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ST72F561K9T3

STMicroelectronics

ST72F561K9T3 by STMicroelectronics

ST72F561K9T3 microcontroller from STMicroelectronics features a 16 MHz clock, operates b/w -40 °C to 125 °C, and supports up to 24 I/O lines. With a compact flatpack design and automotive-grade reliability, it's ideal for embedded applications. Its 61440 ROM and ADC channels enhance functionality in various projects.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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ACDS - Activité Composants Distribution Service

France . 9,000 parts In-Stock

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9,000

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Vyrian

USA . 7,063 parts In-Stock

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7,063

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Digiode

USA . 1,951 parts In-Stock

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Anansix

USA . 1,870 parts In-Stock

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1,870

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Distributors (Availability)

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AZTECH Wire

Italy . 591 parts In-Stock

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$8.420

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-

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591

$8.420

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IDEA Electronic Components Group

UK . 1,696 parts In-Stock

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$73.438

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$66.094

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1,696

$73.438

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$66.094

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MKK Technologies

India . 1,631 parts In-Stock

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$138.096

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1,631

$138.096

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DigiPath Technology Company

USA . 1,631 parts In-Stock

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$138.096

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1,631

$138.096

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Perfect Parts

USA . 20,440 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 15,300 parts In-Stock

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15,300

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Cyclops Electronics Ltd (Excess)

UK . 9,000 parts In-Stock

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Microchip USA

USA . 3,785 parts In-Stock

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Corphita

USA . 2,127 parts In-Stock

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Parana Technologies

USA . 1,266 parts In-Stock

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$87.806

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Vigor

Singapore . 1,185 parts In-Stock

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Assy Fe

Spain . 50 parts In-Stock

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Overview

Unlock the power of innovation with the ST72F561K9T3 microcontroller from STMicroelectronics, a leader in cutting-edge technology. Designed for automotive applications, this compact powerhouse offers superior performance, reliability, and a robust temperature range, ensuring it thrives in even the most demanding environments. Experience seamless integration and enhanced efficiency, making it the ideal choice for your next project—where quality meets value!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures a lightweight and durable design, making the microcontroller suitable for various applications.

Surface Mount: YES

Surface mount technology allows for more efficient use of space on PCBs, facilitating compact designs in modern electronics.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V ensures compatibility with various power sources in typical embedded systems.

Package Shape: SQUARE

The square package shape optimizes the layout for PCB design, allowing for easier mounting and component arrangement.

Bit Size: 8

An 8-bit architecture allows for simpler design and programming, making it ideal for a wide range of control applications.

Power Supplies (V): 5

Operating at a standard 5V makes integration into existing systems straightforward and eliminates the need for additional voltage regulation.

No. of Terminals: 32

With 32 terminals, this microcontroller provides ample connections for interfacing with sensors and other peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack design allows for low-height applications, making it ideal for space-constrained designs.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5 V ensures stable operation in battery-powered applications.

Maximum Operating Temperature: 125 °C

Withstanding temperatures up to 125 °C makes this microcontroller suitable for automotive and industrial environments.

Minimum Operating Temperature: -40 °C

The ability to operate down to -40 °C provides reliability in harsh environments, making it ideal for outdoor and industrial applications.

ADC Channels: YES

Integrated ADC channels allow for direct interfacing with analog sensors, simplifying data acquisition processes.

Terminal Position: QUAD

Quad terminal position enhances the ease of soldering and improves reliability in connections.

ROM Words: 61440

A significant ROM storage capacity enables complex programs and extended functionality for applications.

Maximum Seated Height: 1.6 mm

A low seated height allows for low profile designs, important in applications where vertical space is limited.

Width: 7 mm

A 7 mm width makes this microcontroller suitable for compact devices that require efficient use of space.

Maximum Clock Frequency: 16 MHz

With a 16 MHz clock frequency, the microcontroller can handle a variety of tasks efficiently, making it versatile.

Length: 7 mm

The 7 mm length complements the compact design, facilitating integration into smaller electronic systems.

Temperature Grade: AUTOMOTIVE

Designed specifically for automotive applications, ensuring reliability and performance under automotive conditions.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it is versatile enough to be used in a wide range of embedded applications, from simple tasks to complex control systems.

RAM Bytes: 2048

2048 bytes of RAM provides sufficient data handling capabilities for running programs efficiently and managing temporary data.

Technology: CMOS

Using CMOS technology ensures low power consumption, making this microcontroller suitable for battery-powered applications.

Terminal Form: GULL WING

Gull wing terminals allow for easy soldering and provide robust mechanical stability once assembled.

Maximum Supply Current: 150 mA

A maximum supply current of 150 mA indicates flexibility in power consumption, allowing it to be used in both low and moderately powered applications.

Nominal Supply Voltage: 5 V

Operating at a nominal voltage of 5 V enhances compatibility with many standard components and power sources.

PWM Channels: YES

Having PWM channels is beneficial for applications requiring precise control over motors or LED brightness.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and reprogramming of the microcontroller, extending its lifetime and usability.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch strikes a balance between space-saving design and manufacturability, facilitating easy PCB design.

Speed: 8 rpm

An operational speed of 8 rpm indicates suitability for applications requiring moderate speed regulation, such as in robotics.

No. of I/O Lines: 24

With 24 I/O lines available, users have flexible interfacing options for various sensors, displays, and other peripherals.

Technical Specifications

Microcontrollers ST72F561K9T3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G32

Length:

7 mm

No. of I/O Lines:

24

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

61440

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

150 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Trade Compliance

ST72F561K9T3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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