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ST72F361K7T6

STMicroelectronics

ST72F361K7T6 by STMicroelectronics

ST72F361K7T6 microcontroller from STMicroelectronics features a 16 MHz CPU, 32 terminals, and operates b/w -40 °C to 85 °C. With 2048 bytes of RAM and integrated ADC channels, it's ideal for industrial applications requiring low power consumption. Its compact design ensures efficient surface mounting.

Median Price

-

Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 7,427 parts In-Stock

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Digiode

USA . 2,311 parts In-Stock

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Anansix

USA . 726 parts In-Stock

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Microchip USA

USA . 489 parts In-Stock

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$6.765

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489

$6.765

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AZTECH Wire

Italy . 511 parts In-Stock

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$9.330

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511

$9.330

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IDEA Electronic Components Group

UK . 797 parts In-Stock

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$75.325

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$67.792

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797

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$67.792

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MKK Technologies

India . 448 parts In-Stock

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$141.644

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DigiPath Technology Company

USA . 448 parts In-Stock

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$141.644

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448

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Corphita

USA . 4,078 parts In-Stock

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Vigor

Singapore . 1,670 parts In-Stock

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Parana Technologies

USA . 1,509 parts In-Stock

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$90.062

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Overview

Unlock superior performance with the ST72F361K7T6 microcontroller from STMicroelectronics! Renowned for its exceptional quality and reliability, this versatile chip excels in a wide array of applications, from industrial automation to consumer electronics. With features designed for efficiency and longevity, it offers seamless integration and low power consumption, empowering your projects with unmatched speed and precision. Elevate your designs today with STMicroelectronics' trusted innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and protection against environmental factors, making the microcontroller suitable for various applications.

Surface Mount: YES

Being surface mount enhances the ease of integration onto circuit boards, minimizing space usage and allowing for compact designs.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V ensures compatibility with a variety of low-voltage systems, maintaining safety and efficiency.

On Chip Data RAM Width: 8

An 8-bit data RAM width enables efficient data handling for applications requiring moderate data processing capabilities.

Package Shape: SQUARE

The square package shape facilitates uniform mounting and better thermal management on PCBs.

Bit Size: 8

The 8-bit architecture is suitable for applications requiring simplicity in data processing, making it a cost-effective choice.

No. of Terminals: 32

With 32 terminals, the microcontroller provides ample connectivity options for connecting various peripherals and sensors.

Package Style (Meter): FLATPACK, LOW PROFILE

The flatpack, low-profile style allows for low-height designs, which is beneficial in applications where space is constrained.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5 V allows for flexibility in power source selection, making it adaptable to various systems.

Maximum Operating Temperature: 85 °C

An operating temperature limit of 85 °C ensures reliable operation in industrial environments, making it suitable for harsh conditions.

CPU Family: ST7

The ST7 CPU family is known for its robustness and efficiency, making it a proven choice in embedded applications.

No. of External Interrupts: 13

With 13 external interrupts, this microcontroller allows for responsive interactions with multiple inputs, enhancing real-time processing capabilities.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C ensures functionality in extreme cold conditions, making it suitable for outdoor or automotive applications.

Terminal Finish: Matte Tin (Sn)

The matte tin terminal finish offers good solderability and corrosion resistance, contributing to long-term reliability.

ADC Channels: YES

Integrated ADC channels allow for direct measurement of analog signals, enhancing the microcontroller's versatility in sensing applications.

Terminal Position: QUAD

Quad terminal positioning optimizes space and layout on the PCB, facilitating easier routing of traces.

ROM Words: 49152

With 49152 ROM words, the microcontroller allows for substantial programming, supporting complex functionalities in applications.

Maximum Seated Height: 1.6 mm

A maximum seated height of 1.6 mm minimizes the overall profile in compact designs, allowing it to fit in tight spaces.

RAM Words: 1024

1024 RAM words provide adequate memory for temporary data storage and processing, suitable for many standard applications.

Width: 7 mm

A 7 mm width contributes to a compact footprint on PCBs, facilitating the design of smaller devices.

Peripherals: POR; TIMER(4); RTC; WDT

The inclusion of various peripherals such as timers and a real-time clock enhances functionality and enables diverse use cases.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz allows for adequate processing speed for many embedded applications.

Maximum Time At Peak Reflow Temperature (s): 30

The capability to withstand up to 30 seconds at peak reflow temperature ensures reliable soldering and assembly without damaging the microcontroller.

Peak Reflow Temperature °C: 235

A peak reflow temperature of 235 °C is compatible with standard SMT processes, enhancing manufacturability.

Length: 7 mm

At 7 mm in length, this component is well-suited for compact electronic designs, facilitating efficient use of board space.

Temperature Grade: INDUSTRIAL

The industrial temperature grade indicates reliability and performance in a wide range of environmental conditions.

Peripheral IC Type: MICROCONTROLLER

Being designated as a microcontroller allows for versatile control applications, integrating processing capabilities onto a single chip.

RAM Bytes: 2048

The availability of 2048 bytes of RAM is adequate for many common applications requiring temporary data storage and manipulation.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the microcontroller efficient and reliable.

Terminal Form: GULL WING

Gull wing leads facilitate easy soldering and assembly, simplifying the manufacturing process for engineers.

Analog To Digital Converters: 16-Ch 10-Bit

The presence of 16 channels of 10-bit ADC allows for simultaneous analog signal processing from multiple sources, increasing versatility.

Maximum Supply Current: 15 mA

A maximum supply current of 15 mA ensures low power consumption, making it suitable for battery-powered applications.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V is standard in many applications, ensuring compatibility with other components.

Connectivity: LIN(2); SPI

Supported LIN and SPI connectivity options provide flexibility in communication with other devices, enhancing system integration.

ROM Programmability: FLASH

FLASH programmability allows for easy updates and modifications to the firmware, providing flexibility in application development.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm is standard for many designs, making it compatible with a variety of circuit board layouts.

Format: FLOATING POINT

Support for floating-point format enables more complex mathematical operations, broadening application capabilities.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates a moderate handling requirement, ensuring product reliability during manufacturing.

Speed: 8 rpm

With a speed rating of 8 rpm, it can efficiently handle tasks that require slower processing or actuation, suitable for specific applications.

Low Power Mode: YES

The inclusion of a low power mode extends battery life in portable applications, making it an energy-efficient choice.

On Chip Program ROM Width: 8

An 8-bit program ROM width supports efficient code execution for simpler control tasks.

No. of I/O Lines: 24

With 24 I/O lines, this microcontroller can efficiently interface with a wide range of sensors and actuators.

Technical Specifications

Microcontrollers ST72F361K7T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

8

Boundary Scan:

NO

CPU Family:

ST7

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e3

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

13

No. of I/O Lines:

24

No. of Terminals:

32

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

RAM Bytes:

2048

RAM Words:

1024

ROM Words:

49152

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Maximum Supply Current:

15 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Connectivity:

LIN(2); SPI

Peripherals:

POR; TIMER(4); RTC; WDT

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

ST72F361K7T6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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