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ST72F325J6T3

STMicroelectronics

ST72F325J6T3 by STMicroelectronics

ST72F325J6T3 microcontroller from STMicroelectronics features a 16 MHz CPU, operates b/w -40 °C to 125°C, and supports up to 32 I/O lines. With a supply voltage range of 3.8V to 5.5V, it's ideal for automotive applications. Its low power mode enhances efficiency in embedded systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Demsay Elektronik

Türkiye . 3,576 parts In-Stock

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Digiode

USA . 2,730 parts In-Stock

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2,730

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Vyrian

USA . 2,515 parts In-Stock

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Anansix

USA . 451 parts In-Stock

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451

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Distributors (Availability)

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AZTECH Wire

Italy . 706 parts In-Stock

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$14.200

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706

$14.200

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Microchip USA

USA . 176 parts In-Stock

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$36.464

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176

$36.464

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IDEA Electronic Components Group

UK . 2,074 parts In-Stock

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$73.938

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$66.544

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$73.938

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$66.544

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Component Stockers USA

USA . 447 parts In-Stock

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$99.990

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447

$99.990

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MKK Technologies

India . 1,018 parts In-Stock

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$139.035

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$139.035

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DigiPath Technology Company

USA . 1,018 parts In-Stock

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$139.035

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$139.035

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Authorized Procurement Solutions

USA . 9,000 parts In-Stock

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Corphita

USA . 3,663 parts In-Stock

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Parana Technologies

USA . 2,089 parts In-Stock

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$88.404

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Vigor

Singapore . 1,066 parts In-Stock

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A-Z Elektronik GmbH

Germany . 630 parts In-Stock

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Kepictronics

USA . 420 parts In-Stock

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Overview

Unlock the potential of your projects with the ST72F325J6T3 microcontroller from STMicroelectronics! Renowned for their innovation and reliability, STMicroelectronics ensures this high-performance solution excels in automotive applications and more. With robust temperature ratings and low power modes, it offers unmatched efficiency for your designs. Experience seamless integration, enhanced functionality, and peace of mind knowing you’re backed by a trusted leader in technology. Choose quality; choose STMicroelectronics!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable and lightweight material provides excellent protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Supports modern manufacturing processes for compact and efficient PCB design, saving space in your applications.

Maximum Supply Voltage: 5.5 V

Allows for flexibility in power supply options, accommodating various system designs.

Package Shape: SQUARE

The square shape helps optimize PCB layout and provides symmetry, which is advantageous in multiple design scenarios.

Bit Size: 8

An 8-bit architecture is sufficient for many control applications, balancing performance and simplicity.

No. of Terminals: 44

Provides ample connectivity options for interfacing with multiple peripherals, enhancing functionality.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile design keeps components close to the PCB, which is ideal for space-constrained applications.

Minimum Supply Voltage: 3.8 V

Allows the microcontroller to operate in low-power applications, extending battery life in portable devices.

Maximum Operating Temperature: 125 °C

Suitable for automotive and industrial applications where high temperatures can be a concern.

CPU Family: ST72

Part of a well-regarded CPU family known for reliability and support, facilitating easier integration.

No. of External Interrupts: 9

Multiple interrupts enhance the microcontroller's flexibility, enabling it to respond to various signals effectively.

Minimum Operating Temperature: -40 °C

Designed for harsh environments, ensuring operations in extreme temperatures, making it suitable for automotive use.

Terminal Finish: MATTE TIN

A matte tin finish ensures good solderability and oxidation resistance for reliable connections and longevity.

ADC Channels: YES

Incorporates ADC channels, enabling precise analog signal conversion for interfacing with sensors.

Terminal Position: QUAD

Quad terminal positioning improves soldering yield and facilitates easier PCB routing.

ROM Words: 32768

Ample ROM capacity for storing application code, enabling complex applications without the need for external memory.

Maximum Seated Height: 1.6 mm

Low seated height benefits compact designs, contributing to thinner product enclosures.

Width: 10 mm

Compact width supports efficient PCB layouts and design flexibility.

Maximum Clock Frequency: 16 MHz

Allows for rapid processing speeds suitable for most control applications.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures durability during soldering processes, preventing damage to the microcontroller.

Peak Reflow Temperature (°C): 260

High reflow temperature tolerance supports a variety of soldering techniques, enhancing manufacturing robustness.

Length: 10 mm

Compact length allows for efficient space utilization on PCB designs.

Temperature Grade: AUTOMOTIVE

Engineered for automotive applications, ensuring reliability and performance in demanding environments.

Peripheral IC Type: MICROCONTROLLER

Versatile microcontroller type suitable for a wide range of embedded applications.

RAM Bytes: 1024

Offers sufficient RAM for processing complex computations and running applications efficiently.

Technology: CMOS

CMOS technology ensures low power consumption while maintaining high performance.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and provide reliable electrical contact.

Maximum Supply Current: 15 mA

Low supply current enhances power efficiency, important for battery-operated devices.

Nominal Supply Voltage: 5 V

Standard nominal voltage allows for broad compatibility with existing systems and power supplies.

PWM Channels: YES

Integrated PWM channels support motor control and other applications requiring variable output.

ROM Programmability: FLASH

Flash memory allows for easy updates and reprogramming, enhancing product lifecycle management.

Terminal Pitch: 0.8 mm

Fine terminal pitch supports higher component density on PCBs, making it ideal for advanced designs.

Format: FIXED POINT

Optimized for fixed-point operations, this architecture is efficient for control algorithms and signal processing.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, this component is suitable for standard production environments with adequate handling precautions.

Speed: 8 rpm

Low speed operation is ideal for low-power applications, contributing to energy savings in devices.

Low Power Mode: YES

Features a low power mode that further extends battery life, enhancing efficiency in portable devices.

On Chip Program ROM Width: 8

An 8-bit ROM width optimizes size and speed for certain applications, benefiting performance.

No. of I/O Lines: 32

A high number of I/O lines provides versatile interfacing options with various peripherals.

Technical Specifications

Microcontrollers ST72F325J6T3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e3

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

9

No. of I/O Lines:

32

No. of Terminals:

44

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Maximum Supply Current:

15 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

ST72F325J6T3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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