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ST72F561J7TAE

STMicroelectronics

ST72F561J7TAE by STMicroelectronics

ST72F561J7TAE by STMicroelectronics is an 8-bit microcontroller with 5V supply, 16MHz clock frequency, and 2048 bytes of RAM. Ideal for industrial applications, it features CAN, LIN(2), SCI(2), SPI connectivity and 11-Ch 10-Bit ADC channels for precise analog to digital conversion.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,996 parts In-Stock

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Digiode

USA . 4,915 parts In-Stock

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Anansix

USA . 2,559 parts In-Stock

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2,559

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Distributors (Availability)

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AZTECH Wire

Italy . 449 parts In-Stock

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$10.110

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-

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449

$10.110

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IDEA Electronic Components Group

UK . 1,036 parts In-Stock

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$58.677

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-

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$52.809

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1,036

$58.677

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$52.809

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Component Stockers USA

USA . 484 parts In-Stock

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$99.990

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484

$99.990

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MKK Technologies

India . 944 parts In-Stock

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$110.338

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944

$110.338

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DigiPath Technology Company

USA . 944 parts In-Stock

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$110.338

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944

$110.338

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QUARKTWIN TECHNOLOGY LTD

USA . 22,377 parts In-Stock

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Corphita

USA . 4,243 parts In-Stock

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Microchip USA

USA . 2,979 parts In-Stock

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Vigor

Singapore . 1,507 parts In-Stock

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Parana Technologies

USA . 994 parts In-Stock

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$70.157

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994

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iodParts Technologies Inc.

India . 150 parts In-Stock

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Overview

Unleash the power of innovation with the ST72F561J7TAE microcontroller from STMicroelectronics. Crafted with precision and expertise, this high-quality product offers unparalleled performance and reliability. Perfect for a wide range of applications, this microcontroller provides value and benefits like no other. With advanced features and cutting-edge technology, the ST72F561J7TAE is your ultimate solution for all your electronic needs. Experience the difference with STMicroelectronics today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable plastic/epoxy material ensures longevity and reliability of the product.

Surface Mount: YES

Surface mount design allows for easy installation and integration into various electronic systems.

Maximum Supply Voltage: 5.5 V

Supports a wide range of supply voltages, increasing flexibility in application usage.

Package Shape: SQUARE

Square package shape for easy handling and placement on circuit boards.

Bit Size: 8

8-bit architecture provides a good balance between performance and cost.

Power Supplies (V): 5

Operates at standard 5V power supply, making it compatible with many existing systems.

No. of Terminals: 44

Ample number of terminals for connectivity and interfacing with other components.

Package Style (Meter): FLATPACK, LOW PROFILE

Low profile package style saves space and allows for compact design solutions.

Minimum Supply Voltage: 4.5 V

Ability to operate at a low minimum supply voltage enhances energy efficiency.

Maximum Operating Temperature: 85 °C

Wide operating temperature range suitable for industrial applications.

CPU Family: ST72

Belongs to a reputable CPU family known for performance and reliability.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme low temperature environments.

ADC Channels: YES

Onboard ADC channels for analog signal processing, increasing versatility.

Terminal Position: QUAD

Quad terminal position for secure and efficient connections.

ROM Words: 49152

Large ROM size for storing program instructions and data.

Maximum Seated Height: 1.6 mm

Low profile design suitable for applications with height restrictions.

Width: 10 mm

Compact width for space-constrained designs.

Peripherals: TIMER(5)

Multiple timers for precise timekeeping and synchronization.

Maximum Clock Frequency: 16 MHz

High clock frequency for speedy operation and performance.

Length: 10 mm

Short length for compact and space-saving layouts.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance for rugged environments.

Peripheral IC Type: MICROCONTROLLER

Incorporates various peripherals for enhanced functionality and control.

No. of Timers: 5

Multiple timers for multitasking and scheduling capabilities.

RAM Bytes: 2048

Sufficient RAM for data storage and processing.

Technology: CMOS

CMOS technology for low power consumption and high integration density.

Terminal Form: GULL WING

Gull wing terminal form for secure and reliable connections.

Analog To Digital Convertors: 11-Ch 10-Bit

Multiple ADC channels with high resolution for accurate analog-to-digital conversion.

Maximum Supply Current: 15 mA

Low supply current for energy-efficient operation.

Nominal Supply Voltage: 5 V

Stable and standard supply voltage for consistent performance.

PWM Channels: YES

Pulse Width Modulation (PWM) channels for precise control of output signals.

Connectivity: CAN, LIN(2), SCI(2), SPI

Multiple connectivity options for communication with external devices and networks.

ROM Programmability: FLASH

Flash ROM programmability for easy and flexible firmware updates.

Terminal Pitch: 0.8 mm

Fine terminal pitch for high-density mounting and compact layouts.

Speed: 8 rpm

Operates at a speed suitable for a wide range of applications.

On Chip Program ROM Width: 8

8-bit program ROM width for efficient data processing and storage.

No. of I/O Lines: 34

Sufficient I/O lines for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers ST72F561J7TAE attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G44

Length:

10 mm

No. of I/O Lines:

34

No. of Terminals:

44

No. of Timers:

5

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

49152

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

15 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, LIN(2), SCI(2), SPI

Peripherals:

TIMER(5)

Analog To Digital Convertors:

11-Ch 10-Bit

Trade Compliance

ST72F561J7TAE Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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