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ST72F521R9T3

STMicroelectronics

ST72F521R9T3 by STMicroelectronics

ST72F521R9T3 microcontroller from STMicroelectronics features a 16 MHz CPU, operates b/w 3.8-5.5 V, and includes 48 I/O lines. Its automotive-grade design supports applications requiring high reliability in extreme temperatures (-40 °C to 125°C). With 61440 ROM words and ADC/PWM channels, it's ideal for embedded systems.

Median Price

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Lifecycle Status

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Vyrian

USA . 8,116 parts In-Stock

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ComSIT Distribution GmbH

Germany . 5,400 parts In-Stock

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Digiode

USA . 4,797 parts In-Stock

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Rebound Electronics

UK . 796 parts In-Stock

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Anansix

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Chip Stock

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LIBRA Elektronik GmbH

Germany . 173 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 61 parts In-Stock

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Elcom Components

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J & M Industries LLC

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Electronic Expediters

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Vigor

Singapore . 3,128 parts In-Stock

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$9.000

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$9.000

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AZTECH Wire

Italy . 380 parts In-Stock

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$9.110

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Microchip USA

USA . 451 parts In-Stock

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IDEA Electronic Components Group

UK . 16 parts In-Stock

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$67.629

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$60.866

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MKK Technologies

India . 39 parts In-Stock

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$127.172

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DigiPath Technology Company

USA . 39 parts In-Stock

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Kepictronics

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A-Z Elektronik GmbH

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Corphita

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RC Electronics

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Parana Technologies

USA . 2,087 parts In-Stock

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Assy Fe

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Perfect Parts

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Cyclops Electronics Ltd (Excess)

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Overview

Unlock new possibilities with the ST72F521R9T3 microcontroller from STMicroelectronics, a trusted leader in innovation. Designed for automotive applications, this low-profile, energy-efficient chip delivers unparalleled performance and reliability under extreme conditions. With advanced features like multiple ADC channels and PWM capabilities, it empowers your projects to thrive while ensuring quality that meets the highest industry standards. Elevate your designs and experience exceptional value today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Utilizing plastic/epoxy materials makes the microcontroller lightweight and cost-effective while providing decent protection against environmental factors.

Surface Mount: YES

The surface mount design allows for compact PCB layouts, facilitating the integration of multiple components and improving overall device density.

Maximum Supply Voltage: 5.5 V

Supports a slightly higher supply voltage, providing flexibility for various power supply configurations.

Package Shape: SQUARE

The square package shape enhances the layout options on a circuit board, optimizing space utilization.

Bit Size: 8

An 8-bit architecture is suitable for many embedded applications, making it a cost-effective choice for simple control tasks.

Power Supplies (V): 3.8/5.5

The dual voltage supply range allows compatibility with various power setups, making it versatile for different applications.

No. of Terminals: 64

Having 64 terminals provides ample IO options for connecting multiple peripherals and devices, enhancing functionality.

Package Style (Meter): FLATPACK, LOW PROFILE

A low-profile flatpack design is ideal for devices that require a slim profile, contributing to compact and elegant product designs.

Minimum Supply Voltage: 3.8 V

The minimum supply voltage ensures reliable operation in a range of environments and applications with lower power requirements.

Maximum Operating Temperature: 125 °C

Operating at high temperatures makes the microcontroller suitable for automotive and industrial applications where heat can be a concern.

CPU Family: ST72

The ST72 family is well-regarded for its performance and features within the industry, ensuring robust software and support.

Minimum Operating Temperature: -40 °C

This wide temperature range makes it suitable for extreme environments, ensuring functionality in harsh conditions.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and corrosion resistance, enhancing long-term reliability.

ADC Channels: YES

With integrated ADC channels, this microcontroller can easily interface with analog sensors, making it ideal for data acquisition applications.

Terminal Position: QUAD

Quad terminal positioning facilitates easier routing on PCBs, improving design flexibility and guiding signal integrity.

ROM Words: 61440

A substantial ROM capacity allows for complex programs and algorithms, enhancing the microcontroller's capability for advanced applications.

Maximum Seated Height: 1.6 mm

The low seated height assists in minimizing profile on the PCB, which is advantageous for height-sensitive applications.

Width: 14 mm

A compact width enables efficient use of space on PCBs, allowing for more components to be placed in smaller areas.

Maximum Clock Frequency: 16 MHz

A 16 MHz clock frequency affords ample speed for many applications, balancing performance and power consumption.

Maximum Time At Peak Reflow Temperature (s): 30

This specification indicates good thermal stability during soldering processes, which is critical for reliable manufacturing.

Peak Reflow Temperature °C: 250

Resilience to high reflow temperatures ensures that the microcontroller can withstand modern assembly processes without damage.

Length: 14 mm

The length contributes to the overall compact design of the component, making it suitable for space-constrained applications.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, ensuring high reliability and performance under stringent conditions expected in vehicles.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller provides efficient processing capabilities and lower power consumption, enhancing overall performance.

RAM Bytes: 2048

With 2048 bytes of RAM, the microcontroller can handle moderate data processing tasks, supporting more complex applications.

Technology: CMOS

CMOS technology provides lower power consumption and higher density, critical for mobile and battery-powered devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and improve mechanical stability on the PCB.

Maximum Supply Current: 15 mA

Low supply current suggests better energy efficiency, making it suitable for battery-operated devices.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5V is standard and commonly supported, making it easier to interface with other electronics.

PWM Channels: YES

Integrated PWM channels enable control of motors and other devices, making it suitable for applications in automation and robotics.

ROM Programmability: FLASH

Having flash ROM programmability allows for reprogramming without needing to replace the microcontroller, providing flexibility for updates.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch provides good spacing for soldering and allows for higher density in PCB designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates suitable handling procedures, ensuring integrity during storage and manufacturing.

Speed: 8 rpm

The operational speed of 8 rpm is adequate for many low-speed control applications typical in embedded systems.

On Chip Program ROM Width: 8

Having an 8-bit program ROM width aligns with the bit size, providing efficient data handling and storage capabilities.

No. of I/O Lines: 48

With 48 I/O lines, this microcontroller offers substantial interfacing options for various peripherals, enhancing its versatility.

Technical Specifications

Microcontrollers ST72F521R9T3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

48

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.6SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

250

Power Supplies (V):

3.8/5.5

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

61440

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

15 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

ST72F521R9T3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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