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ST72F325R9T6

STMicroelectronics

ST72F325R9T6 by STMicroelectronics

ST72F325R9T6 by STMicroelectronics is an 8-bit microcontroller with 64 terminals, operating at a max frequency of 16 MHz. It features 2048 bytes of RAM and flash ROM programmability, suitable for industrial applications requiring low power consumption and PWM functionality.

Median Price

$6.580

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

American Microsemiconductor Inc.

USA . 58 parts In-Stock

1+ parts

$6.580

100+ parts

-

1k+ parts

-

10k+ parts

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58

$6.580

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-

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Vyrian

USA . 7,300 parts In-Stock

1+ parts

-

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7,300

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-

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-

Anansix

USA . 2,065 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,065

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-

-

-

Digiode

USA . 595 parts In-Stock

1+ parts

-

100+ parts

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595

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 426 parts In-Stock

1+ parts

$8.472

100+ parts

-

1k+ parts

-

10k+ parts

-

426

$8.472

-

-

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AZTECH Wire

Italy . 642 parts In-Stock

1+ parts

$10.290

100+ parts

-

1k+ parts

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10k+ parts

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642

$10.290

-

-

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IDEA Electronic Components Group

UK . 377 parts In-Stock

1+ parts

$24.136

100+ parts

-

1k+ parts

$21.723

10k+ parts

-

377

$24.136

-

$21.723

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MKK Technologies

India . 847 parts In-Stock

1+ parts

$45.387

100+ parts

-

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-

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847

$45.387

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-

-

DigiPath Technology Company

USA . 847 parts In-Stock

1+ parts

$45.387

100+ parts

-

1k+ parts

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847

$45.387

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Corphita

USA . 4,740 parts In-Stock

1+ parts

-

100+ parts

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4,740

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Vigor

Singapore . 2,889 parts In-Stock

1+ parts

-

100+ parts

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2,889

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Parana Technologies

USA . 1,842 parts In-Stock

1+ parts

-

100+ parts

$28.858

1k+ parts

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10k+ parts

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1,842

-

$28.858

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Overview

Unleash the power of innovation with the ST72F325R9T6 microcontroller by STMicroelectronics. Crafted with precision and excellence, this versatile device brings endless possibilities to your projects. Whether you're designing smart appliances, automotive systems, or IoT devices, this microcontroller delivers unmatched performance and reliability. Experience seamless integration, high-speed processing, and energy efficiency like never before. Embrace the future of technology with the ST72F325R9T6 and elevate your creations to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material ensures durability and reliability of the microcontroller.

Surface Mount: YES

Surface mount capability allows for easy installation and space-saving on PCBs.

Maximum Supply Voltage: 5.5 V

Ability to handle a maximum supply voltage of 5.5 V provides flexibility in power supply options.

Bit Size: 8

8-bit size enables efficient processing and control capabilities.

No. of Terminals: 64

Having 64 terminals allows for multiple connections and interfaces with other components.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85 °C ensures stable performance in various environmental conditions.

No. of External Interrupts: 15

Availability of 15 external interrupts enables efficient handling of external events and interrupts.

RAM Bytes: 2048

2048 RAM bytes provide sufficient memory for data storage and processing.

ADC Channels: YES

Having ADC channels allows for analog signal conversion and measurement.

PWM Channels: YES

PWM channels enable precise control of pulse width modulation signals for various applications.

Technical Specifications

Microcontrollers ST72F325R9T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

15

No. of I/O Lines:

48

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.63SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

250

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

61440

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Maximum Supply Current:

15 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

ST72F325R9T6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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