italy . 1,133 parts In-Stock

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$8.970

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1,133

$8.970

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IDEA Electronic Components Group

UK . 790 parts In-Stock

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$48.624

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$43.761

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790

$48.624

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$43.761

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MKK Technologies

India . 590 parts In-Stock

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$91.434

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590

$91.434

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DigiPath Technology Company

USA . 590 parts In-Stock

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$91.434

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590

$91.434

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A-Z Elektronik GmbH

Germany . 4,923 parts In-Stock

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Vigor

Singapore . 3,929 parts In-Stock

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3,929

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Corphita

USA . 2,978 parts In-Stock

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2,978

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Perfect Parts

USA . 1,789 parts In-Stock

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1,789

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Parana Technologies

USA . 1,199 parts In-Stock

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$58.137

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1,199

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$58.137

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Kepictronics

USA . 60 parts In-Stock

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Overview

Unleash innovation with the ST72F60E1M1 microcontroller from STMicroelectronics, a leader in semiconductor solutions. Engineered for reliability and performance, this compact powerhouse excels in diverse applications, from consumer electronics to industrial automation. Benefit from its energy efficiency and robust functionality, ensuring seamless integration into your projects. Elevate your designs with quality you can trust and experience enhanced productivity today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protection against environmental factors, making this microcontroller suitable for various applications.

Surface Mount: YES

Surface mounting allows for a compact design, making it an ideal choice for space-constrained projects and enhancing the circuit’s performance.

Maximum Supply Voltage: 5.5 V

This microcontroller accommodates a maximum supply voltage of 5.5 V, providing flexibility in powering from standard voltage sources.

Package Shape: RECTANGULAR

The rectangular package shape is advantageous for efficient PCB layout and optimized conductive paths.

Bit Size: 8

With an 8-bit architecture, this microcontroller is suitable for basic control applications, minimizing complexity while effectively handling tasks.

Power Supplies (V): 5

Designed for a standard 5 V power supply, this microcontroller is compatible with commonly used components and systems.

No. of Terminals: 24

Having 24 terminals offers a good number of I/O options, enabling versatile integration in various applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style contributes to a compact footprint, ideal for applications where space-saving is crucial.

Minimum Supply Voltage: 4 V

The minimum supply voltage of 4 V allows for stable operation across a range of voltage conditions, ensuring reliable performance.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this microcontroller can operate effectively in a variety of environments, suitable for commercial applications.

CPU Family: ST72

The ST72 CPU family is recognized for its robustness and P efficiency, offering excellent performance for embedded systems.

Minimum Operating Temperature: 0 °C

Starting from 0 °C operationally makes it suitable for many industry applications that require low-temperature functionality.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The premium terminal finish enhances reliability and electrical connectivity, ensuring longer lifespan and better performance.

DMA Channels: YES

The presence of DMA channels allows for efficient data transfer, reducing CPU load and enhancing system performance.

Terminal Position: DUAL

Dual terminal position enables more flexible layout options during PCB design, promoting ease of integration.

ROM Words: 4096

With 4096 ROM words, it provides ample program storage space for complex applications.

Maximum Seated Height: 2.65 mm

The low seated height enables it to fit comfortably in compact designs, thus saving valuable board space.

Width: 7.5 mm

A width of 7.5 mm enhances layout flexibility, allowing integration into diverse applications without design constraints.

Maximum Clock Frequency: 24 MHz

A clock frequency of 24 MHz provides sufficient speed for most control applications, ensuring responsive performance.

Peripherals: TIMER(2)

Two integrated timers add functionality for timing operations without additional components, simplifying design.

RAM Bytes: 384

With 384 bytes of RAM, it supports moderate data processing needs for simple to intermediate applications.

Technology: CMOS

Utilizing CMOS technology enhances power efficiency, making this microcontroller suitable for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals promote easier soldering and enhance mechanical stability during PCB assembly.

Maximum Supply Current: 13 mA

A maximum supply current of 13 mA ensures efficient power consumption, beneficial for low-power applications.

Nominal Supply Voltage: 5 V

Designed to operate at a nominal voltage of 5 V, this microcontroller aligns well with common electronic components.

PWM Channels: YES

Including PWM channels enhances capabilities for control applications, such as motor speed and light dimming.

Connectivity: SCI, USB

The inclusion of SCI and USB connectivity options ensures versatile communication capabilities for various applications.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications of the program, increasing flexibility and longevity.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm is standard for many PCB designs, facilitating widespread compatibility and manufacturing efficiency.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates that it can withstand moderate moisture levels, offering durability in varied environments.

Speed: 8 rpm

At a speed of 8 rpm, this microcontroller can efficiently manage slower-speed applications, enhancing its usability.

On Chip Program ROM Width: 8

An 8-bit program ROM width provides a balance between performance and memory usage, ideal for many basic applications.

No. of I/O Lines: 14

With 14 I/O lines available, this microcontroller supports a considerable number of interfacing options for peripherals and sensors.

Technical Specifications

Microcontrollers ST72F60E1M1 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

NO

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

15.4 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

14

No. of Terminals:

24

On Chip Program ROM Width:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

384

ROM Words:

4096

ROM Programmability:

FLASH

Maximum Seated Height:

2.65 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

13 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SCI, USB

Peripherals:

TIMER(2)

Trade Compliance

ST72F60E1M1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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