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ST72F561J4T6

STMicroelectronics

ST72F561J4T6 by STMicroelectronics

ST72F561J4T6 microcontroller from STMicroelectronics features a 16 MHz clock, operates at 5 V with a max supply of 5.5 V, and includes 34 I/O lines. Its industrial-grade design supports applications in automation and control systems. With 16 KB ROM and ADC channels, it ensures efficient performance in various environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,713 parts In-Stock

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Digiode

USA . 4,707 parts In-Stock

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4,707

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Anansix

USA . 127 parts In-Stock

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127

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Distributors (Availability)

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Microchip USA

USA . 379 parts In-Stock

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$7.234

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379

$7.234

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AZTECH Wire

Italy . 494 parts In-Stock

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$11.210

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494

$11.210

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IDEA Electronic Components Group

UK . 713 parts In-Stock

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$47.913

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$43.121

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713

$47.913

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$43.121

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MKK Technologies

India . 1,455 parts In-Stock

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$90.097

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1,455

$90.097

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DigiPath Technology Company

USA . 1,455 parts In-Stock

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$90.097

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1,455

$90.097

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Component Stockers USA

USA . 368 parts In-Stock

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$99.990

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368

$99.990

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Corphita

USA . 4,226 parts In-Stock

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Parana Technologies

USA . 2,076 parts In-Stock

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$57.287

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Vigor

Singapore . 1,191 parts In-Stock

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Overview

Unlock unparalleled performance with the ST72F561J4T6 microcontroller from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for versatility and reliability, this low-profile, surface-mount MCU excels in demanding environments, making it perfect for industrial applications like automation, robotics, and smart devices. Experience enhanced efficiency and long-lasting quality that empower your projects to reach new heights, while benefiting from ST's trusted legacy of excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection against environmental factors, making the microcontroller suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and facilitates automated assembly, making the manufacturing process more efficient.

Maximum Supply Voltage: 5.5 V

The up to 5.5 V supply voltage compatibility ensures versatility and integration with a wide range of power sources.

Package Shape: SQUARE

A square package shape allows for efficient use of board space, optimizing layout in compact designs.

Bit Size: 8

An 8-bit size is ideal for basic control tasks, making it suitable for low-power applications with reduced complexity.

Power Supplies (V): 5

Operating at 5V is common and allows for easy integration with standard digital logic levels.

No. of Terminals: 44

A higher number of terminals increases connectivity options, allowing for complex designs with multiple peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE

Flatpack, low profile design enhances heat dissipation and is well-suited for applications with space constraints.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5 V offers flexibility, allowing it to operate in various voltage conditions.

Maximum Operating Temperature: 85 °C

An operating temperature of up to 85 °C makes this microcontroller reliable in industrial environments.

Minimum Operating Temperature: -40 °C

Its capability to function in extreme cold environments is advantageous for applications in harsh conditions.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish ensures good solderability and reduces oxidation, enhancing the longevity of the microcontroller.

ADC Channels: YES

Integrated ADC channels enable analog signal processing, expanding the range of applications in sensor interfacing.

Terminal Position: QUAD

Quad terminal positioning allows for easier placement on PCBs, improving assembly efficiency.

ROM Words: 16384

With 16K words of ROM, this microcontroller supports larger programs and complex applications.

Maximum Seated Height: 1.6 mm

A low seated height aids in maintaining a compact design, essential for space-constrained environments.

Width: 10 mm

A width of 10 mm optimizes board layout and allows for dense component packing.

Maximum Clock Frequency: 16 MHz

A clock frequency of 16 MHz provides adequate processing speed for various control applications.

Maximum Time At Peak Reflow Temperature (s): 30

A reflow time of 30 seconds indicates good thermal resistance and suitability for modern soldering processes.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C ensures compatibility with lead-free soldering techniques.

Length: 10 mm

With a length of 10 mm, this microcontroller is compact, allowing it to fit in various applications without taking up much space.

Temperature Grade: INDUSTRIAL

An industrial temperature grade guarantees reliable performance under demanding environmental conditions.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, it is designed for processing and managing a variety of peripherals seamlessly.

RAM Bytes: 1024

With 1KB of RAM, it enables basic data storage for real-time computation and data handling.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making it ideal for energy-sensitive applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and ensure stable connections on PCBs.

Maximum Supply Current: 150 mA

A maximum supply current of 150 mA supports a range of peripheral devices without compromising performance.

Nominal Supply Voltage: 5 V

The nominal 5V supply voltage streamlines integration within standard electronic systems.

PWM Channels: YES

Incorporating PWM channels allows for efficient control of motors and other devices requiring variable power.

ROM Programmability: FLASH

Flash ROM programmability offers the flexibility to update firmware easily, extending the microcontroller's lifespan.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm balances compactness with ease of handling, making assembly simpler.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, requiring careful handling during storage and assembly.

Speed: 8 rpm

A speed of 8 rpm is suitable for low-speed applications, ideal for motor control in various devices.

No. of I/O Lines: 34

The availability of 34 I/O lines offers extensive interfacing capabilities, ensuring the microcontroller can handle diverse application requirements.

Technical Specifications

Microcontrollers ST72F561J4T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

34

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

150 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

ST72F561J4T6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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