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ST72F521M9TCTR

STMicroelectronics

ST72F521M9TCTR by STMicroelectronics

ST72F521M9TCTR by STMicroelectronics is an 8-bit microcontroller with 61440 ROM words and 2048 RAM bytes. Ideal for automotive applications, it operates b/w -40 to 125 °C with a supply voltage of 5V. This CMOS technology device has a max supply current of 15mA at a speed of 8rpm.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,282 parts In-Stock

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4,282

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Vyrian

USA . 2,072 parts In-Stock

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2,072

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Anansix

USA . 1,147 parts In-Stock

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1,147

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 386 parts In-Stock

1+ parts

$13.282

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386

$13.282

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AZTECH Wire

Italy . 599 parts In-Stock

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$18.750

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599

$18.750

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IDEA Electronic Components Group

UK . 145 parts In-Stock

1+ parts

$73.565

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$66.209

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145

$73.565

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$66.209

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MKK Technologies

India . 44 parts In-Stock

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$138.334

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44

$138.334

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DigiPath Technology Company

USA . 44 parts In-Stock

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$138.334

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44

$138.334

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Corphita

USA . 2,562 parts In-Stock

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2,562

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Vigor

Singapore . 2,500 parts In-Stock

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2,500

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Parana Technologies

USA . 2,027 parts In-Stock

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$87.958

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2,027

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$87.958

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Overview

Experience the cutting-edge technology with the ST72F521M9TCTR microcontroller by STMicroelectronics. This versatile device offers high-quality performance in a compact package that is ideal for a wide range of applications. With its innovative design and reliable manufacturing, this microcontroller provides customers with unparalleled value and efficiency. Whether you're working on automotive projects or industrial applications, the ST72F521M9TCTR delivers exceptional results every time. Upgrade your projects with this powerful microcontroller and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good thermal and mechanical properties, making the product durable and reliable.

Surface Mount: YES

Easy to mount on PCBs, saving space and enabling automated assembly.

Package Shape: SQUARE

Square shape allows for efficient use of space on the PCB.

Bit Size: 8

Suitable for applications that require processing of 8-bit data.

Power Supplies (V): 5

Operates at a standard voltage, ensuring compatibility with common power sources.

No. of Terminals: 80

Sufficient number of terminals for connecting to various components and peripherals.

Package Style (Meter): FLATPACK

Flatpack style allows for space-saving design and ease of PCB integration.

Maximum Operating Temperature: 125 °C

Ideal for applications that require operation in high temperature environments.

CPU Family: ST72

Belongs to a reputable CPU family known for performance and reliability.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold temperatures, suitable for a wide range of applications.

Terminal Finish: MATTE TIN

Provides good conductivity and corrosion resistance for stable connections.

Terminal Position: QUAD

Quad terminal position allows for easy soldering and board layout.

ROM Words: 61440

Ample ROM capacity for storing program instructions and data.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards for ruggedness and reliability.

RAM Bytes: 2048

Sufficient RAM for temporary data storage during program execution.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminals provide strong mechanical attachment to the PCB.

Maximum Supply Current: 15 mA

Low supply current consumption for energy-efficient operation.

Nominal Supply Voltage: 5 V

Standard supply voltage for compatibility with various power sources.

ROM Programmability: FLASH

Flash ROM allows for easy reprogramming of memory contents.

Terminal Pitch: 0.635 mm

Fine terminal pitch for compact PCB design and high-density integration.

Speed: 8 rpm

Suitable for applications requiring moderate processing speed.

Technical Specifications

Microcontrollers ST72F521M9TCTR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

Bit Size:

8

CPU Family:

ST72

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

80

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP80,.64SQ

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

61440

ROM Programmability:

FLASH

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

15 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Trade Compliance

ST72F521M9TCTR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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