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ST72F521M9T6

STMicroelectronics

ST72F521M9T6 by STMicroelectronics

ST72F521M9T6 microcontroller from STMicroelectronics features an 8-bit CPU, operates at a max voltage of 5.5V, and supports up to 64 I/O lines. With a temp range of -40 °C to 85°C, it's ideal for industrial applications requiring reliable performance. Its low-profile package ensures efficient space utilization.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,350 parts In-Stock

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8,350

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Anansix

USA . 2,283 parts In-Stock

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Chip Stock

USA . 1,125 parts In-Stock

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Digiode

USA . 117 parts In-Stock

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IDEA Electronic Components Group

UK . 805 parts In-Stock

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$17.515

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-

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$15.763

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805

$17.515

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$15.763

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AZTECH Wire

Italy . 1,065 parts In-Stock

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$18.350

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$18.350

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Vigor

Singapore . 2,000 parts In-Stock

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$30.000

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$30.000

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MKK Technologies

India . 325 parts In-Stock

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$32.936

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$32.936

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DigiPath Technology Company

USA . 325 parts In-Stock

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$32.936

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QUARKTWIN TECHNOLOGY LTD

USA . 26,101 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Corphita

USA . 3,027 parts In-Stock

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Microchip USA

USA . 2,688 parts In-Stock

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Perfect Parts

USA . 902 parts In-Stock

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Parana Technologies

USA . 257 parts In-Stock

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S.R.D Solutions

India . 200 parts In-Stock

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Kepictronics

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Overview

Unlock the potential of your projects with the ST72F521M9T6 microcontroller from STMicroelectronics. Renowned for their quality and innovation, STMicroelectronics brings you a versatile solution that excels in demanding industrial applications. With its robust performance and wide operating temperature range, this microcontroller ensures reliability while offering seamless integration and power efficiency. Elevate your designs with ST's trusted technology—where excellence meets affordability!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliable performance and longevity in various applications.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration into modern electronic circuits.

Maximum Supply Voltage: 5.5 V

The acceptable voltage range ensures compatibility with a wide array of power supply configurations.

Package Shape: SQUARE

A square package shape facilitates efficient space utilization on PCB layouts.

Bit Size: 8

An 8-bit architecture is ideal for simple control applications, striking a balance between performance and power consumption.

Power Supplies (V): 5

Designed for 5V power supply, it aligns with common voltage levels used in microcontroller applications.

No. of Terminals: 80

With 80 terminals available, the microcontroller supports extensive I/O options for various functionalities.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack style makes it suitable for space-constrained designs and improves thermal performance.

Minimum Supply Voltage: 3.8 V

The lower supply voltage requirement enhances flexibility while allowing for efficient power usage.

Maximum Operating Temperature: 85 °C

Operating up to 85 °C makes it suitable for industrial applications where heat is a concern.

CPU Family: ST72

Part of the ST72 family, which is known for its strong performance in control applications.

Minimum Operating Temperature: -40 °C

A temperature range from -40 °C allows it to operate effectively in harsh environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish ensures excellent conductivity and corrosion resistance, enhancing longevity.

ADC Channels: YES

Integrated ADC channels allow direct analog signal processing, simplifying designs and reducing component count.

Terminal Position: QUAD

Quad terminal positioning aids in better alignment for soldering during the assembly process.

ROM Words: 61440

A substantial ROM capacity enables complex applications and extensive program storage.

Maximum Seated Height: 1.6 mm

The low seated height is advantageous for low-profile designs, maintaining a compact footprint.

Width: 14 mm

A modest width allows it to fit well into various PCB layouts without taking excessive space.

Maximum Clock Frequency: 16 MHz

With a maximum clock frequency of 16 MHz, this microcontroller can perform efficiently for many application needs.

Length: 14 mm

The length of 14 mm complements the width, creating a compact and easy-to-manage component.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, ensuring reliability in demanding environments.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it integrates processing, memory, and input/output interfaces into one unit, simplifying design.

RAM Bytes: 2048

2KB of RAM provides sufficient memory for operational tasks and moderate complexity in applications.

Technology: CMOS

CMOS technology ensures low power consumption and high speed, making it ideal for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminals allow for effective soldering, providing a secure connection to the PCB.

Maximum Supply Current: 15 mA

A maximum supply current of 15 mA indicates low power consumption, ideal for portable devices.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V simplifies sourcing power in many electronic systems.

PWM Channels: YES

The inclusion of PWM channels offers versatility in controlling motors and LED brightness.

ROM Programmability: FLASH

Flash ROM allows for easy updates and reprogramming, enhancing the device's adaptability for different applications.

Terminal Pitch: 0.65 mm

A 0.65mm terminal pitch is compatible with many PCB designs, making it easier to integrate into existing layouts.

Speed: 8 rpm

This speed capability supports various low-speed applications, making it versatile for niche use cases.

No. of I/O Lines: 64

64 I/O lines provide extensive connectivity options for interfacing with other components and peripherals.

Technical Specifications

Microcontrollers ST72F521M9T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

14 mm

No. of I/O Lines:

64

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.64SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

61440

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

15 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

ST72F521M9T6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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