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ST72F561J6TAE

STMicroelectronics

ST72F561J6TAE by STMicroelectronics

ST72F561J6TAE by STMicroelectronics is an 8-bit microcontroller with 5V supply, 16MHz clock frequency, and 1024 bytes of RAM. Ideal for industrial applications, it features CAN, LIN(2), SCI(2), SPI connectivity and 11-Ch 10-Bit ADC channels for precise analog to digital conversion.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,664 parts In-Stock

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4,664

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Digiode

USA . 3,078 parts In-Stock

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3,078

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Anansix

USA . 472 parts In-Stock

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472

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Nova Conductors

Japan . 52 parts In-Stock

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52

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 896 parts In-Stock

1+ parts

$2.000

100+ parts

-

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896

$2.000

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Microchip USA

USA . 331 parts In-Stock

1+ parts

$7.422

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-

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331

$7.422

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AZTECH Wire

Italy . 213 parts In-Stock

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$16.497

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213

$16.497

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IDEA Electronic Components Group

UK . 1,344 parts In-Stock

1+ parts

$25.097

100+ parts

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$22.587

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1,344

$25.097

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$22.587

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MKK Technologies

India . 1,413 parts In-Stock

1+ parts

$47.193

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1,413

$47.193

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DigiPath Technology Company

USA . 1,413 parts In-Stock

1+ parts

$47.193

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1,413

$47.193

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Aztec Data Supply Inc.

USA . 49 parts In-Stock

1+ parts

$72.430

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49

$72.430

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Vigor

Singapore . 6,000 parts In-Stock

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6,000

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Aranea Global

USA . 2,000 parts In-Stock

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2,000

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Parana Technologies

USA . 997 parts In-Stock

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$30.007

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997

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$30.007

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Corphita

USA . 905 parts In-Stock

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905

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Perfect Parts

USA . 7 parts In-Stock

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7

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Overview

Discover the powerful ST72F561J6TAE microcontroller by STMicroelectronics, designed with precision and reliability in mind. Ideal for a wide range of applications, this versatile device offers 8-bit processing power, 5 timers, and 11-channel 10-bit ADC for seamless functionality. With a compact square-shaped package and low profile style, this industrial-grade microcontroller maximizes performance while minimizing space requirements. Experience the value and benefits of this top-of-the-line product, providing customers with unparalleled quality and cutting-edge technology for all their electronic needs.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material ensures durability and protection for the microcontroller.

Surface Mount:

YES - Allows for easy and efficient installation on circuit boards.

Maximum Supply Voltage:

5.5 V - Provides a wide range of voltage input options for flexibility in usage.

Package Shape:

SQUARE - Compact shape allows for efficient use of space on PCBs.

Bit Size:

8 - Ample bit size for handling various data processing tasks effectively.

Power Supplies (V):

5 - Common voltage supply requirement for compatibility with existing systems.

No. of Terminals:

44 - Sufficient terminals for connecting to external components and peripherals.

Package Style (Meter):

FLATPACK, LOW PROFILE - Low-profile design saves space and allows for slim devices.

Minimum Supply Voltage:

4.5 V - Ensures stable operation even under low voltage conditions.

Maximum Operating Temperature:

85 °C - Suitable for industrial applications with higher temperature requirements.

CPU Family:

ST72 - A reliable and established CPU family known for performance and stability.

Minimum Operating Temperature:

40 °C - Can operate in extreme cold environments without issues.

ADC Channels:

YES - Analog-to-digital conversion capability for interfacing with analog sensors.

Terminal Position:

QUAD - Terminal layout facilitates easy connections and board design.

ROM Words:

32768 - Sufficient memory for storing program instructions and data.

Maximum Seated Height:

1.6 mm - Low profile design for slim devices and space-constrained applications.

Width:

10 mm - Compact width for fitting into small form factor designs.

Peripherals:

TIMER(5) - Multiple timers for precise timing operations in various applications.

Maximum Clock Frequency:

16 MHz - High clock frequency for swift data processing and response times.

Length:

10 mm - Compact length for space-efficient PCB layout.

Temperature Grade:

INDUSTRIAL - Designed to withstand harsh industrial environments.

Peripheral IC Type:

MICROCONTROLLER - Dedicated IC for efficient control and processing tasks.

No. of Timers:

5 - Sufficient timers for managing different timing events concurrently.

RAM Bytes:

1024 - Adequate RAM for temporary data storage and manipulation.

Technology:

CMOS - Low power consumption and high noise immunity for reliable operation.

Terminal Form:

GULL WING - Terminal form factor for easy soldering and reliable connections.

Analog To Digital Convertors:

11-Ch 10-Bit - High-resolution ADC for accurate analog signal conversion.

Maximum Supply Current:

15 mA - Low current consumption for energy-efficient operation.

Nominal Supply Voltage:

5 V - Standard voltage supply for compatibility with most systems.

PWM Channels:

YES - Pulse-width modulation support for motor control and other applications.

Connectivity:

CAN, LIN(2), SCI(2), SPI - Versatile communication interfaces for diverse connectivity options.

ROM Programmability:

FLASH - Flash programmable memory for easy and quick firmware updates.

Terminal Pitch:

0.8 mm - Fine terminal pitch for high-density PCB layout.

Speed:

8 rpm - Suitable for controlling motors and other equipment with precision.

On Chip Program ROM Width:

8 - Wide ROM width for storing program instructions efficiently.

No. of I/O Lines:

34 - Abundant I/O lines for interfacing with various external devices and peripherals.

Technical Specifications

Microcontrollers ST72F561J6TAE attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G44

Length:

10 mm

No. of I/O Lines:

34

No. of Terminals:

44

No. of Timers:

5

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

15 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, LIN(2), SCI(2), SPI

Peripherals:

TIMER(5)

Analog To Digital Convertors:

11-Ch 10-Bit

Trade Compliance

ST72F561J6TAE Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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