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ST72F561AR9T6

STMicroelectronics

ST72F561AR9T6 by STMicroelectronics

ST72F561AR9T6 microcontroller from STMicroelectronics features a 16 MHz clock, 64 terminals, and operates within -40 °C to 85 °C. With 61440 ROM words and 2048 RAM bytes, it's ideal for industrial applications requiring reliable performance. Its compact design ensures efficient surface mounting in various devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,220 parts In-Stock

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Anansix

USA . 1,105 parts In-Stock

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1,105

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Digiode

USA . 639 parts In-Stock

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639

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Distributors (Availability)

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AZTECH Wire

Italy . 1,211 parts In-Stock

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$10.940

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$10.940

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Microchip USA

USA . 347 parts In-Stock

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$28.405

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347

$28.405

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IDEA Electronic Components Group

UK . 2,275 parts In-Stock

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$58.464

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$52.618

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$58.464

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$52.618

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MKK Technologies

India . 30 parts In-Stock

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$109.938

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30

$109.938

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DigiPath Technology Company

USA . 30 parts In-Stock

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$109.938

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30

$109.938

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A-Z Elektronik GmbH

Germany . 5,232 parts In-Stock

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Vigor

Singapore . 1,202 parts In-Stock

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Kepictronics

USA . 960 parts In-Stock

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Parana Technologies

USA . 869 parts In-Stock

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$69.903

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Corphita

USA . 220 parts In-Stock

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Perfect Parts

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Overview

Unlock your project’s potential with the ST72F561AR9T6 microcontroller from STMicroelectronics, a trusted leader in innovation. This versatile, industrial-grade MCU ensures unmatched reliability, offering robust performance for a myriad of applications—from automation to consumer electronics. With its advanced features and compact design, you can achieve superior efficiency and scalability, empowering your creations to thrive in any environment. Elevate your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures good mechanical stability and protection against environmental factors, making it a reliable choice for various applications.

Surface Mount: YES

Surface mount technology allows for smaller and lighter circuit designs, optimizing space on the PCB.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, this microcontroller is versatile and can be used across a range of voltage-sensitive applications.

Package Shape: SQUARE

The square package shape optimizes space on PCB layouts and enhances thermal dissipation.

Bit Size: 8

An 8-bit architecture is beneficial for applications requiring straightforward processing, making this microcontroller suitable for basic control tasks.

Power Supplies (V): 5

Operating at 5 V is standard for many devices, providing compatibility with a wide range of peripherals and systems.

No. of Terminals: 64

With 64 terminals, this microcontroller can interface with multiple devices, expanding its functionality in complex projects.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low-profile, fine-pitch flatpack design is beneficial for high-density applications where space is a premium.

Minimum Supply Voltage: 4.5 V

The lower minimum supply voltage increases energy efficiency, allowing it to operate effectively in battery-powered devices.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this microcontroller is suitable for use in industrial environments where high temperatures may be encountered.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures (-40 °C) makes this product ideal for extreme conditions and outdoor applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finishes provide robust corrosion resistance and enhanced conductivity, ensuring long-term reliability.

ADC Channels: YES

The presence of ADC channels allows for analog signal processing, making this microcontroller suitable for sensor applications.

Terminal Position: QUAD

Quad terminal positioning ensures easy and reliable connections, reducing the risk of circuit errors during installation.

ROM Words: 61440

A substantial ROM capacity of 61440 words provides ample storage for firmware and application data.

Maximum Seated Height: 1.6 mm

A low maximum seated height enhances compatibility with compact designs and improves airflow in high-density environments.

Width: 10 mm

The compact width makes it easy to integrate into tight spaces, ideal for portable and embedded applications.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz provides sufficient processing power for handling a variety of tasks.

Maximum Time At Peak Reflow Temperature (s): 30

This specification indicates the microcontroller's durability during manufacturing processes, ensuring reliability in high-temperature soldering.

Peak Reflow Temperature °C: 260

The ability to withstand peak reflow temperatures of up to 260 °C ensures compatibility with modern soldering techniques.

Length: 10 mm

The compact length enhances flexibility in PCB design, catering to space-constrained applications.

Temperature Grade: INDUSTRIAL

An industrial temperature grade ensures that this microcontroller can operate reliably in harsh environments.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it integrates processing power and peripheral control, making it a versatile building block for electronics projects.

RAM Bytes: 2048

2048 bytes of RAM offer sufficient memory for operational tasks, making it suitable for moderately complex applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, leading to improved efficiency in battery-powered devices.

Terminal Form: GULL WING

Gull wing terminals provide enhanced mechanical stability and facilitate easier soldering to the PCB.

Maximum Supply Current: 150 mA

A maximum supply current of 150 mA allows for adequate power to drive connected devices and components.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V is a common standard that promotes compatibility with a wide array of components.

PWM Channels: YES

The inclusion of PWM channels enables precise control over motors and other actuators, making it ideal for embedded systems.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and modifications to the firmware, enhancing the product's longevity.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5 mm, this microcontroller is designed for high-density applications while maintaining connectivity.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate sensitivity to moisture, suitable for standard manufacturing and assembly conditions.

Speed: 8 rpm

A speed rating of 8 rpm suggests the microcontroller can support low-speed applications, ideal for certain motor control tasks.

No. of I/O Lines: 48

With 48 I/O lines available, this microcontroller provides extensive interfacing options for different peripherals and sensors.

Technical Specifications

Microcontrollers ST72F561AR9T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

48

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

61440

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

150 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

ST72F561AR9T6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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