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ST72F324LJ4T6

STMicroelectronics

ST72F324LJ4T6 by STMicroelectronics

ST72F324LJ4T6 microcontroller from STMicroelectronics features a 16 MHz CPU, 12 ADC channels, and operates b/w -40 °C to 85 °C. With a compact flatpack design and low power consumption (max 7 mA), it's ideal for industrial applications. Its flash ROM supports versatile programming needs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,297 parts In-Stock

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Digiode

USA . 1,738 parts In-Stock

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Anansix

USA . 527 parts In-Stock

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527

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LWI Electronics Inc

India . 4 parts In-Stock

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Microchip USA

USA . 101 parts In-Stock

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$6.108

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101

$6.108

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AZTECH Wire

Italy . 651 parts In-Stock

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$20.720

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651

$20.720

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IDEA Electronic Components Group

UK . 1,093 parts In-Stock

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$35.207

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$31.686

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$35.207

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$31.686

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MKK Technologies

India . 1,980 parts In-Stock

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$66.204

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$66.204

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DigiPath Technology Company

USA . 1,980 parts In-Stock

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$66.204

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RC Electronics

USA . 8,510 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,035 parts In-Stock

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Vigor

Singapore . 3,556 parts In-Stock

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Assy Fe

Spain . 2,880 parts In-Stock

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Corphita

USA . 2,507 parts In-Stock

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Authorized Procurement Solutions

USA . 1,500 parts In-Stock

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Parana Technologies

USA . 669 parts In-Stock

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$42.095

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669

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$42.095

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Overview

Unlock the future of innovation with the ST72F324LJ4T6 microcontroller from STMicroelectronics, a leader in cutting-edge technology. This high-quality, versatile component excels in diverse applications—from industrial automation to consumer electronics—ensuring reliability and peak performance. With its compact design and robust features, it delivers unmatched value, empowering engineers to create smarter, more efficient solutions while minimizing energy consumption and maximizing productivity.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material provides good protection against environmental factors, making the microcontroller suitable for a variety of applications.

Surface Mount: YES

Surface mount capability allows for compact designs and easier integration into modern electronic systems.

Maximum Supply Voltage: 3.6 V

Supports a wide range of power supply options, making it versatile for different applications.

Package Shape: SQUARE

The square package shape allows for efficient space utilization on PCBs.

Bit Size: 8

8-bit architecture provides sufficient processing power for simpler applications.

Power Supplies: 3/3.3 V

Compatible with commonly available power supplies, enhancing design flexibility.

No. of Terminals: 44

With 44 terminals, it offers ample connectivity options for peripherals and I/O operations.

Package Style (Meter): FLATPACK, LOW PROFILE

The low profile design minimizes height on PCB assemblies, suitable for space-constrained applications.

Minimum Supply Voltage: 2.85 V

Allows operation in lower voltage environments, contributing to power efficiency.

Maximum Operating Temperature: 85 °C

High temperature tolerance ensures reliability in industrial environments.

CPU Family: ST72

Part of a well-established family, providing a proven track record of reliability and performance.

Minimum Operating Temperature: -40 °C

Extended temperature range makes it suitable for extreme conditions.

Terminal Finish: MATTE TIN

The matte tin finish provides excellent solderability and reduces oxidation.

ADC Channels: YES

Built-in ADC channels allow for direct interfacing with analog sensors, increasing design flexibility.

Terminal Position: QUAD

Quad terminal position facilitates easy mounting and space-efficient layouts.

ROM Words: 16384

Ample ROM capacity for program storage, suitable for relatively complex applications.

Maximum Seated Height: 1.6 mm

Low seated height enhances compactness of design.

Width: 10 mm

Compact width for easy integration into small form factor devices.

Peripherals: TIMER(4)

Four timer peripherals provide enhanced functionality for time-sensitive applications.

Maximum Clock Frequency: 16 MHz

Decent clock frequency is sufficient for moderate-speed operations and processing tasks.

Maximum Time At Peak Reflow Temperature: 30 s

Well-defined reflow profile ensures reliable solder joints during assembly.

Peak Reflow Temperature: 260 °C

Supports high-temperature soldering processes, allowing for more robust assembly techniques.

Length: 10 mm

Standard length, contributing to uniformity and easier placement on PCBs.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, ensuring long-term reliability in demanding conditions.

Peripheral IC Type: MICROCONTROLLER

Specialized for control applications, making it ideal for embedded systems.

RAM Bytes: 512

Sufficient RAM for handling typical data processing tasks within embedded applications.

Technology: CMOS

CMOS technology provides low power consumption, enhancing device efficiency.

Terminal Form: GULL WING

Gull wing terminals simplify soldering processes and improve component accessibility.

Analog To Digital Convertors: 12-Ch 10-Bit

Multiple ADC channels with good resolution enable precise data acquisition from sensors.

Maximum Supply Current: 7 mA

Low supply current ensures minimal power consumption, extending battery life in portable applications.

Nominal Supply Voltage: 3 V

Optimized for common supply voltages, enhancing compatibility and ease of design.

PWM Channels: YES

Presence of PWM channels provides flexibility in controlling motors and other power devices.

Connectivity: SCI, SPI

Offers standard communication interfaces, enhancing integration with other devices and systems.

ROM Programmability: FLASH

FLASH programmability allows for easy updates and modifications to the firmware.

Terminal Pitch: 0.8 mm

A standard terminal pitch facilitates compatibility with various PCB layouts.

Moisture Sensitivity Level (MSL): 3

Level 3 MSL indicates moderate moisture sensitivity, providing guidance for handling and storage.

Speed: 8 rpm

Indicates suitability for applications requiring gradual speed control, such as motor drivers.

On Chip Program ROM Width: 8

8-bit ROM width is suitable for applications that do not require extensive data width.

No. of I/O Lines: 32

32 I/O lines offer ample connections for external components, sensors, and actuators.

Technical Specifications

Microcontrollers ST72F324LJ4T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

32

No. of Terminals:

44

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

RAM Bytes:

512

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

7 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.85 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SCI, SPI

Peripherals:

TIMER(4)

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

ST72F324LJ4T6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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