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ST72F344K4T6TR

STMicroelectronics

ST72F344K4T6TR by STMicroelectronics

ST72F344K4T6TR microcontroller from STMicroelectronics features an 8-bit CPU with a max clock frequency of 16 MHz, operating voltage range of 3.3-5.5 V, and 32 terminals. Ideal for industrial applications, it supports ADC and PWM channels. Its compact design ensures efficient performance in various embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,440 parts In-Stock

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6,440

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Digiode

USA . 1,916 parts In-Stock

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1,916

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Anansix

USA . 1,576 parts In-Stock

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1,576

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Distributors (Availability)

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Microchip USA

USA . 415 parts In-Stock

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$1.366

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415

$1.366

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AZTECH Wire

Italy . 1,115 parts In-Stock

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$8.560

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1,115

$8.560

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IDEA Electronic Components Group

UK . 1,420 parts In-Stock

1+ parts

$13.788

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$12.409

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1,420

$13.788

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$12.409

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MKK Technologies

India . 422 parts In-Stock

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$25.928

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422

$25.928

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DigiPath Technology Company

USA . 422 parts In-Stock

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$25.928

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422

$25.928

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Component Stockers USA

USA . 496 parts In-Stock

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$99.990

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496

$99.990

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Corphita

USA . 4,947 parts In-Stock

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Vigor

Singapore . 2,500 parts In-Stock

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2,500

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Parana Technologies

USA . 2,152 parts In-Stock

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$16.486

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$16.486

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Overview

Elevate your projects with the ST72F344K4T6TR microcontroller from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for reliability and versatility, this powerhouse supports a wide range of applications—from industrial automation to consumer electronics—delivering unmatched performance in compact designs. With its robust temperature range and efficient power management, you can trust STMicroelectronics to drive quality and excellence in every device. Experience seamless integration and enhanced functionality that truly adds value to your creations!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection, making the microcontroller suitable for various applications.

Surface Mount: YES

The surface mount design allows for compact PCB layouts and efficient use of space, ideal for modern electronics.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, this microcontroller can operate reliably in low-voltage applications.

Package Shape: SQUARE

The square package shape helps in efficient use of PCB space and simplifies alignment during assembly.

Bit Size: 8

An 8-bit size is sufficient for many embedded applications, balancing complexity and performance.

Power Supplies (V): 3/5

Supports both 3V and 5V power supplies, offering flexibility for various designs.

No. of Terminals: 32

32 terminals allow for numerous input/output connections, making it versatile for different applications.

Package Style (Meter): FLATPACK

The flatpack style enhances flat PCB layouts, which is beneficial for space-constrained designs.

Minimum Supply Voltage: 3.3 V

A minimum supply voltage of 3.3 V supports low-power applications, extending battery life in portable devices.

Maximum Operating Temperature: 85 °C

This temperature rating makes the microcontroller suitable for industrial applications where heat resistance is critical.

CPU Family: ST72

Being part of the ST72 family provides access to advanced features and support for various application needs.

Minimum Operating Temperature: -40 °C

Supports extreme temperature ranges, making it ideal for harsh environmental conditions.

ADC Channels: YES

Inclusion of ADC channels enables the microcontroller to interface with analog signals, enhancing its functionality.

Terminal Position: QUAD

Quad terminal positioning facilitates easy access and soldering on circuit boards.

ROM Words: 16384

With 16,384 ROM words, there is ample space for program storage, enabling complex logic implementations.

Maximum Seated Height: 1.6 mm

The low seated height is advantageous for low-profile applications.

Width: 7 mm

A compact width of 7 mm allows for dense PCB designs without sacrificing performance.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz ensures responsive performance for a variety of tasks.

Length: 7 mm

Compact length contributes to the microcontroller's small footprint for embedded applications.

Temperature Grade: INDUSTRIAL

Rated for industrial use, ensuring reliability in demanding environments.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it integrates processing power with input/output capabilities, simplifying system design.

RAM Bytes: 1024

With 1024 bytes of RAM, the microcontroller can efficiently handle data while executing tasks.

Technology: CMOS

CMOS technology ensures low power consumption, making the microcontroller ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and maintenance.

Maximum Supply Current: 13 mA

The low supply current minimizes power consumption, beneficial for energy-efficient designs.

PWM Channels: YES

The presence of PWM channels allows for advanced control of motors and other peripherals.

ROM Programmability: FLASH

Flash programmable ROM provides flexibility for updates and changes to the firmware.

Terminal Pitch: 0.8 mm

The 0.8 mm terminal pitch allows for high-density mounting, maximizing design efficiency.

Speed: 16 rpm

The operational speed of 16 rpm is suitable for various applications requiring moderate speed control.

No. of I/O Lines: 34

34 I/O lines provide a wide range of options for connecting sensors and actuators, enhancing application possibilities.

Technical Specifications

Microcontrollers ST72F344K4T6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G32

Length:

7 mm

No. of I/O Lines:

34

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

13 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Trade Compliance

ST72F344K4T6TR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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