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ST72F344S4T6TR

STMicroelectronics

ST72F344S4T6TR by STMicroelectronics

ST72F344S4T6TR microcontroller from STMicroelectronics features an 8-bit CPU with a max clock frequency of 16 MHz, operating voltage range of 3.3-5.5 V, and 34 I/O lines. It’s ideal for industrial applications due to its -40 °C to 85°C temp range. This device supports ADC and PWM channels for versatile control tasks.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,820 parts In-Stock

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2,820

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Anansix

USA . 1,915 parts In-Stock

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1,915

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Digiode

USA . 1,897 parts In-Stock

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1,897

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Distributors (Availability)

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AZTECH Wire

Italy . 670 parts In-Stock

1+ parts

$18.380

100+ parts

-

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670

$18.380

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Microchip USA

USA . 177 parts In-Stock

1+ parts

$30.959

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177

$30.959

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IDEA Electronic Components Group

UK . 1,322 parts In-Stock

1+ parts

$51.494

100+ parts

-

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$46.345

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1,322

$51.494

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$46.345

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MKK Technologies

India . 875 parts In-Stock

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$96.832

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875

$96.832

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DigiPath Technology Company

USA . 875 parts In-Stock

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$96.832

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875

$96.832

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Component Stockers USA

USA . 414 parts In-Stock

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$99.990

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414

$99.990

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Authorized Procurement Solutions

USA . 9,000 parts In-Stock

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9,000

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Corphita

USA . 4,929 parts In-Stock

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4,929

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Vigor

Singapore . 2,485 parts In-Stock

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2,485

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Kepictronics

USA . 1,393 parts In-Stock

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1,393

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Parana Technologies

USA . 730 parts In-Stock

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$61.569

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730

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$61.569

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Overview

Unlock the potential of your next project with the ST72F344S4T6TR microcontroller from STMicroelectronics. Renowned for its high-quality and reliable solutions, STMicroelectronics delivers exceptional performance in compact designs ideal for industrial automation, consumer electronics, and IoT applications. With its versatile power supply range, efficient processing, and robust temperature tolerance, this microcontroller empowers engineers to innovate with confidence while optimizing energy consumption and ensuring durability. Experience unmatched value and advanced functionality that drives your success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and ease of integration into modern circuit boards.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V ensures compatibility with a wide range of power supplies and easy integration into existing systems.

Package Shape: SQUARE

The square package shape facilitates efficient layout on printed circuit boards, optimizing space usage.

Bit Size: 8

An 8-bit architecture is suitable for many applications, offering a balance between performance and complexity.

Power Supplies (V): 3/5

Support for both 3V and 5V supply voltages increases versatility and compatibility with various electronic designs.

No. of Terminals: 44

With 44 terminals, this microcontroller offers extensive connectivity options for peripherals and I/O devices.

Package Style (Meter): FLATPACK

The flatpack style minimizes the footprint on the PCB, enhancing design efficiency and space management.

Minimum Supply Voltage: 3.3 V

A minimum supply voltage of 3.3 V allows for energy-efficient designs and compatibility with low-power applications.

Maximum Operating Temperature: 85 °C

An upper operating temperature limit of 85 °C makes it suitable for industrial applications subject to relatively high temperatures.

CPU Family: ST72

The ST72 CPU family is renowned for reliability and performance, making it a trusted option for various embedded applications.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C ensures functionality in extreme cold environments, ideal for industrial and outdoor applications.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides excellent solderability and good resistance to oxidation, enhancing reliability in connections.

ADC Channels: YES

Integrated ADC channels allow for precise analog signal processing, enabling the microcontroller to interface with various sensors.

Terminal Position: QUAD

Quad terminal position enhances accessibility for connections, making board layout easier and more efficient.

ROM Words: 16384

With 16,384 ROM words, there is ample memory available for storing programs, supporting complex applications.

Maximum Seated Height: 1.6 mm

A compact height of 1.6 mm allows for space-constrained designs without compromising performance.

Width: 10 mm

A width of 10 mm enables flexible design options, fitting easily in most layout configurations.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz delivers sufficient processing speed for a range of real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for reliable soldering without damaging the component, ensuring manufacturing quality.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C ensures compatibility with modern surface mount assembly processes.

Length: 10 mm

The 10 mm length fits well in a variety of PCB layouts, maintaining compatibility with standard PCB dimensions.

Temperature Grade: INDUSTRIAL

The industrial temperature grade indicates robustness for use in harsh operating environments.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller allows for processing and control capabilities in embedded systems.

RAM Bytes: 1024

With 1024 bytes of RAM, it supports moderate data processing tasks and efficient program execution.

Technology: CMOS

CMOS technology leads to lower power consumption, making it suitable for battery-powered applications.

Terminal Form: GULL WING

Gull wing terminals are popular for their ease of handling during assembly and reliable soldering.

Maximum Supply Current: 13 mA

A maximum supply current of 13 mA helps ensure the microcontroller can operate efficiently without excessive power usage.

PWM Channels: YES

Integrated PWM channels facilitate motor control and signal modulation applications.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and changes to firmware post-production, enhancing flexibility.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm supports high-density designs and allows for compact PCB layouts.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate moisture sensitivity, guiding proper handling during assembly and storage.

Speed: 16 rpm

While this specification might appear unrelated to a microcontroller, it may indicate operational capacity in specific control applications.

No. of I/O Lines: 34

Having 34 I/O lines allows for extensive interfacing capabilities with external devices ensuring versatility.

Technical Specifications

Microcontrollers ST72F344S4T6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

34

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

13 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

ST72F344S4T6TR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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