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ST72F561K7T6

STMicroelectronics

ST72F561K7T6 by STMicroelectronics

ST72F561K7T6 microcontroller from STMicroelectronics features a 16 MHz clock, operates within -40 °C to 85 °C, and supports up to 24 I/O lines. With a compact low-profile package and flash ROM of 49,152 words, it's ideal for industrial applications. Its CMOS technology ensures efficient performance at a nominal voltage of 5 V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,029 parts In-Stock

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3,029

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Digiode

USA . 1,161 parts In-Stock

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1,161

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Anansix

USA . 215 parts In-Stock

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215

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Distributors (Availability)

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Microchip USA

USA . 340 parts In-Stock

1+ parts

$7.164

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340

$7.164

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AZTECH Wire

Italy . 448 parts In-Stock

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$9.700

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448

$9.700

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IDEA Electronic Components Group

UK . 1,745 parts In-Stock

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$29.090

100+ parts

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$26.181

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1,745

$29.090

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$26.181

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MKK Technologies

India . 272 parts In-Stock

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$54.703

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272

$54.703

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DigiPath Technology Company

USA . 272 parts In-Stock

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$54.703

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272

$54.703

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Vigor

Singapore . 3,034 parts In-Stock

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Corphita

USA . 2,170 parts In-Stock

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Parana Technologies

USA . 721 parts In-Stock

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$34.782

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721

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Overview

Unlock innovation with the ST72F561K7T6 microcontroller from STMicroelectronics, a trusted leader in cutting-edge technology. This robust device delivers reliability and efficiency for a diverse range of applications, from industrial automation to consumer electronics. Experience superior performance in a compact design, ensuring seamless integration into your projects. Elevate your designs and drive success with STMicroelectronics, where quality meets excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of robust plastic/epoxy helps ensure durability and resistance to environmental factors, making this microcontroller reliable in various applications.

Surface Mount: YES

Surface mount technology enables compact design and better performance in miniaturized electronic devices.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V allows compatibility with a wide range of power supply options, enhancing versatility in applications.

Package Shape: SQUARE

The square package shape is ideal for efficient PCB layout, maximizing space and promoting thermal performance.

Bit Size: 8

An 8-bit architecture is sufficient for many embedded applications, balancing performance and simplicity.

Power Supplies (V): 5

Operating at a standard power supply voltage of 5 V simplifies integration into existing systems and reduces design complexity.

No. of Terminals: 32

With 32 terminals, ample connectivity options are available for peripherals, sensors, or other devices.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack design optimizes space in compact devices, making it suitable for modern electronics where real estate is limited.

Minimum Supply Voltage: 4.5 V

The ability to operate at a minimum voltage of 4.5 V ensures consistent performance in varying power environments.

Maximum Operating Temperature: 85 °C

This microcontroller can function effectively at temperatures up to 85 °C, making it suitable for industrial applications.

CPU Family: ST72

The ST72 CPU family is known for efficient processing capabilities, enabling responsive and fast applications.

Minimum Operating Temperature: -40 °C

Operating in extremely low temperatures makes it reliable for outdoor and harsh environment applications.

ADC Channels: YES

Integrated ADC channels allow for easy interfacing with analog sensors, enhancing functionality in sensor-based applications.

Terminal Position: QUAD

The quad terminal position provides a stable connection and improves soldering reliability during assembly.

ROM Words: 49152

A significant ROM size of 49152 words supports complex programs and applications without significant limitations.

Maximum Seated Height: 1.6 mm

The low seated height contributes to a thinner profile of devices, ideal for sleek designs.

Width: 7 mm

A compact width of 7 mm makes it space-efficient when placed on circuit boards.

Maximum Clock Frequency: 16 MHz

A clock frequency of 16 MHz provides a good balance of performance for various embedded tasks.

Length: 7 mm

The length of 7 mm complements the compact design, allowing for flexible layout options on PCBs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in demanding environments.

Peripheral IC Type: MICROCONTROLLER

As a dedicated microcontroller, it excels in control applications, making it suitable for a wide range of embedded systems.

RAM Bytes: 2048

With 2048 bytes of RAM, it is capable of handling multiple data sets and procedural tasks efficiently.

Technology: CMOS

CMOS technology provides low power consumption while maintaining high performance, making it ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering techniques, enhancing assembly efficiency.

Maximum Supply Current: 8 mA

The low supply current of 8 mA optimizes power usage, making it suitable for low-power applications.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V aligns with common electronics, ensuring compatibility across various platforms.

PWM Channels: YES

Integrated PWM channels allow for precise control in applications like motor control and LED brightness adjustment.

ROM Programmability: FLASH

Flash programmability enables easy updates and modifications to the program memory, facilitating rapid prototyping and development.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm allows for high-density board layouts, accommodating more components within limited space.

Speed: 8 rpm

Speed of 8 rpm, although low, is suitable for specific applications such as monitoring or control systems where slower response is adequate.

No. of I/O Lines: 24

Having 24 I/O lines provides significant flexibility for interfacing with various peripherals and devices.

Technical Specifications

Microcontrollers ST72F561K7T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G32

Length:

7 mm

No. of I/O Lines:

24

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

49152

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

8 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Trade Compliance

ST72F561K7T6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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