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ST72F561J9TBXS

STMicroelectronics

ST72F561J9TBXS by STMicroelectronics

ST72F561J9TBXS microcontroller from STMicroelectronics features a 16 MHz clock, operates at 4.5-5.5 V, and includes ADC and PWM channels. With 34 I/O lines in a low-profile flatpack package, it's ideal for embedded applications requiring efficient control.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 9,993 parts In-Stock

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Digiode

USA . 4,249 parts In-Stock

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4,249

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Anansix

USA . 2,144 parts In-Stock

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2,144

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Distributors (Availability)

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AZTECH Wire

Italy . 906 parts In-Stock

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$16.090

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906

$16.090

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IDEA Electronic Components Group

UK . 1,402 parts In-Stock

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$21.315

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$19.184

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1,402

$21.315

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$19.184

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MKK Technologies

India . 1,810 parts In-Stock

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$40.082

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1,810

$40.082

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DigiPath Technology Company

USA . 1,810 parts In-Stock

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$40.082

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1,810

$40.082

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Microchip USA

USA . 1,482 parts In-Stock

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$82.750

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$82.750

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Component Stockers USA

USA . 545 parts In-Stock

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$99.990

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545

$99.990

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Kepictronics

USA . 13,000 parts In-Stock

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13,000

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Corphita

USA . 3,295 parts In-Stock

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3,295

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Parana Technologies

USA . 556 parts In-Stock

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$25.486

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556

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$25.486

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Overview

Unlock exceptional performance with the ST72F561J9TBXS microcontroller from STMicroelectronics, renowned for its reliability and innovation. Designed for diverse applications, this compact powerhouse boasts advanced features like integrated ADC and PWM channels, ensuring seamless integration into your projects. Benefit from its low power consumption and robust design, enabling you to create efficient, high-quality solutions that stand out in today's competitive market. Elevate your designs with STMicroelectronics—where quality meets uncompromising performance!

Feature Benefit Bullets

Surface Mount: YES

Being a surface mount device enables efficient utilization of PCB space, making it ideal for compact applications.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows flexibility in power management and compatibility with various power sources.

Package Shape: SQUARE

Square package shape provides uniformity in mounting and easier layout design on circuit boards.

Bit Size: 8

An 8-bit microcontroller is suitable for simpler tasks and applications, balancing performance and power consumption.

No. of Terminals: 44

Having 44 terminals facilitates a wide range of I/O connections, enabling diverse interfacing options.

Package Style (Meter): FLATPACK, LOW PROFILE

Flatpack and low profile design minimizes height, making it suitable for applications with space constraints.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage enhances power efficiency and extends battery life in portable applications.

ADC Channels: YES

Inclusion of ADC channels allows for direct interfacing with analog sensors, enhancing its application scope.

Terminal Position: QUAD

Quad terminal positions provide stable mounting and ease of access for required connections.

Width: 10 mm

Compact width supports integration in tight spaces, maintaining design flexibility.

Maximum Clock Frequency: 16 MHz

A 16 MHz clock frequency supports efficient processing for basic control tasks and real-time applications.

Length: 10 mm

A uniform length of 10 mm aligns with the width, maximizing the compact design benefits.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it is versatile for a wide array of embedded applications, from simple to complex.

Terminal Form: GULL WING

Gull wing terminals offer reliable soldering on PCBs, enhancing manufacturing robustness.

Nominal Supply Voltage: 5 V

The standard nominal supply voltage allows easy integration with commonly used power supplies and devices.

PWM Channels: YES

PWM channels make it suitable for applications requiring motor control and dimming functionalities.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch allows for denser PCB designs without compromising the manufacturing process.

Speed: 8 rpm

A speed of 8 rpm indicates suitability for low-speed control applications, particularly in robotics.

No. of I/O Lines: 34

Having 34 I/O lines provides extensive interfacing capability, enhancing its use in complex projects.

Technical Specifications

Microcontrollers ST72F561J9TBXS attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

16 MHz

DMA Channels:

NO

External Data Bus Width:

0

Length:

10 mm

No. of I/O Lines:

34

No. of Terminals:

44

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Speed:

8 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Trade Compliance

ST72F561J9TBXS Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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