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ST72F325K6T3

STMicroelectronics

ST72F325K6T3 by STMicroelectronics

ST72F325K6T3 microcontroller from STMicroelectronics features an 8-bit CPU with a max clock frequency of 16 MHz, operating b/w -40 °C and 125°C. It supports up to 24 I/O lines and includes ADC/PWM channels for versatile applications. Ideal for automotive use, it operates on a supply voltage of 3.8-5.5 V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,128 parts In-Stock

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5,128

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Chip Stock

USA . 3,800 parts In-Stock

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3,800

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Digiode

USA . 3,640 parts In-Stock

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3,640

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ComSIT Distribution GmbH

Germany . 1,705 parts In-Stock

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1,705

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Anansix

USA . 254 parts In-Stock

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254

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ACDS - Activité Composants Distribution Service

France . 40 parts In-Stock

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40

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Distributors (Availability)

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AZTECH Wire

Italy . 445 parts In-Stock

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$8.250

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-

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445

$8.250

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IDEA Electronic Components Group

UK . 1,864 parts In-Stock

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$25.217

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-

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$22.695

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1,864

$25.217

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$22.695

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Microchip USA

USA . 4,135 parts In-Stock

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$28.491

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4,135

$28.491

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MKK Technologies

India . 1,149 parts In-Stock

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$47.419

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1,149

$47.419

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DigiPath Technology Company

USA . 1,149 parts In-Stock

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$47.419

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1,149

$47.419

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QUARKTWIN TECHNOLOGY LTD

USA . 20,945 parts In-Stock

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20,945

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Kepictronics

USA . 5,999 parts In-Stock

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Perfect Parts

USA . 4,480 parts In-Stock

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Metaverse IC Inc.

Canada . 3,000 parts In-Stock

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Authorized Procurement Solutions

USA . 2,885 parts In-Stock

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2,885

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A-Z Elektronik GmbH

Germany . 2,399 parts In-Stock

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2,399

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Vigor

Singapore . 2,284 parts In-Stock

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2,284

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Parana Technologies

USA . 1,910 parts In-Stock

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$30.151

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1,910

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$30.151

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GreenTree Electronics

Israel . 250 parts In-Stock

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250

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Corphita

USA . 182 parts In-Stock

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182

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Overview

Unlock the potential of your designs with the ST72F325K6T3 microcontroller from STMicroelectronics, a leader in innovative semiconductor solutions. This versatile and reliable 8-bit MCU is perfect for automotive applications, ensuring robust performance under extreme conditions. Benefit from low power consumption and enhanced peripheral features, giving you the edge in efficiency and functionality. Elevate your projects with quality you can trust, backed by ST's commitment to excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material enhances reliability and performance in various applications.

Surface Mount: YES

Facilitates easy integration into compact circuit designs, optimizing space and performance.

Maximum Supply Voltage: 5.5 V

Allows for compatibility with a wide range of power supply configurations.

Package Shape: SQUARE

Efficiently utilizes board space, ideal for dense layouts.

Bit Size: 8

Suitable for simpler control applications, providing a balance between performance and energy consumption.

No. of Terminals: 32

Offers ample connections for external components and peripherals, enhancing functionality.

Package Style (Meter): FLATPACK, LOW PROFILE

Enables seamless placement in low-profile designs, improving aesthetic and functional aspects.

Minimum Supply Voltage: 3.8 V

Versatile operation range supporting various applications with different voltage requirements.

Maximum Operating Temperature: 125 °C

Ideal for use in high-temperature environments, ensuring reliability in automotive and industrial applications.

CPU Family: ST72

Proven architecture with a strong performance track record, signifying robust design.

No. of External Interrupts: 6

Provides flexibility for handling multiple external events, enhancing responsiveness.

Minimum Operating Temperature: -40 °C

Reliability in extreme cold, making it perfect for outdoor and harsh environments.

Terminal Finish: Matte Tin (Sn)

Ensures good solderability and corrosion resistance, leading to improved reliability.

ADC Channels: YES

Enables high-precision analog signal processing, suitable for sensors and signal conditioning.

Terminal Position: QUAD

Facilitates easier PCB layout and soldering, enhancing manufacturing efficiency.

ROM Words: 32768

Provides sufficient programming space for complex applications, supporting versatile software tasks.

Maximum Seated Height: 1.6 mm

Optimizes for low-profile designs, maintaining compatibility with tight spaces.

Width: 7 mm

Compact size allows for more design flexibility in space-constrained applications.

Maximum Clock Frequency: 16 MHz

Balancing performance with power consumption, suitable for energy-sensitive applications.

Maximum Time At Peak Reflow Temperature (s): 30

Standard reflow profile compatibility ensures reliable assembly processes.

Peak Reflow Temperature °C: 235

High-temperature resilience allows for robust soldering and assembly processes.

Length: 7 mm

Maintains compact dimensions for easier placement in tight-fitting designs.

Temperature Grade: AUTOMOTIVE

Meets stringent automotive standards, ensuring durability and performance in vehicles.

Peripheral IC Type: MICROCONTROLLER

Designed for versatile embedded applications, making it suitable for various project needs.

RAM Bytes: 1024

Adequate memory for handling multiple tasks and data, improving overall performance.

Technology: CMOS

Low static power consumption technology, promoting energy efficiency.

Terminal Form: GULL WING

Provides strong mechanical support for better solder joint reliability.

Maximum Supply Current: 15 mA

Efficient power consumption, making it suitable for battery-operated devices.

Nominal Supply Voltage: 5 V

Common voltage used in many applications, ensuring broad design compatibility.

PWM Channels: YES

Allows for precise control of DC motors and other devices, enhancing application flexibility.

ROM Programmability: FLASH

Supports easy updates and reprogramming of firmware, improving product longevity.

Terminal Pitch: 0.8 mm

Allows for higher density layouts, beneficial for advanced circuit designs.

Format: FIXED POINT

Suitable for applications with predictable data processing needs, enhancing efficiency.

Moisture Sensitivity Level (MSL): 3

Requires standard handling precautions, supporting long-term reliability in various conditions.

Speed: 8 rpm

Low operational energy demands, beneficial for applications requiring slow actuation.

Low Power Mode: YES

Enhances battery life in portable devices, ensuring energy efficiency.

On Chip Program ROM Width: 8

Compatible with standard 8-bit applications, providing flexibility in software design.

No. of I/O Lines: 24

Sufficient I/O options for various interfacing needs, maximizing application potential.

Technical Specifications

Microcontrollers ST72F325K6T3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e3

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

6

No. of I/O Lines:

24

No. of Terminals:

32

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Maximum Supply Current:

15 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Trade Compliance

ST72F325K6T3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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