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ST72F561AR9TA

STMicroelectronics

ST72F561AR9TA by STMicroelectronics

ST72F561AR9TA microcontroller from STMicroelectronics features a 16 MHz clock, 64 terminals, and operates within -40 °C to 85 °C. With 61440 ROM words and 2048 RAM bytes, it's ideal for industrial applications requiring reliable performance. Its compact design ensures efficient surface mounting in various devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,551 parts In-Stock

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7,551

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Digiode

USA . 4,278 parts In-Stock

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4,278

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Anansix

USA . 971 parts In-Stock

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971

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Distributors (Availability)

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AZTECH Wire

Italy . 1,006 parts In-Stock

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$8.750

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-

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1,006

$8.750

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IDEA Electronic Components Group

UK . 1,163 parts In-Stock

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$43.026

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-

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$38.723

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$43.026

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$38.723

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Microchip USA

USA . 308 parts In-Stock

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$69.551

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308

$69.551

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MKK Technologies

India . 1,674 parts In-Stock

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$80.907

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1,674

$80.907

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DigiPath Technology Company

USA . 1,674 parts In-Stock

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$80.907

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$80.907

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QUARKTWIN TECHNOLOGY LTD

USA . 14,007 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,655 parts In-Stock

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Corphita

USA . 4,883 parts In-Stock

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Vigor

Singapore . 3,331 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Parana Technologies

USA . 2,128 parts In-Stock

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$51.444

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Metaverse IC Inc.

Canada . 420 parts In-Stock

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Overview

Elevate your projects with the ST72F561AR9TA microcontroller from STMicroelectronics, a trusted leader in semiconductor innovation. Crafted with precision in a low-profile package, this robust 8-bit solution excels across diverse applications—from industrial automation to consumer electronics. With superior reliability, extensive I/O capabilities, and exceptional temperature resilience, it ensures optimal performance and longevity, empowering you to bring your ideas to life seamlessly and efficiently.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and provides excellent protection against environmental factors.

Surface Mount: YES

Surface mount technology allows for compact design and efficient space utilization on PCBs.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, this microcontroller is versatile for various low-power applications.

Package Shape: SQUARE

The square package shape provides uniform layout possibilities for circuit design.

Bit Size: 8

An 8-bit microcontroller is ideal for simple applications while providing sufficient processing power.

Power Supplies (V): 5

The compatibility with a standard 5V power supply makes it easy to integrate into existing systems.

No. of Terminals: 64

A larger number of terminals allows for higher connectivity and functionality in complex designs.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low-profile design is suitable for space-constrained applications and enhances thermal performance.

Minimum Supply Voltage: 4.5 V

Allows flexibility in power supply options for varying loads and applications.

Maximum Operating Temperature: 85 °C

Supported operating temperature up to 85 °C makes it suitable for industrial environments.

Minimum Operating Temperature: -40 °C

This microcontroller can operate in extreme conditions, ensuring reliable performance in harsh environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Premium terminal finishes improve electrical connectivity and resist oxidation for longevity.

ADC Channels: YES

Integrated ADC channels allow for easy interfacing with analog sensors, expanding application possibilities.

Terminal Position: QUAD

Quad terminal positioning facilitates flexible PCB layout and design.

ROM Words: 61440

Ample ROM storage supports complex programs and data handling.

Maximum Seated Height: 1.6 mm

Low profile height ensures compatibility with compact designs and reduces overall device size.

Width: 10 mm

A width of 10 mm allows it to fit in tight spaces while still providing necessary functionality.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz enables responsive processing for moderately complex applications.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for reliable soldering processes, ensuring good quality and longevity of connections.

Peak Reflow Temperature °C: 260

Supports modern assembly processes with higher reflow temperatures for better soldering reliability.

Length: 10 mm

Compact dimensions contribute to overall space savings in electronic designs.

Temperature Grade: INDUSTRIAL

Industrial-grade ensures robust performance in a wide range of challenging environments.

Peripheral IC Type: MICROCONTROLLER

Designed as a microcontroller, it inherently supports complex control applications.

RAM Bytes: 2048

With 2048 bytes of RAM, it can handle moderate data processing tasks efficiently.

Technology: CMOS

CMOS technology grants low power consumption, essential for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals simplify soldering and improve mechanical stability.

Maximum Supply Current: 150 mA

A maximum supply current of 150 mA allows for some power-demanding peripherals to be supported.

Nominal Supply Voltage: 5 V

Nominal 5 V supply simplifies integration into various electronic systems.

PWM Channels: YES

Integrated PWM channels provide capabilities for motor control and other applications requiring variable output.

ROM Programmability: FLASH

Flash ROM allows for easy reprogramming and updates, which is essential in development.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch enables denser circuit board layouts without compromising on connectivity.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating signifies appropriate handling requirements to ensure the reliability of the device throughout its lifecycle.

Speed: 8 rpm

While speed may not be high, it is adequate for specific low-speed applications in various automation tasks.

No. of I/O Lines: 48

A generous number of I/O lines allows for extensive interfacing options with sensors and other peripherals.

Technical Specifications

Microcontrollers ST72F561AR9TA attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

48

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

61440

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

150 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

ST72F561AR9TA Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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