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ST72F361K9TC

STMicroelectronics

ST72F361K9TC by STMicroelectronics

ST72F361K9TC microcontroller from STMicroelectronics features a 5V supply, operates in -40 °C to 125 °C range, and includes 6 ADC channels. With 61440 ROM words and 2048 RAM bytes, it's ideal for automotive applications requiring reliable performance. Its compact design supports various connectivity options like LIN and SPI.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,321 parts In-Stock

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8,321

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Digiode

USA . 3,987 parts In-Stock

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3,987

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Anansix

USA . 2,088 parts In-Stock

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2,088

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Distributors (Availability)

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AZTECH Wire

Italy . 694 parts In-Stock

1+ parts

$18.070

100+ parts

-

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694

$18.070

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IDEA Electronic Components Group

UK . 1,124 parts In-Stock

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$32.298

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-

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$29.068

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1,124

$32.298

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$29.068

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MKK Technologies

India . 1,036 parts In-Stock

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$60.733

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1,036

$60.733

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DigiPath Technology Company

USA . 1,036 parts In-Stock

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$60.733

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1,036

$60.733

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Authorized Procurement Solutions

USA . 23,880 parts In-Stock

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23,880

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Microchip USA

USA . 7,165 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,127 parts In-Stock

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7,127

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QUARKTWIN TECHNOLOGY LTD

USA . 4,145 parts In-Stock

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4,145

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Vigor

Singapore . 2,062 parts In-Stock

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2,062

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Parana Technologies

USA . 661 parts In-Stock

1+ parts

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$38.617

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661

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$38.617

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Corphita

USA . 236 parts In-Stock

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Overview

Unlock innovation with the ST72F361K9TC microcontroller from STMicroelectronics—your partner in excellence. Designed for reliability and precision in automotive applications, this compact powerhouse ensures robust performance even in extreme environments. Benefit from its rich feature set, including multiple ADC channels and timers, all while enjoying the trusted quality of a leading manufacturer. Elevate your projects with cutting-edge technology that drives efficiency and empowers creativity!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and provides good insulation, making it ideal for automotive applications.

Surface Mount: YES

Surface mount technology allows for compact design and efficient use of board space, which is essential in modern electronics.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V makes it compatible with a wide range of circuits, simplifying integration.

Package Shape: SQUARE

The square package shape allows for efficient layout and thermal management in circuit design.

Bit Size: 8

An 8-bit architecture is sufficient for many control applications, offering a balance between performance and cost.

Power Supplies (V): 5

Operating at a standard voltage of 5V makes it convenient to power and integrate into existing systems.

No. of Terminals: 32

Having 32 terminals provides ample connectivity options for numerous inputs and outputs, enhancing versatility.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack style ensures a space-saving footprint, beneficial in compact electronic devices.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage improves flexibility in power supply design and energy efficiency.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature ensures reliability in extreme conditions, making it suitable for automotive applications.

Minimum Operating Temperature: -40 °C

The ability to operate in low temperatures increases the range of environments this product can be used in.

ADC Channels: YES

The inclusion of ADC channels enables the microcontroller to interface with analog sensors, making it versatile.

Terminal Position: QUAD

Quad terminal positioning enhances reliability during soldering and improves mechanical strength.

ROM Words: 61440

A large number of ROM words provides ample space for program storage, facilitating complex applications.

Maximum Seated Height: 1.6 mm

A low seated height reduces the overall profile of the module, making it ideal for compact applications.

Width: 7 mm

A width of 7 mm aids in compact PCB designs, conserving space without compromising functionality.

Peripherals: TIMER(5)

Multiple timers enhance the microcontroller's ability to manage time-critical tasks efficiently.

Maximum Clock Frequency: 8 MHz

An 8 MHz clock frequency allows for adequate processing speed for many embedded applications.

Length: 7 mm

The compact length matches its width, providing a symmetrical and space-efficient design for PCBs.

Temperature Grade: AUTOMOTIVE

Designed specifically for automotive applications, ensuring reliability in harsh environments.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it is ideal for embedded systems requiring control functions.

RAM Bytes: 2048

With 2048 bytes of RAM, it supports moderate data processing needs for various applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it energy-efficient.

Terminal Form: GULL WING

Gull wing terminals facilitate easy handling and soldering, improving manufacturing efficiency.

Analog To Digital Converters: 6-Ch 10-Bit

6-channel 10-bit ADCs enable accurate digital representation of analog signals, crucial for precise control.

Maximum Supply Current: 12 mA

A low maximum supply current enhances energy efficiency, reducing overall power consumption.

Nominal Supply Voltage: 5 V

Nominal operation at 5V simplifies system design, making it compatible with a variety of power sources.

PWM Channels: YES

Peripheral PWM channels enable control of motors and other devices, enhancing flexibility for various applications.

Connectivity: LIN(2), SCI(2), SPI

Multiple communication protocols increase connectivity options, making the microcontroller adaptable to different systems.

ROM Programmability: FLASH

The FLASH ROM allows for easy updates and reprogramming, which is essential for product lifecycle management.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch allows for compact designs while maintaining ease of soldering.

Speed: 8 rpm

A speed of 8 rpm indicates suitable performance for various control tasks, especially in automotive applications.

On Chip Program ROM Width: 8

An 8-bit ROM width is compatible with numerous applications, striking a balance between performance and complexity.

No. of I/O Lines: 26

Having 26 I/O lines provides extensive interfacing possibilities for sensors and actuators, enhancing the product's versatility.

Technical Specifications

Microcontrollers ST72F361K9TC attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G32

Length:

7 mm

No. of I/O Lines:

26

No. of Terminals:

32

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

61440

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

12 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

LIN(2), SCI(2), SPI

Peripherals:

TIMER(5)

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

ST72F361K9TC Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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