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ST72F361J6T6

STMicroelectronics

ST72F361J6T6 by STMicroelectronics

ST72F361J6T6 microcontroller from STMicroelectronics features a 16 MHz CPU, 768 bytes of RAM, and supports up to 18 external interrupts. With a supply voltage range of 4.5-5.5 V, it's ideal for industrial applications requiring reliable performance in harsh conditions. Its low power mode enhances efficiency for embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,877 parts In-Stock

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Digiode

USA . 4,140 parts In-Stock

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4,140

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Anansix

USA . 539 parts In-Stock

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539

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Distributors (Availability)

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Microchip USA

USA . 268 parts In-Stock

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$6.952

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268

$6.952

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AZTECH Wire

Italy . 1,062 parts In-Stock

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$20.340

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1,062

$20.340

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IDEA Electronic Components Group

UK . 1,035 parts In-Stock

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$31.444

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$28.299

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1,035

$31.444

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$28.299

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MKK Technologies

India . 1,717 parts In-Stock

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$59.128

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1,717

$59.128

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DigiPath Technology Company

USA . 1,717 parts In-Stock

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$59.128

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1,717

$59.128

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Vigor

Singapore . 1,672 parts In-Stock

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Parana Technologies

USA . 1,093 parts In-Stock

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$37.596

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$37.596

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Corphita

USA . 286 parts In-Stock

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Overview

Unlock the potential of your designs with the ST72F361J6T6 microcontroller from STMicroelectronics – a hallmark of reliability and performance. Built for versatility, it excels in automotive, industrial, and consumer applications, offering seamless integration and energy efficiency. With advanced features like multiple ADC channels and robust processing capabilities, this microcontroller empowers you to innovate without compromise, ensuring your projects stand out in quality and functionality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and environmental resistance, making the microcontroller suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and easier integration into modern electronics, maximizing space efficiency.

Maximum Supply Voltage: 5.5 V

The higher maximum supply voltage permits compatibility with a wider range of power sources, ensuring versatile application scenarios.

On Chip Data RAM Width: 8

An 8-bit RAM width provides adequate processing power for simpler tasks, making it ideal for efficient low-power applications.

Package Shape: SQUARE

The square package shape contributes to better stability and alignment during installation on circuit boards.

Bit Size: 8

An 8-bit architecture is well-suited for many embedded applications, balancing performance and resource usage.

No. of Terminals: 44

Having 44 terminals allows for ample connectivity options, enabling complex functionalities and peripheral interfacing.

Package Style (Meter): FLATPACK, LOW PROFILE

This low-profile flatpack style is conducive for compact designs, making it suitable for space-constrained applications.

Minimum Supply Voltage: 4.5 V

The minimum voltage requirement of 4.5 V allows for extended battery life and power efficiency in portable devices.

Maximum Operating Temperature: 85 °C

Withstanding up to 85 °C ensures reliable performance in industrial applications, where temperature variations can be significant.

CPU Family: ST7

The ST7 CPU family is known for robustness and stability, ensuring long-term reliability in embedded systems.

No. of External Interrupts: 18

Having 18 external interrupts provides versatility for handling real-time events in various applications.

Minimum Operating Temperature: -40 °C

This wide operational temperature range makes the microcontroller suitable for harsh environments.

Terminal Finish: MATTE TIN

Matte tin finish contributes to improved solderability and resistance to oxidation, ensuring reliable connections.

ADC Channels: YES

Inclusion of ADC channels enhances the microcontroller's ability to interface with analog signals, expanding its usability.

Terminal Position: QUAD

The quad terminal position provides effective electrical connections and improved routing on PCB designs.

ROM Words: 32768

With 32K ROM words, the microcontroller can store substantial firmware, essential for complex application programs.

Maximum Seated Height: 1.6 mm

A low seated height minimizes space usage on PCB, facilitating higher density designs.

RAM Words: 768

768 RAM words allow for adequate temporary data storage for running applications, improving processing capability.

Width: 10 mm

The 10 mm width is compact, making it suitable for miniaturized devices and products.

Peripherals: POR; TIMER(4); RTC; WDT

A rich set of peripherals enhances the microcontroller's functionality, providing features needed for real-time processing.

Maximum Clock Frequency: 16 MHz

A 16 MHz clock frequency offers good processing speed for a variety of applications without sacrificing power efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

This specification ensures compatibility with soldering processes, facilitating ease of manufacturing.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C ensures the product can withstand standard soldering processes with high reliability.

Length: 10 mm

The compact length of 10 mm supports design constraints in miniaturized electronic devices.

Temperature Grade: INDUSTRIAL

Being industrial temperature graded ensures reliability across a diverse range of challenging environments.

Peripheral IC Type: MICROCONTROLLER

As a dedicated microcontroller, it is optimized for managing tasks in embedded systems, providing efficient performance.

RAM Bytes: 1536

Having 1536 bytes of RAM enables better multitasking and data handling capabilities in microcontroller applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and better mechanical strength on PCB joints.

Analog To Digital Converters: 16-Ch 10-Bit

The 16-channel 10-bit ADC capability greatly enhances the device's ability to interact with various sensors.

Maximum Supply Current: 15 mA

With a maximum supply current of 15 mA, it is power-efficient, making it suitable for battery-powered applications.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V enhances compatibility with common power rail systems in consumer electronics.

Connectivity: LIN(2); SPI

The inclusion of LIN and SPI connectivity enables versatile communication options with other devices and sensors.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and reprogramming, enhancing functionality over the product's lifecycle.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm is ideal for modern PCB designs, facilitating efficient circuit layout and assembly.

Format: FLOATING POINT

Floating-point format capability allows for precise mathematical computations, benefiting complex algorithms.

Moisture Sensitivity Level (MSL): 3

MSL 3 ensures a reasonable level of protection for storage and handling, adding to the overall robustness of the component.

Speed: 8 rpm

An operational speed of 8 RPM, while not directly indicative of microcontroller performance, can denote suitability for specific control applications.

Low Power Mode: YES

Support for low power mode significantly enhances battery life in portable applications, making it energy-efficient.

On Chip Program ROM Width: 8

An 8-bit program ROM width enables efficient instruction set processing tailored for embedded applications.

No. of I/O Lines: 34

Having 34 I/O lines provides flexibility in interfacing with various peripherals and expansion options.

Technical Specifications

Microcontrollers ST72F361J6T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Bit Size:

8

Boundary Scan:

NO

CPU Family:

ST7

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e3

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

18

No. of I/O Lines:

34

No. of Terminals:

44

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

1536

RAM Words:

768

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Maximum Supply Current:

15 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Connectivity:

LIN(2); SPI

Peripherals:

POR; TIMER(4); RTC; WDT

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

ST72F361J6T6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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