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ST72F32AK2T6

STMicroelectronics

ST72F32AK2T6 by STMicroelectronics

ST72F32AK2T6 microcontroller from STMicroelectronics features an 8-bit CPU, operates at a max voltage of 5.5V, and includes 8 ADC channels. With a compact flatpack design and industrial temp range (-40 °C to 85 °C), it's ideal for embedded applications. Its connectivity options include SCI and SPI, making it versatile for various projects.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,770 parts In-Stock

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7,770

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Digiode

USA . 2,778 parts In-Stock

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2,778

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Anansix

USA . 2,327 parts In-Stock

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2,327

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 121 parts In-Stock

1+ parts

$7.360

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121

$7.360

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AZTECH Wire

Italy . 1,091 parts In-Stock

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$18.200

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1,091

$18.200

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IDEA Electronic Components Group

UK . 251 parts In-Stock

1+ parts

$21.401

100+ parts

-

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$19.261

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251

$21.401

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$19.261

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MKK Technologies

India . 1,788 parts In-Stock

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$40.243

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1,788

$40.243

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DigiPath Technology Company

USA . 1,788 parts In-Stock

1+ parts

$40.243

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1,788

$40.243

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Component Stockers USA

USA . 621 parts In-Stock

1+ parts

$99.990

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621

$99.990

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Vigor

Singapore . 2,300 parts In-Stock

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2,300

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Parana Technologies

USA . 1,708 parts In-Stock

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$25.588

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1,708

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$25.588

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Perfect Parts

USA . 1,648 parts In-Stock

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1,648

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Corphita

USA . 927 parts In-Stock

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927

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Overview

Unlock the potential of your projects with the ST72F32AK2T6 microcontroller from STMicroelectronics—where quality meets innovation. Renowned for their reliability, STMicroelectronics delivers exceptional performance and versatility in a compact, low-profile package. Ideal for industrial applications, this microcontroller empowers you to create smarter, more efficient devices while ensuring seamless connectivity. Elevate your designs with the proven excellence of ST!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and protection from environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for a smaller footprint and easier integration into compact electronic designs.

Maximum Supply Voltage: 5.5 V

This voltage range is commonly compatible with various standard power supply systems.

Package Shape: SQUARE

The square package shape helps in efficient space utilization on PCB layouts.

Bit Size: 8

An 8-bit architecture is well-suited for simple control applications and efficient processing.

Power Supplies (V): 5

Operating at 5V makes it compatible with many existing systems and components, facilitating easier integration.

No. of Terminals: 32

A higher number of terminals provides more connectivity options for various peripherals and I/O.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile design is ideal for space-constrained applications, providing flexibility in placement.

Minimum Supply Voltage: 3.8 V

A broad supply voltage range enhances operational flexibility and power management.

Maximum Operating Temperature: 85 °C

This temperature rating is suitable for industrial applications that may experience elevated conditions.

CPU Family: ST72

Being part of the ST72 family indicates reliability and proven performance in microcontroller applications.

Minimum Operating Temperature: -40 °C

The ability to operate in low temperatures makes it suitable for harsh environments.

Terminal Finish: Matte Tin (Sn)

Matte tin provides good solderability and corrosion resistance, enhancing the product's longevity.

ADC Channels: YES

Integrated ADC channels facilitate direct analog signal processing, broadening application possibilities.

Terminal Position: QUAD

Quad terminal positions allow for efficient manufacturing processes and improved thermal management.

ROM Words: 8192

A sizable ROM allows for more complex programs and features within the microcontroller.

Maximum Seated Height: 1.6 mm

Compact height allows for ease of integration into low-profile devices, saving space.

Width: 7 mm

Small width enables space-saving designs for compact electronic projects.

Peripherals: TIMER(4)

Multiple timers can manage complex tasks efficiently, enhancing the microcontroller's utility.

Maximum Clock Frequency: 16 MHz

A 16 MHz clock frequency allows for quick processing, suitable for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

This specification ensures compatibility with standard assembly processes in manufacturing.

Peak Reflow Temperature °C: 235

High peak reflow temperatures indicate robustness during the soldering process.

Length: 7 mm

Short length contributes to a compact overall size, ideal for space-sensitive designs.

Temperature Grade: INDUSTRIAL

Rated for industrial use, indicating reliability in demanding applications.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller makes it versatile for various control and automation tasks.

RAM Bytes: 384

A reasonable amount of RAM allows for efficient execution of applications, especially in control tasks.

Technology: CMOS

CMOS technology provides low power consumption, making it suitable for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and surface mount assembly, reducing production costs.

Analog To Digital Converters: 8-Ch 10-Bit

The 8-channel ADC supports multiple inputs, enabling diverse sensor integration.

Maximum Supply Current: 7 mA

A low current draw at maximum supply enhances energy efficiency, beneficial for portable applications.

Nominal Supply Voltage: 5 V

Using a standard nominal supply voltage ensures compatibility with many existing systems.

PWM Channels: YES

Built-in PWM channels make it perfect for motor control and other applications requiring precise control.

Connectivity: SCI, SPI

These connectivity options allow for seamless integration with other devices and peripherals.

ROM Programmability: FLASH

Flash memory allows for easy reprogramming of the microcontroller, providing flexibility in updates.

Terminal Pitch: 0.8 mm

A smaller terminal pitch can allow for more connections in a compact space.

Moisture Sensitivity Level (MSL): 3

This MSL rating indicates moderate sensitivity, guiding proper storage and handling.

Speed: 8 rpm

A specific speed rating can indicate application focused usage, especially in motor related tasks.

On Chip Program ROM Width: 8

The 8-bit ROM width supports compatibility with various standard data paths.

No. of I/O Lines: 24

Having 24 I/O lines enables extensive interfacing possibilities for different applications.

Technical Specifications

Microcontrollers ST72F32AK2T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

24

No. of Terminals:

32

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

235

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

384

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

7 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SCI, SPI

Peripherals:

TIMER(4)

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

ST72F32AK2T6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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