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ST72F340K2T6

STMicroelectronics

ST72F340K2T6 by STMicroelectronics

ST72F340K2T6 by STMicroelectronics is an 8-bit microcontroller with 512 bytes of RAM and 8192 ROM words. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring a low profile package style and quad terminal position.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,887 parts In-Stock

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8,887

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Anansix

USA . 2,375 parts In-Stock

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2,375

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Digiode

USA . 307 parts In-Stock

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307

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 352 parts In-Stock

1+ parts

$4.054

100+ parts

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352

$4.054

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AZTECH Wire

Italy . 910 parts In-Stock

1+ parts

$11.050

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910

$11.050

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IDEA Electronic Components Group

UK . 74 parts In-Stock

1+ parts

$20.623

100+ parts

-

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$18.560

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74

$20.623

-

$18.560

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MKK Technologies

India . 1,266 parts In-Stock

1+ parts

$38.780

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1,266

$38.780

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DigiPath Technology Company

USA . 1,266 parts In-Stock

1+ parts

$38.780

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1,266

$38.780

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Component Stockers USA

USA . 276 parts In-Stock

1+ parts

$99.990

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276

$99.990

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Vigor

Singapore . 3,100 parts In-Stock

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3,100

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Corphita

USA . 1,578 parts In-Stock

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1,578

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Parana Technologies

USA . 456 parts In-Stock

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$24.658

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456

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$24.658

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Overview

Unlock endless possibilities with the ST72F340K2T6 microcontroller by STMicroelectronics. Known for their top-quality products, STMicroelectronics exceeds expectations in the field of microcontrollers. This versatile device is perfect for a wide range of applications, offering customers unparalleled value and benefits. From industrial automation to consumer electronics, this microcontroller provides reliable performance and efficiency, making it an essential component for your next project. Experience innovation at its finest with the ST72F340K2T6.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller easy to handle and ensuring longevity.

Surface Mount: YES

Surface mount technology allows for compact and efficient assembly of electronic circuits, making this microcontroller suitable for small devices.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for flexibility in power supply options, making this microcontroller versatile.

Package Shape: SQUARE

The square package shape is space-efficient and makes the microcontroller easy to integrate into different designs.

Bit Size: 8

An 8-bit microcontroller offers sufficient processing power for many applications while keeping costs low.

Power Supplies (V): 3/5

Support for both 3V and 5V power supplies allows for compatibility with a wide range of devices and systems.

No. of Terminals: 32

Having 32 terminals provides ample connectivity options for interfacing with external components and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE

The flatpack, low profile package style makes the microcontroller suitable for applications where space is limited.

Minimum Supply Voltage: 3.3 V

The low minimum supply voltage ensures efficient power consumption and reliable operation in various environments.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this microcontroller can function reliably in industrial environments with elevated temperatures.

CPU Family: ST72

The ST72 CPU family is known for its performance and reliability, offering a solid foundation for this microcontroller.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, this microcontroller can operate in extreme cold environments without issues.

Terminal Finish: TIN

Tin terminal finish provides excellent solderability and reliability, ensuring a secure connection for the microcontroller.

Terminal Position: QUAD

The quad terminal position allows for easy access and routing of connections, simplifying the assembly process.

ROM Words: 8192

With 8192 ROM words, this microcontroller has ample memory capacity for storing program instructions and data.

Maximum Seated Height: 1.6 mm

A low maximum seated height makes this microcontroller suitable for slim and compact device designs.

Width: 7 mm

The narrow width of 7mm enables efficient placement of this microcontroller on a circuit board, saving space.

Maximum Clock Frequency: 16 MHz

The high maximum clock frequency allows for fast execution of instructions, making this microcontroller suitable for demanding applications.

Length: 7 mm

The short length of 7mm contributes to the compactness of this microcontroller, ideal for applications with size constraints.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh industrial environments with temperature fluctuations.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product integrates multiple peripherals and functions on a single chip, reducing the need for external components.

RAM Bytes: 512

With 512 bytes of RAM, this microcontroller offers sufficient memory for temporary data storage and efficient multitasking.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making this microcontroller energy-efficient and reliable.

Terminal Form: GULL WING

The gull wing terminal form offers secure mechanical and electrical connections, suitable for automated assembly processes.

Maximum Supply Current: 13 mA

The low maximum supply current ensures energy efficiency and prevents overheating, making this microcontroller reliable in long-term operation.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage is a common standard in electronic devices, ensuring compatibility with a wide range of systems.

PWM Channels: YES

Pulse Width Modulation (PWM) channels allow for precise control of analog signals, enhancing the versatility of this microcontroller.

ROM Programmability: FLASH

Flash ROM programmability enables easy firmware updates and reprogramming, making this microcontroller adaptable to changing requirements.

Terminal Pitch: 0.8 mm

With a fine terminal pitch of 0.8mm, this microcontroller offers high-density packaging and efficient use of board space.

Speed: 8 rpm

With a speed of 8 rpm, this microcontroller offers fast processing capabilities, suitable for real-time control and communication applications.

No. of I/O Lines: 24

Having 24 I/O lines provides ample connectivity for interfacing with external devices and sensors, making this microcontroller versatile in various applications.

Technical Specifications

Microcontrollers ST72F340K2T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

NO

Additional Features:

ALSO OPERATES AT 2.7V MINIMUM SUPPLY AT 4 MHZ

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e3

Length:

7 mm

No. of I/O Lines:

24

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

512

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

13 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Trade Compliance

ST72F340K2T6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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