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ST72F521M9TC

STMicroelectronics

ST72F521M9TC by STMicroelectronics

ST72F521M9TC microcontroller from STMicroelectronics features an 8-bit CPU with a max clock frequency of 16 MHz, operating b/w -40 °C to 125 °C. It supports up to 64 I/O lines and includes ADC and PWM channels. Ideal for automotive applications, it operates on a supply voltage of 3.8V to 5.5V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,466 parts In-Stock

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3,466

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Anansix

USA . 656 parts In-Stock

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656

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Digiode

USA . 647 parts In-Stock

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647

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Distributors (Availability)

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Microchip USA

USA . 321 parts In-Stock

1+ parts

$11.959

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321

$11.959

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AZTECH Wire

Italy . 158 parts In-Stock

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$17.080

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158

$17.080

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IDEA Electronic Components Group

UK . 1,920 parts In-Stock

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$23.556

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$21.200

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$23.556

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$21.200

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MKK Technologies

India . 2,092 parts In-Stock

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$44.295

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2,092

$44.295

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DigiPath Technology Company

USA . 2,092 parts In-Stock

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$44.295

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2,092

$44.295

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Component Stockers USA

USA . 665 parts In-Stock

1+ parts

$99.990

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665

$99.990

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Futuretech Components

Singapore . 8,100 parts In-Stock

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8,100

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Vigor

Singapore . 4,899 parts In-Stock

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4,899

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Parana Technologies

USA . 1,971 parts In-Stock

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$28.164

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1,971

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$28.164

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Corphita

USA . 68 parts In-Stock

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Overview

Unlock the future of innovation with the ST72F521M9TC microcontroller from STMicroelectronics. Renowned for its superior quality and robust performance, this reliable device excels in automotive and industrial applications. With a compact, low-profile design, it offers exceptional versatility, ensuring seamless integration into your projects. Count on STMicroelectronics’ legacy of excellence to deliver unparalleled value, enhanced efficiency, and lasting benefits for your next cutting-edge solution!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package offers durability and protection from environmental factors, ensuring reliability in various applications.

Surface Mount: YES

Surface mount technology enables reduced PCB space and facilitates automated assembly, making the product suitable for compact designs.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, this microcontroller can operate safely within typical voltage levels for most applications.

Package Shape: SQUARE

The square package shape provides a symmetrical design that can simplify layout on a PCB, optimizing space usage.

Bit Size: 8

An 8-bit architecture is adequate for many embedded applications, balancing simplicity and performance for less demanding tasks.

Power Supplies (V): 5

The product is designed to operate at a nominal voltage of 5 V, which is common and easily obtainable for many designers.

No. of Terminals: 80

With 80 terminals, this microcontroller offers extensive I/O capabilities, allowing for diverse peripheral connections.

Package Style (Meter): FLATPACK, LOW PROFILE

The flatpack, low-profile design contributes to a slim form factor, ideal for space-constrained applications.

Minimum Supply Voltage: 3.8 V

A minimum supply voltage of 3.8 V ensures flexible operation and compatibility with a range of power sources.

Maximum Operating Temperature: 125 °C

Withstanding up to 125 °C makes this microcontroller suitable for automotive and other high-temperature environments.

CPU Family: ST72

The ST72 CPU family is known for its efficiency and performance, making it ideal for control-oriented applications.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40 °C ensures reliability in harsh climatic conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finishes improve solderability and corrosion resistance, enhancing long-term reliability.

ADC Channels: YES

Integrated ADC channels allow for direct measurement of analog signals, making it versatile for various input types.

Terminal Position: QUAD

Quad terminal positioning permits easier mounting and greater design flexibility on circuit boards.

ROM Words: 61440

Ample ROM capacity enables more complex programs and functionalities, enhancing the controller's capability.

Maximum Seated Height: 1.6 mm

The low seated height reduces the overall height of the assembly, which is advantageous in compact designs.

Width: 14 mm

A width of 14 mm strikes a balance between space-saving and accommodating necessary I/O connections effectively.

Maximum Clock Frequency: 16 MHz

Operating at a maximum clock frequency of 16 MHz enables efficient processing for up to moderate tasks.

Length: 14 mm

The 14 mm length contributes to a compact package that can easily fit into space-critical applications.

Temperature Grade: AUTOMOTIVE

Designed for automotive use, this microcontroller meets stringent reliability standards for critical applications.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it integrates computational and control capabilities essential for various embedded applications.

RAM Bytes: 2048

With 2048 bytes of RAM, the microcontroller can handle moderate data storage and processing tasks efficiently.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, suitable for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals provide excellent solder joint reliability, ensuring stable connections to PCBs.

Maximum Supply Current: 15 mA

A maximum supply current of 15 mA allows for energy-efficient operation, particularly beneficial in power-sensitive applications.

Nominal Supply Voltage: 5 V

5 V as the nominal supply voltage allows for compatibility with a wide range of circuits and reduces complexity.

PWM Channels: YES

The presence of PWM channels enables precise control of motors and other devices, enhancing versatility.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and modifications to the firmware, providing long-term usability.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm makes it suitable for modern PCB designs while ensuring good soldering practices.

Speed: 8 rpm

The operational speed of 8 rpm is suitable for control applications where precise, slow movements are required.

No. of I/O Lines: 64

Having 64 I/O lines offers extensive connectivity, making it ideal for applications requiring multiple inputs and outputs.

Technical Specifications

Microcontrollers ST72F521M9TC attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

14 mm

No. of I/O Lines:

64

No. of Terminals:

80

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.64SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

61440

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

15 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

ST72F521M9TC Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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