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ST72F325J6B6

STMicroelectronics

ST72F325J6B6 by STMicroelectronics

ST72F325J6B6 microcontroller from STMicroelectronics features an 8-bit CPU with a max clock frequency of 16 MHz, operating voltage range of 3.8-5.5 V, and 32 I/O lines. It’s ideal for industrial applications due to its -40 °C to 85°C temp grade and built-in ADC/PWM channels. Packaged in a compact rectangular form, it supports FLASH ROM programmability for versatile use.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,347 parts In-Stock

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5,347

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Digiode

USA . 3,129 parts In-Stock

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3,129

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Anansix

USA . 2,340 parts In-Stock

1+ parts

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2,340

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 248 parts In-Stock

1+ parts

$7.454

100+ parts

-

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-

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-

248

$7.454

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AZTECH Wire

Italy . 374 parts In-Stock

1+ parts

$15.040

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374

$15.040

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IDEA Electronic Components Group

UK . 2,344 parts In-Stock

1+ parts

$38.887

100+ parts

-

1k+ parts

$34.999

10k+ parts

-

2,344

$38.887

-

$34.999

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MKK Technologies

India . 2,145 parts In-Stock

1+ parts

$73.125

100+ parts

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2,145

$73.125

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DigiPath Technology Company

USA . 2,145 parts In-Stock

1+ parts

$73.125

100+ parts

-

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10k+ parts

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2,145

$73.125

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Corphita

USA . 3,715 parts In-Stock

1+ parts

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3,715

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Vigor

Singapore . 3,000 parts In-Stock

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3,000

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Parana Technologies

USA . 63 parts In-Stock

1+ parts

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$46.496

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63

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$46.496

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Overview

Unlock the power of innovation with the ST72F325J6B6 microcontroller from STMicroelectronics. Renowned for their commitment to quality and cutting-edge technology, STMicroelectronics delivers a robust, versatile solution perfect for industrial applications. With its impressive temperature range, low power consumption, and extensive I/O capabilities, this microcontroller ensures reliability and efficiency in your projects, empowering you to create smarter, more efficient systems that stand out in today’s competitive landscape.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making it ideal for various applications.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V allows for compatibility with a wide range of power supply systems, enhancing versatility.

Package Shape: RECTANGULAR

The rectangular shape of the package provides ease of mounting and efficient use of space in circuit designs.

Bit Size: 8

An 8-bit architecture is suitable for many low-power applications, optimizing performance for simpler control tasks.

Power Supplies (V): 3.3/5

Dual voltage supply options (3.3V and 5V) accommodate various design requirements and improve flexibility.

No. of Terminals: 42

With 42 terminals, this microcontroller offers ample connectivity options, enabling complex designs and functionalities.

Package Style (Meter): IN-LINE, SHRINK PITCH

The in-line, shrink pitch style facilitates efficient circuit board layout and saves space.

Minimum Supply Voltage: 3.8 V

A minimum supply voltage of 3.8 V ensures reliable operation in low-voltage environments, enhancing versatility.

Maximum Operating Temperature: 85 °C

The ability to operate at up to 85 °C makes this microcontroller suitable for industrial applications with higher thermal demands.

CPU Family: ST72

The ST72 CPU family is known for its efficiency and reliability, making it a trusted choice for numerous applications.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C allows for use in extreme environments, ensuring performance in harsh conditions.

Terminal Finish: TIN

The tin terminal finish provides good solderability and reliability, ensuring stable connections in electronic assemblies.

ADC Channels: YES

Integrated ADC channels allow for direct interfacing with analog signals, enhancing the microcontroller's functionality.

Terminal Position: DUAL

The dual terminal position provides layout flexibility and simplifies PCB design, catering to various application needs.

ROM Words: 32768

With 32,768 ROM words, this microcontroller can accommodate a substantial amount of program memory for complex applications.

Maximum Seated Height: 5.08 mm

A maximum seated height of 5.08 mm contributes to a compact design, making it suitable for space-constrained applications.

Width: 15.24 mm

A width of 15.24 mm optimizes PCB layout options, allowing for integration into various form factors.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz ensures decent processing speed for most control applications, striking a balance between performance and power consumption.

Length: 36.83 mm

This length provides an ideal fit for various PCB designs, accommodating multiple configurations.

Temperature Grade: INDUSTRIAL

Rated for industrial temperatures, this microcontroller guarantees reliability in rigorous operational environments.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller peripheral IC type, it is well-suited for embedded systems and control applications, supporting a variety of operations.

RAM Bytes: 1024

With 1024 bytes of RAM, it is capable of handling multiple tasks simultaneously, making it suitable for more complex applications.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and improved performance, ideal for battery-operated devices.

Terminal Form: THROUGH-HOLE

The through-hole terminal form enhances mechanical stability, making it perfect for applications requiring robust assembly.

Maximum Supply Current: 15 mA

A maximum supply current of just 15 mA contributes to low power consumption, which is essential for energy-efficient designs.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V is common and preferred in many applications, facilitating easy integration.

PWM Channels: YES

The presence of PWM channels allows for precise control over motors and other devices, expanding the scope of applications.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications of firmware, enhancing the product's adaptability.

Terminal Pitch: 1.778 mm

A terminal pitch of 1.778 mm provides a good balance between density and ease of handling during PCB assembly.

Speed: 8 rpm

With a speed rating of 8 rpm, this microcontroller is suitable for low-speed sensing and control applications.

No. of I/O Lines: 32

Having 32 I/O lines allows for interfacing with multiple peripherals and devices, enhancing the system's capabilities.

Technical Specifications

Microcontrollers ST72F325J6B6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDIP-T42

JESD-609 Code:

e3

Length:

36.83 mm

No. of I/O Lines:

32

No. of Terminals:

42

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SDIP42,.6

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

5.08 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

15 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.778 mm

Terminal Position:

DUAL

Width:

15.24 mm

Peripheral IC Type:

Trade Compliance

ST72F325J6B6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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