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ST72F361K9T6

STMicroelectronics

ST72F361K9T6 by STMicroelectronics

ST72F361K9T6 microcontroller from STMicroelectronics features a 5V supply, 8-bit architecture, and 32 terminals. It operates in extreme temperatures (-40 °C to 85 °C) and includes peripherals like ADCs and timers. Ideal for industrial applications requiring low power and robust performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,169 parts In-Stock

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Vyrian

USA . 2,878 parts In-Stock

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Anansix

USA . 1,380 parts In-Stock

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1,380

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Connector Distribution Corp

USA . 20 parts In-Stock

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20

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Right Parts Inc.

USA . 20 parts In-Stock

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20

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Distributors (Availability)

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Microchip USA

USA . 466 parts In-Stock

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$7.022

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466

$7.022

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AZTECH Wire

Italy . 36 parts In-Stock

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$10.470

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36

$10.470

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IDEA Electronic Components Group

UK . 382 parts In-Stock

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$16.031

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$14.428

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382

$16.031

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$14.428

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MKK Technologies

India . 247 parts In-Stock

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$30.145

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DigiPath Technology Company

USA . 247 parts In-Stock

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$30.145

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247

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Corphita

USA . 3,983 parts In-Stock

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Vigor

Singapore . 1,732 parts In-Stock

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Parana Technologies

USA . 1,000 parts In-Stock

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$19.168

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Perfect Parts

USA . 513 parts In-Stock

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513

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Overview

Unlock exceptional performance with the ST72F361K9T6 microcontroller from STMicroelectronics, a leader in innovative semiconductor solutions. Renowned for its reliability and quality, this compact powerhouse excels in industrial applications, offering low power consumption and versatile connectivity options like LIN and SPI. Experience seamless integration, enhanced functionality, and robust processing power—perfect for your next project, ensuring you stay ahead of the competition!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy ensures enhanced protection against environmental factors, making it durable for various applications.

Surface Mount: YES

Surface mount technology allows for more compact designs and easier automated assembly, making it ideal for modern electronics.

Maximum Supply Voltage: 5.5 V

The permissible voltage range allows compatibility with common power supplies, ensuring reliability and ease of integration.

On Chip Data RAM Width: 8

An 8-bit RAM width allows for efficient data manipulation for simpler applications, reducing costs without sacrificing performance.

Package Shape: SQUARE

The square package shape is space-efficient, allowing for better PCB design and enhancing layout flexibility.

Bit Size: 8

With an 8-bit architecture, this microcontroller is well-suited for low-power applications and simpler control tasks.

No. of Terminals: 32

The higher terminal count provides flexibility for a variety of I/O connections, supporting more complex designs.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile design is beneficial for compact applications, making it suitable for small form factor devices.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5 V ensures operation in low voltage environments while maintaining performance.

Maximum Operating Temperature: 85 °C

This allows the microcontroller to operate in a broad range of temperature conditions, making it suitable for industrial applications.

CPU Family: ST7

The ST7 family is known for its reliability and performance in a variety of applications, ensuring trusted performance.

No. of External Interrupts: 13

With 13 external interrupts, this microcontroller is responsive and can handle multiple peripheral signals efficiently.

Minimum Operating Temperature: -40 °C

Suitable for extreme environments, this microcontroller can withstand harsh climatic conditions without failure.

Terminal Finish: Matte Tin (Sn)

The matte tin finish improves solderability and reduces corrosion, enhancing the durability of connections.

ADC Channels: YES

Integration of ADC channels allows for real-time analog data processing, expanding its application possibilities.

Terminal Position: QUAD

Quad terminal positioning simplifies PCB layout and assembly, allowing for better signal integrity and reliability.

ROM Words: 61440

A large ROM space allows for more complex programs and algorithms, providing greater functionality.

Maximum Seated Height: 1.6 mm

This low height enhances packaging density, making it a great choice for compact designs.

RAM Words: 1024

Sufficient RAM enables the execution of moderately complex applications without excessive external memory requirements.

Width: 7 mm

The width of 7 mm supports space-efficient designs, making it ideal for various compact applications.

Peripherals: POR; TIMER(4); RTC; WDT

The built-in peripherals enhance functionality, broadening the range of applications such as timer-based controls and real-time clock functionalities.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz ensures fast processing speeds suitable for many real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

Support for extended reflow times allows for flexible soldering processes, improving production efficiency.

Peak Reflow Temperature °C: 235

Ability to withstand high peak reflow temperatures indicates robustness during manufacturing processes.

Length: 7 mm

A compact length allows for efficient use of space on a PCB, enhancing design flexibility.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures reliability under varying conditions, making it suitable for industrial and critical applications.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it can handle control tasks and computations, making it essential for embedded systems.

RAM Bytes: 2048

2KB of RAM strikes a balance between performance and cost for applications requiring moderate data handling.

Technology: CMOS

CMOS technology offers low power consumption, making this microcontroller energy efficient and suitable for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals provide excellent solderability and mechanical strength, ensuring enduring connections on the PCB.

Analog To Digital Convertors: 16-Ch 10-Bit

The availability of 16-channel, 10-bit ADCs makes it capable of precise analog input handling for diverse applications.

Maximum Supply Current: 15 mA

A low maximum supply current ensures extended battery life in portable applications, enhancing energy efficiency.

Nominal Supply Voltage: 5 V

A standard nominal supply voltage simplifies power supply design and allows for easier integration with other components.

Connectivity: LIN(2); SPI

Multiple connectivity options enable seamless integration with various peripherals and devices, enhancing versatility.

ROM Programmability: FLASH

Flash programmability allows for easy updating and modification of firmware, ensuring longevity and adaptability in the field.

Terminal Pitch: 0.8 mm

A standard terminal pitch of 0.8 mm ensures compatibility with a variety of PCB designs and components.

Format: FLOATING POINT

Support for floating-point operations enables more complex calculations, enhancing processing capabilities for sophisticated applications.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates moderate handling requirements, allowing for practical assembly and storage solutions.

Speed: 8 rpm

The ability to operate at 8 RPM is ideal for applications requiring slow control and precise movement.

Low Power Mode: YES

The low power mode feature is essential for battery-powered applications, prolonging operational time without compromising performance.

On Chip Program ROM Width: 8

An 8-bit program ROM width allows efficient code execution for embedded applications, optimizing resource usage.

No. of I/O Lines: 24

Having 24 I/O lines provides ample interface options for sensors, actuators, and other peripherals, supporting a variety of applications.

Technical Specifications

Microcontrollers ST72F361K9T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

8

Boundary Scan:

NO

CPU Family:

ST7

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e3

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

13

No. of I/O Lines:

24

No. of Terminals:

32

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

RAM Bytes:

2048

RAM Words:

1024

ROM Words:

61440

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Maximum Supply Current:

15 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Connectivity:

LIN(2); SPI

Peripherals:

POR; TIMER(4); RTC; WDT

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

ST72F361K9T6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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