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ST72F521AR6T6

STMicroelectronics

ST72F521AR6T6 by STMicroelectronics

ST72F521AR6T6 microcontroller from STMicroelectronics features a 16 MHz CPU, 64 terminals, and operates b/w -40 °C to 85°C. With 32K ROM and 1K RAM, it supports CAN, I2C, SPI for versatile applications in industrial settings. Its low-profile design ensures efficient space utilization.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,119 parts In-Stock

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4,119

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Anansix

USA . 2,083 parts In-Stock

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2,083

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Digiode

USA . 1,359 parts In-Stock

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1,359

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Distributors (Availability)

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Vigor

Singapore . 1,892 parts In-Stock

1+ parts

$6.670

100+ parts

-

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1,892

$6.670

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AZTECH Wire

Italy . 1,093 parts In-Stock

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$8.550

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1,093

$8.550

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Microchip USA

USA . 2,150 parts In-Stock

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$19.372

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2,150

$19.372

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IDEA Electronic Components Group

UK . 121 parts In-Stock

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$41.729

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$37.556

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121

$41.729

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$37.556

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MKK Technologies

India . 1,282 parts In-Stock

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$78.469

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1,282

$78.469

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DigiPath Technology Company

USA . 1,282 parts In-Stock

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$78.469

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1,282

$78.469

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Component Stockers USA

USA . 241 parts In-Stock

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$99.990

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241

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 27,354 parts In-Stock

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27,354

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Corphita

USA . 3,402 parts In-Stock

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3,402

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Parana Technologies

USA . 1,500 parts In-Stock

1+ parts

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$49.894

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1,500

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$49.894

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Overview

Elevate your projects with the ST72F521AR6T6 from STMicroelectronics—a trusted leader in microcontroller innovation. This robust 8-bit MCU is designed for versatility, offering exceptional performance across various applications, from industrial automation to consumer electronics. Its reliable operation and extensive connectivity options ensure seamless integration, empowering you to create smart, efficient solutions that stand out in today’s competitive market. Experience quality and efficiency like never before!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and resistance to environmental factors, making the microcontroller suitable for various applications.

Surface Mount: YES

Surface mount technology allows for efficient use of board space, enabling compact designs in modern electronics.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V allows compatibility with a wide range of power sources, ensuring flexibility in design.

Package Shape: SQUARE

The square package shape facilitates easy integration into various layouts, improving the overall PCB design.

Bit Size: 8

With an 8-bit architecture, this microcontroller is well-suited for applications that require basic processing capabilities.

Power Supplies (V): 5

Operating at a nominal supply of 5 V simplifies design by using common power sources readily available in many applications.

No. of Terminals: 64

The 64 terminals provide ample connectivity options for interfacing with various peripherals, enhancing functionality.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile design is ideal for high-density applications where space is a concern.

Minimum Supply Voltage: 3.8 V

The ability to operate down to 3.8 V ensures better performance in low-voltage applications, improving energy efficiency.

Maximum Operating Temperature: 85 °C

An operating temperature of up to 85 °C makes this microcontroller suitable for industrial applications and challenging environments.

CPU Family: ST72

The ST72 CPU family is known for its reliable performance in consumer and industrial applications.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C ensures the microcontroller can function in extreme cold conditions, ideal for outdoor and harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish provides excellent corrosion resistance and enhances reliability, ensuring long-term performance.

ADC Channels: YES

The presence of ADC channels allows for analog signal processing, expanding the microcontroller's application in sensor-based designs.

Terminal Position: QUAD

Quad terminal position helps with accurate alignment during soldering and improves the mechanical stability of the components.

ROM Words: 32768

With a ROM capacity of 32768 words, this microcontroller can store a significant amount of application code.

Maximum Seated Height: 1.6 mm

A maximum seated height of 1.6 mm allows for a low-profile design, which is advantageous in space-constrained applications.

Width: 10 mm

Compact width makes it suitable for embedding in small electronic devices.

Peripherals: TIMER(5)

Having multiple timers enhances the capabilities for precise timing operations and event scheduling.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz allows for efficient processing speed in various applications.

Length: 10 mm

The standard length of 10 mm is conducive for integration into many PCB designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliability and consistent performance in demanding environments.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller means it integrates processing, memory, and I/O functions, making it a versatile choice for embedded systems.

RAM Bytes: 1024

With 1024 bytes of RAM, it provides sufficient memory for temporary data storage during program execution.

Technology: CMOS

CMOS technology offers low power consumption, making it ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and reliable connections on PCBs.

Analog To Digital Convertors: 16-Ch 10-Bit

The 16-channel, 10-bit ADC allows for versatile analog input measurements, making it beneficial for sensor applications.

Maximum Supply Current: 15 mA

Low maximum supply current ensures energy efficiency, extending the battery life of portable devices.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V is compatible with many other components, simplifying the design process.

PWM Channels: YES

Support for PWM channels allows for control of motor speeds and other applications requiring modulation.

Connectivity: CAN, I2C, SCI, SPI

Multiple connectivity interfaces enhance communication options with other devices, making the microcontroller highly versatile.

ROM Programmability: FLASH

Flash ROM programmability allows for reprogramming the microcontroller, which is critical for updating applications.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm supports high-density designs, an advantage for modern electronic devices.

Speed: 8 rpm

Optimized for 8 rpm applications, it fits well in low-speed control scenarios.

On Chip Program ROM Width: 8

An 8-bit program ROM width ensures compatibility with a wide range of instruction sets and applications.

No. of I/O Lines: 48

Having 48 I/O lines allows for significant external device connectivity, enhancing the microcontroller's flexibility in designs.

Technical Specifications

Microcontrollers ST72F521AR6T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

No. of I/O Lines:

48

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

15 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C, SCI, SPI

Peripherals:

TIMER(5)

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

ST72F521AR6T6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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