Loading...

ST72F325AR9T6

STMicroelectronics

ST72F325AR9T6 by STMicroelectronics

ST72F325AR9T6 microcontroller from STMicroelectronics features a 16 MHz CPU, 64 terminals, and operates within -40 °C to 85 °C. With 2048 bytes of RAM and flash ROM for programmability, it's ideal for industrial applications requiring low power and multiple I/O lines. Its compact design ensures efficient surface mounting in various devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,656 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,656

-

-

-

-

Vyrian

USA . 4,333 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,333

-

-

-

-

Chip Stock

USA . 765 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

765

-

-

-

-

Anansix

USA . 519 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

519

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 420 parts In-Stock

1+ parts

$8.570

100+ parts

-

1k+ parts

-

10k+ parts

-

420

$8.570

-

-

-

Microchip USA

USA . 432 parts In-Stock

1+ parts

$39.441

100+ parts

-

1k+ parts

-

10k+ parts

-

432

$39.441

-

-

-

IDEA Electronic Components Group

UK . 1,439 parts In-Stock

1+ parts

$79.083

100+ parts

-

1k+ parts

$71.175

10k+ parts

-

1,439

$79.083

-

$71.175

-

MKK Technologies

India . 1,959 parts In-Stock

1+ parts

$148.711

100+ parts

-

1k+ parts

-

10k+ parts

-

1,959

$148.711

-

-

-

DigiPath Technology Company

USA . 1,959 parts In-Stock

1+ parts

$148.711

100+ parts

-

1k+ parts

-

10k+ parts

-

1,959

$148.711

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 21,723 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

21,723

-

-

-

-

A-Z Elektronik GmbH

Germany . 4,961 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,961

-

-

-

-

Corphita

USA . 4,632 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,632

-

-

-

-

Vigor

Singapore . 1,347 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,347

-

-

-

-

Parana Technologies

USA . 1,088 parts In-Stock

1+ parts

-

100+ parts

$94.556

1k+ parts

-

10k+ parts

-

1,088

-

$94.556

-

-

Metaverse IC Inc.

Canada . 905 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

905

-

-

-

-

Perfect Parts

USA . 728 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

728

-

-

-

-

Overview

Unlock the potential of your projects with the ST72F325AR9T6 microcontroller from STMicroelectronics, a leader in innovation and quality. Designed for durability and efficiency, this versatile 8-bit MCU is perfect for industrial applications, promising reliability even in extreme temperatures. With seamless integration features and low power consumption, elevate your designs while enjoying robust performance. Choose STMicroelectronics and empower your creations with excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material ensures reliability and cost-effectiveness, ideal for consumer and industrial applications.

Surface Mount: YES

Allows for compact designs and efficient use of PCB space, facilitating modern electronics assembly.

Maximum Supply Voltage: 5.5 V

Compatible with a wide range of power sources, providing flexibility in system design.

Package Shape: SQUARE

Square shape can simplify PCB layout and integration into various applications.

Bit Size: 8

Sufficient for many applications, especially in control systems and simple embedded tasks.

No. of Terminals: 64

Provides ample connectivity options for interfacing with various peripherals and components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Enables efficient space utilization in compact designs, fitting into low-profile applications.

Minimum Supply Voltage: 3.8 V

Allows operation with lower power supplies, enhancing energy efficiency in battery-operated devices.

Maximum Operating Temperature: 85 °C

Suitable for environments with higher temperatures, ensuring reliable performance under challenging conditions.

CPU Family: ST72

Proven architecture with support for various application needs, enhancing design confidence.

No. of External Interrupts: 15

Enables responsive event handling, crucial for real-time applications.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme conditions, making it suitable for industrial and automotive applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent corrosion resistance and durability, ensuring reliable electrical connections.

ADC Channels: YES

Enables direct signal processing from analog sources, making it versatile for sensor applications.

Terminal Position: QUAD

Allows for improved routing options on the PCB, facilitating versatile design layouts.

ROM Words: 61440

Offers substantial memory for storing code, enabling complex application development.

Maximum Seated Height: 1.6 mm

Low profile design allows for space-saving implementations in compact devices.

Width: 10 mm

Compact width makes it easier to fit in space-constrained designs.

Maximum Clock Frequency: 16 MHz

Provides adequate processing speed for many applications without excessive power consumption.

Maximum Time At Peak Reflow Temperature: 30 s

Allows for reliable soldering during manufacturing processes, enhancing production yield.

Peak Reflow Temperature: 260 °C

High reflow temperature tolerance ensures product reliability during assembly processes.

Length: 10 mm

Compact size contributes to smaller PCB designs, enabling miniaturized electronic products.

Temperature Grade: INDUSTRIAL

Meets stringent industry standards for temperature stability, ensuring reliable operation in demanding environments.

Peripheral IC Type: MICROCONTROLLER

Designed specifically for control-related tasks, enhancing performance in embedded applications.

RAM Bytes: 2048

Adequate RAM allows for effective processing of data and enhances multitasking capabilities.

Technology: CMOS

Low power consumption technology enhances battery life in portable and battery-operated devices.

Terminal Form: GULL WING

Standard gull wing design facilitates easy PCB mounting and soldering, ensuring reliable connections.

Maximum Supply Current: 15 mA

Low supply current makes it ideal for energy-sensitive applications, promoting battery efficiency.

Nominal Supply Voltage: 5 V

Standard supply voltage allows for widespread compatibility with various power supply options.

PWM Channels: YES

Enables precise control of motors and other devices, ideal for automation and control applications.

ROM Programmability: FLASH

Allows for easy updates and customization of firmware, enhancing product longevity and flexibility.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density designs, offering more functionality in smaller spaces.

Format: FIXED POINT

Fixed-point support allows for efficient mathematical operations in various applications, particularly in control systems.

Moisture Sensitivity Level (MSL): 3

Indicates a reasonable level of moisture tolerance, ensuring stability during storage and assembly.

Speed: 8 rpm

Provides sufficient processing speed for most control and processing tasks, ensuring smooth operations.

Low Power Mode: YES

Conserves power during inactivity, making it suitable for energy-sensitive devices.

On Chip Program ROM Width: 8

Supported width enables compatibility with various software and firmware, maximizing versatility.

No. of I/O Lines: 48

Ample I/O lines facilitate diverse interfacing capabilities, supporting complex designs and functionalities.

Technical Specifications

Microcontrollers ST72F325AR9T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

15

No. of I/O Lines:

48

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

61440

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Maximum Supply Current:

15 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

ST72F325AR9T6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20