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ST72F325K6TC

STMicroelectronics

ST72F325K6TC by STMicroelectronics

ST72F325K6TC by STMicroelectronics is an 8-bit microcontroller with 32 terminals, operating at a max clock frequency of 16 MHz. Ideal for automotive applications, it features Flash ROM programmability, PWM channels, and ADC capabilities. With a temperature range from -40 to 125 °C, this CMOS technology-based microcontroller offers versatile performance in a compact square package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,432 parts In-Stock

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5,432

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Anansix

USA . 1,783 parts In-Stock

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1,783

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Digiode

USA . 752 parts In-Stock

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752

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 232 parts In-Stock

1+ parts

$6.842

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232

$6.842

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AZTECH Wire

Italy . 221 parts In-Stock

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$16.720

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221

$16.720

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IDEA Electronic Components Group

UK . 2,163 parts In-Stock

1+ parts

$58.118

100+ parts

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$52.306

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2,163

$58.118

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$52.306

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MKK Technologies

India . 530 parts In-Stock

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$109.288

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530

$109.288

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DigiPath Technology Company

USA . 530 parts In-Stock

1+ parts

$109.288

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530

$109.288

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Vigor

Singapore . 4,543 parts In-Stock

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4,543

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Parana Technologies

USA . 2,123 parts In-Stock

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$69.489

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2,123

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$69.489

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Corphita

USA . 1,697 parts In-Stock

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1,697

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Overview

Unlock the potential of your electronic projects with the ST72F325K6TC microcontroller by STMicroelectronics. This high-quality device offers unmatched performance and reliability, making it ideal for a wide range of applications. Whether you're working on automotive systems, industrial controls, or consumer electronics, this microcontroller is sure to meet your needs. Trust in STMicroelectronics to deliver exceptional value and cutting-edge technology with the ST72F325K6TC.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and protection for the microcontroller, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto printed circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 5.5 V

Supports a wide range of supply voltages, offering flexibility in power requirements for different projects.

Package Shape: SQUARE

Square shape allows for efficient use of space on PCBs, ideal for compact designs.

Bit Size: 8

8-bit architecture provides enough processing power for a variety of applications while keeping costs low.

No. of Terminals: 32

Sufficient number of terminals for connecting to other components and peripherals in a system.

Minimum Operating Temperature: -40 °C

Wide operating temperature range enables reliable performance in harsh environments or extreme conditions.

ADC Channels: YES

Analog-to-digital converter channels allow for interfacing with analog sensors or signals, expanding the range of applications for the microcontroller.

Maximum Clock Frequency: 16 MHz

High clock frequency allows for fast data processing and response times, suitable for real-time applications.

Temperature Grade: AUTOMOTIVE

Automotive grade certification ensures reliability and performance under automotive operating conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency of the microcontroller.

Nominal Supply Voltage: 5 V

Compatible with standard 5V power supply, making it easy to integrate into existing systems or designs.

PWM Channels: YES

Pulse width modulation channels enable precise control of outputs such as motors or LEDs, enhancing the versatility of the microcontroller.

ROM Programmability: FLASH

Flash ROM allows for easy programming and reprogramming of the microcontroller, facilitating firmware updates and customization.

Speed: 8 rpm

Operates at a speed of 8 revolutions per minute, suitable for applications requiring precise speed control or monitoring.

No. of I/O Lines: 24

Sufficient number of input/output lines for interfacing with external devices and peripherals, expanding the connectivity options of the microcontroller.

Technical Specifications

Microcontrollers ST72F325K6TC attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G32

Length:

7 mm

No. of I/O Lines:

24

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Trade Compliance

ST72F325K6TC Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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