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ST72F561J9TC

STMicroelectronics

ST72F561J9TC by STMicroelectronics

ST72F561J9TC by STMicroelectronics is an 8-bit microcontroller with 5V supply, 16MHz clock frequency, and 2048 bytes of RAM. Ideal for automotive applications due to its -40 to 125°C operating temperature range and FLASH ROM programmability. Features include 34 I/O lines, PWM channels, and ADC channels for versatile functionality in a compact flatpack package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 7,300 parts In-Stock

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Digiode

USA . 4,626 parts In-Stock

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Vyrian

USA . 3,921 parts In-Stock

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Anansix

USA . 1,219 parts In-Stock

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1,219

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Bristol Electronics

USA . 320 parts In-Stock

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320

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Nova Conductors

Japan . 66 parts In-Stock

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66

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Distributors (Availability)

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Microchip USA

USA . 187 parts In-Stock

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$8.522

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187

$8.522

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Ampacity Inc.

Singapore . 1,400 parts In-Stock

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$14.000

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1,400

$14.000

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AZTECH Wire

Italy . 759 parts In-Stock

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$19.728

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759

$19.728

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IDEA Electronic Components Group

UK . 656 parts In-Stock

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$48.627

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$43.764

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656

$48.627

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$43.764

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MKK Technologies

India . 264 parts In-Stock

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$91.439

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264

$91.439

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DigiPath Technology Company

USA . 264 parts In-Stock

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$91.439

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264

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Vigor

Singapore . 7,014 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,240 parts In-Stock

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Lixinc

USA . 5,902 parts In-Stock

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Corphita

USA . 3,809 parts In-Stock

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Aranea Global

USA . 100 parts In-Stock

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100

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Parana Technologies

USA . 86 parts In-Stock

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$58.140

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86

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$58.140

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Overview

Unleash the power of innovation with the ST72F561J9TC microcontroller by STMicroelectronics. Known for their high-quality products, STMicroelectronics delivers exceptional value and performance in the world of microcontrollers. Ideal for a wide range of applications, this microcontroller offers unmatched benefits and advantages to customers looking for reliability and efficiency. Explore the possibilities with the ST72F561J9TC and experience the cutting-edge technology that sets it apart from the rest.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body is cost-effective and provides good protection for the microcontroller, making it a durable choice for various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and cost during manufacturing processes.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5V, this microcontroller can easily interface with various components and peripherals within the specified voltage range.

Package Shape: SQUARE

The square package shape helps optimize PCB space utilization and ensures a compact design for space-constrained applications.

Bit Size: 8

An 8-bit microcontroller offers sufficient processing power for many applications while being cost-effective compared to higher-bit counterparts.

Power Supplies (V): 5

The 5V power supply requirement is a common voltage level in many electronic systems, enabling easy integration of this microcontroller in various projects.

No. of Terminals: 44

The ample number of 44 terminals provide flexibility for connecting external components, interfaces, and peripherals, making it suitable for complex system designs.

Package Style (Meter): FLATPACK, LOW PROFILE

The flatpack, low profile package style helps in achieving a slim and compact form factor, ideal for applications where space is a constraint.

Minimum Supply Voltage: 4.5 V

The minimum supply voltage of 4.5V ensures compatibility with lower voltage power sources, increasing the versatility of the microcontroller in various scenarios.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this microcontroller can withstand elevated temperature environments, making it suitable for industrial and automotive applications.

CPU Family: ST72

The ST72 CPU family offers reliable performance with low power consumption, making it an energy-efficient choice for applications requiring extended battery life.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40°C ensures reliable operation even in extreme cold conditions, expanding the range of potential applications for this microcontroller.

Terminal Finish: MATTE TIN

The matte tin finish on terminals provides good solderability and corrosion resistance, ensuring robust connections for reliable performance over time.

ADC Channels: YES

The presence of ADC channels allows for analog signal processing and conversion, facilitating sensor interfacing and data acquisition in various applications.

Terminal Position: QUAD

The quad terminal position enables easy soldering and connectivity on the PCB, simplifying the assembly process and ensuring secure connections.

ROM Words: 61440

The ample ROM capacity of 61440 words provides ample space for program storage, enabling the implementation of complex algorithms and functions in the microcontroller.

Maximum Seated Height: 1.6 mm

The low maximum seated height of 1.6mm helps in achieving a slim profile for the overall system design, especially in applications where space is a critical factor.

Width: 10 mm

The compact width of 10mm contributes to the overall small form factor of the microcontroller, enabling its integration in space-constrained applications.

Maximum Clock Frequency: 16 MHz

The high maximum clock frequency of 16MHz enables fast and efficient processing of instructions, making the microcontroller suitable for applications requiring real-time performance.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper solder reflow during manufacturing processes, leading to reliable solder joints.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C is well within standard reflow soldering temperatures, ensuring proper solder melting and joint formation for reliable connections.

Length: 10 mm

The compact length of 10mm contributes to the overall small footprint of the microcontroller, enabling its integration in various compact electronic devices.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade signifies that this microcontroller is designed to operate reliably in automotive environments with temperature fluctuations, ensuring robust performance in vehicle systems.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product integrates various peripherals and functions on a single chip, offering a cost-effective and space-efficient solution for embedded system designs.

RAM Bytes: 2048

The 2048 bytes of RAM provide sufficient memory for data storage and manipulation during program execution, enabling efficient processing of tasks in the microcontroller.

Technology: CMOS

The CMOS technology used in this microcontroller offers low power consumption and high noise immunity, making it suitable for battery-operated and noise-sensitive applications.

Terminal Form: GULL WING

The gull-wing terminal form facilitates easy soldering and inspection during manufacturing processes, ensuring reliable connections and reducing the risk of solder defects.

Maximum Supply Current: 15 mA

The low maximum supply current of 15mA helps in reducing power consumption, making it an energy-efficient choice for battery-powered applications.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V is a standard voltage level in many electronic systems, ensuring compatibility and ease of integration with existing designs and components.

PWM Channels: YES

The presence of PWM channels allows for precise control of analog signals, enabling applications such as motor control, lighting dimming, and sound generation.

ROM Programmability: FLASH

The ROM programmability using flash memory technology allows for easy and fast program updates and enhancements, enabling flexibility and scalability in application development.

Terminal Pitch: 0.8 mm

The 0.8mm terminal pitch provides good spacing between terminals for easy soldering and assembly, reducing the risk of short circuits and ensuring reliable connections.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates that this microcontroller requires intermediate precautions during PCB storage and handling to prevent moisture-related issues, ensuring product reliability.

Speed: 8 rpm

The speed specification of 8rpm may not be applicable for this microcontroller as it is primarily designed for processing instructions rather than rotational speed.

No. of I/O Lines: 34

The 34 I/O lines provide ample interfaces for connecting to external devices and peripherals, offering flexibility and expandability in system integration and customization.

Technical Specifications

Microcontrollers ST72F561J9TC attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

34

No. of Terminals:

44

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

61440

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

15 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

ST72F561J9TC Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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