Loading...

ST72F32AK1T6

STMicroelectronics

ST72F32AK1T6 by STMicroelectronics

ST72F32AK1T6 microcontroller from STMicroelectronics features an 8-bit CPU, operates at a max voltage of 5.5V, and includes 8 ADC channels. Ideal for industrial applications, it supports SPI/SCI connectivity and offers low power consumption with a max current of 10mA. Its compact design ensures efficient performance in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,410 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,410

-

-

-

-

Digiode

USA . 790 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

790

-

-

-

-

Anansix

USA . 711 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

711

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 1,205 parts In-Stock

1+ parts

$8.800

100+ parts

-

1k+ parts

-

10k+ parts

-

1,205

$8.800

-

-

-

Microchip USA

USA . 3,231 parts In-Stock

1+ parts

$16.157

100+ parts

-

1k+ parts

-

10k+ parts

-

3,231

$16.157

-

-

-

IDEA Electronic Components Group

UK . 1,317 parts In-Stock

1+ parts

$49.972

100+ parts

-

1k+ parts

$44.974

10k+ parts

-

1,317

$49.972

-

$44.974

-

MKK Technologies

India . 164 parts In-Stock

1+ parts

$93.968

100+ parts

-

1k+ parts

-

10k+ parts

-

164

$93.968

-

-

-

DigiPath Technology Company

USA . 164 parts In-Stock

1+ parts

$93.968

100+ parts

-

1k+ parts

-

10k+ parts

-

164

$93.968

-

-

-

Component Stockers USA

USA . 206 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

-

206

$99.990

-

-

-

Vigor

Singapore . 3,336 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,336

-

-

-

-

Corphita

USA . 2,830 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,830

-

-

-

-

Parana Technologies

USA . 2,298 parts In-Stock

1+ parts

-

100+ parts

$59.749

1k+ parts

-

10k+ parts

-

2,298

-

$59.749

-

-

Perfect Parts

USA . 1,400 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,400

-

-

-

-

A-Z Elektronik GmbH

Germany . 369 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

369

-

-

-

-

Overview

Unlock the potential of your next project with the ST72F32AK1T6 microcontroller from STMicroelectronics, a leader in semiconductor innovation. Renowned for its reliability and performance, this versatile 8-bit powerhouse is perfect for a wide range of applications, from industrial automation to consumer electronics. Enjoy seamless integration, exceptional power efficiency, and robust features that elevate your designs while ensuring long-lasting quality. Choose STMicroelectronics for unmatched expertise and support!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body material enhances protection against environmental factors, making it suitable for reliable performance in various applications.

Surface Mount: YES

Surface mount technology allows for compact PCB designs, enabling higher circuit density and flexibility in design.

Maximum Supply Voltage: 5.5 V

The flexibility of a maximum supply voltage of 5.5V supports a wide range of applications while ensuring compatibility with standard power supplies.

Package Shape: SQUARE

The square package shape enables efficient use of PCB space and easy mounting, which is ideal for compact electronic designs.

Bit Size: 8

An 8-bit architecture is beneficial for simpler control applications and lower power consumption in less complex tasks.

Power Supplies (V): 5

Nominal supply voltage of 5V is widely used in many devices, ensuring easy integration and availability of power source.

No. of Terminals: 32

Having 32 terminals provides considerable I/O complexity and flexibility, allowing for more peripherals and functionalities.

Package Style (Meter): FLATPACK, LOW PROFILE

The low profile flatpack design is suitable for spaces where height is restricted, allowing for sleeker and more compact device designs.

Minimum Supply Voltage: 3.8 V

A minimum supply voltage of 3.8V facilitates operation in lower power environments, contributing to energy efficiency.

Maximum Operating Temperature: 85 °C

The ability to operate at up to 85 °C ensures reliability in higher temperature scenarios, suitable for industrial applications.

CPU Family: ST72

Being part of the ST72 family reflects a solid architecture known for performance and reliability in embedded systems.

Minimum Operating Temperature: -40 °C

This wide temperature range allows for operation in harsh environments, making it ideal for industrial and outdoor applications.

Terminal Finish: Matte Tin (Sn)

Matte tin finish provides good solderability and corrosion resistance, ensuring long-term reliability and performance in various conditions.

ADC Channels: YES

Incorporating ADC channels enhances the ability to process analog signals, allowing for better sensor integration in applications.

Terminal Position: QUAD

Quad terminal positioning makes it easier to achieve a more efficient layout on the PCB, contributing to better signal integrity.

ROM Words: 4096

The capability of having 4096 ROM words allows for ample program storage, suitable for complex embedded applications.

Maximum Seated Height: 1.6 mm

A maximum seated height of 1.6 mm enhances compatibility with low-profile designs, ensuring versatility in circuit board layouts.

Width: 7 mm

The compact 7 mm width helps save space on the PCB, making it ideal for miniaturized electronic devices.

Peripherals: TIMER(4)

Having multiple timers facilitates advanced timing functionalities, enabling more precise control in various applications.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz allows for efficient processing speed, making it suitable for a variety of applications from control to signal processing.

Maximum Time At Peak Reflow Temperature: 30 s

Extended time at peak reflow temperature ensures reliable soldering during assembly, promoting product durability.

Peak Reflow Temperature: 235 °C

The capable peak reflow temperature supports compatibility with common soldering processes, ensuring easy manufacturing.

Length: 7 mm

A length of 7 mm contributes to a compact overall footprint, suitable for space-constrained applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade indicates robustness and stability, making it suitable for demanding environments.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, this IC type is versatile and can be programmed for various applications, from simple to complex control tasks.

RAM Bytes: 384

384 bytes of RAM allow for efficient data processing and temporary storage requirements in embedded applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making this microcontroller energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and improved alignment during assembly, contributing to manufacturing efficiency.

Analog To Digital Converters: 8-Ch 10-Bit

With 8 channels of 10-bit ADCs, measurement accuracy is enhanced, allowing for effective data conversion from analog to digital formats.

Maximum Supply Current: 10 mA

A maximum supply current of 10 mA indicates low power requirements, which is vital for battery-operated and low-power applications.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V is optimal for many electronic designs, ensuring compatibility and simplifying power management.

PWM Channels: YES

Having PWM channels allows for effective control of motors and LEDs, enhancing the product's versatility in diverse applications.

Connectivity: SCI, SPI

Support for SCI and SPI connectivity protocols enables high-speed data exchange, enhancing communication capabilities in embedded systems.

ROM Programmability: FLASH

Flash programmability offers ease of reprogramming and updates, ensuring longevity and adaptability of the product.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch allows for compact placements and connection to modern PCB designs without compromising performance.

Moisture Sensitivity Level (MSL): 3

An MSL level of 3 indicates moderate sensitivity, ensuring the device is suitable for environments with controlled humidity.

Speed: 8 rpm

An 8 rpm speed rating may indicate specific use cases in motor control applications, allowing for tailored designs.

On Chip Program ROM Width: 8

An 8-bit ROM width simplifies programming and interfacing with 8-bit data architectures, promoting compatibility with various peripherals.

No. of I/O Lines: 24

24 I/O lines offer extensive possibilities for interfacing and connecting multiple devices, enhancing the microcontroller's functionality.

Technical Specifications

Microcontrollers ST72F32AK1T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

24

No. of Terminals:

32

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

235

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

384

ROM Words:

4096

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

10 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SCI, SPI

Peripherals:

TIMER(4)

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

ST72F32AK1T6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20