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ST72F324LJ2T5

STMicroelectronics

ST72F324LJ2T5 by STMicroelectronics

ST72F324LJ2T5 microcontroller from STMicroelectronics features a 16 MHz CPU, 8-bit architecture, and 8192 ROM words. It operates b/w -10 °C to 85 °C with a supply voltage of 2.85-3.6 V. Ideal for embedded applications requiring low power and multiple peripherals like ADCs and timers.

Median Price

$3.520

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 480 parts In-Stock

1+ parts

$3.520

100+ parts

$2.449

1k+ parts

$2.076

10k+ parts

-

480

$3.520

$2.449

$2.076

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,955 parts In-Stock

1+ parts

$3.933

100+ parts

-

1k+ parts

-

10k+ parts

-

4,955

$3.933

-

-

-

Vyrian

USA . 3,647 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,647

-

-

-

-

Cyclops Electronics Ltd

UK . 1,347 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,347

-

-

-

-

Anansix

USA . 831 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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831

-

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,510 parts In-Stock

1+ parts

$3.726

100+ parts

-

1k+ parts

-

10k+ parts

-

2,510

$3.726

-

-

-

IDEA Electronic Components Group

UK . 1,644 parts In-Stock

1+ parts

$21.315

100+ parts

-

1k+ parts

$19.183

10k+ parts

-

1,644

$21.315

-

$19.183

-

MKK Technologies

India . 390 parts In-Stock

1+ parts

$40.081

100+ parts

-

1k+ parts

-

10k+ parts

-

390

$40.081

-

-

-

DigiPath Technology Company

USA . 390 parts In-Stock

1+ parts

$40.081

100+ parts

-

1k+ parts

-

10k+ parts

-

390

$40.081

-

-

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Component Stockers USA

USA . 206 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

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206

$99.990

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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5,000

-

-

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A-Z Elektronik GmbH

Germany . 4,757 parts In-Stock

1+ parts

-

100+ parts

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4,757

-

-

-

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Parana Technologies

USA . 1,926 parts In-Stock

1+ parts

-

100+ parts

$25.485

1k+ parts

-

10k+ parts

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1,926

-

$25.485

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-

Kepictronics

USA . 747 parts In-Stock

1+ parts

-

100+ parts

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747

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Perfect Parts

USA . 538 parts In-Stock

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538

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Overview

Unlock your project's potential with the ST72F324LJ2T5 microcontroller from STMicroelectronics—a trusted name in innovation. Designed for versatility, this robust 8-bit powerhouse ensures reliability across diverse applications, from industrial automation to consumer electronics. With low power consumption and a compact package, it seamlessly integrates into tight spaces. Experience enhanced performance and superior quality that prioritizes your success while delivering exceptional value for your designs!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material provides a robust housing that protects the microcontroller from environmental factors.

Surface Mount: YES

Being surface mount allows for smaller PCB designs and efficient manufacturing processes.

Maximum Supply Voltage: 3.6 V

The relatively low maximum supply voltage ensures lower power consumption, making it ideal for battery-operated devices.

Package Shape: SQUARE

A square shape effectively utilizes board space and fits well in compact designs.

Bit Size: 8

An 8-bit size is suitable for low-power applications that don't require complex computations.

Power Supplies (V): 3/3.3

Flexible power supply options accommodate various applications and make integration easier.

No. of Terminals: 44

The high number of terminals allows for a greater number of I/O lines and functionalities.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile design is advantageous for space-constrained applications.

Minimum Supply Voltage: 2.85 V

This specification helps in maximizing compatibility with a variety of power sources.

Maximum Operating Temperature: 85 °C

This temperature rating ensures reliability in a wide range of environmental conditions.

CPU Family: ST72

The ST72 family is known for its solid performance and established reliability in various applications.

Minimum Operating Temperature: -10 °C

This low temperature range allows the microcontroller to perform well in cold environments.

Terminal Finish: MATTE TIN

Matte tin finish offers good solderability and resistance to corrosion.

ADC Channels: YES

The inclusion of ADC channels enhances the ability to interface with analog sensors.

Terminal Position: QUAD

Quad terminal position improves accessibility for wiring and connections on PCBs.

ROM Words: 8192

Plenty of ROM allows for a sizable program code, enabling complex applications.

Maximum Seated Height: 1.6 mm

The low seated height helps in keeping the overall profile of the PCB slim.

Width: 10 mm

A compact width facilitates use in miniaturized electronic designs.

Peripherals: TIMER(4)

Having multiple timers enables advanced control in time-sensitive applications.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz allows for fast processing while maintaining efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

The peak reflow temperature specification ensures compatibility with standard soldering processes.

Peak Reflow Temperature °C: 260

Higher peak temperatures guarantee compatibility with lead-free soldering techniques.

Length: 10 mm

The length matches the width, providing a square footprint ideal for compact designs.

Temperature Grade: COMMERCIAL EXTENDED

Being commercially rated indicates reliability for general use without extreme conditions.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it integrates processing and control functions in one chip for versatility.

RAM Bytes: 384

With 384 bytes of RAM, it supports data storage for moderately complex tasks.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing leads improve soldering accuracy and reliability during PCB assembly.

Analog To Digital Converters: 12-Ch 10-Bit

Multiple ADC channels with 10-bit resolution provide flexibility for various sensor types.

Maximum Supply Current: 7 mA

The low supply current ensures extended battery life for portable applications.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3V simplifies design considerations with common power supply options.

PWM Channels: YES

PWM channels support various applications such as motor control or LED dimming.

Connectivity: SCI, SPI

Compatible connectivity options enhance interfacing with other devices and peripherals.

ROM Programmability: FLASH

Flash programmability allows for easy updates and reprogrammability of firmware.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch allows for compact layouts on PCBs while facilitating easy soldering.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate moisture sensitivity, guiding proper handling and storage practices.

Speed: 8 rpm

This speed capability is ideal for low-speed applications like simple control tasks.

On Chip Program ROM Width: 8

An 8-bit program ROM width enhances compatibility with 8-bit data processing standards.

No. of I/O Lines: 32

A good number of I/O lines allows for extensive interfacing options for various applications.

Technical Specifications

Microcontrollers ST72F324LJ2T5 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

32

No. of Terminals:

44

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-10 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

RAM Bytes:

384

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

7 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.85 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SCI, SPI

Peripherals:

TIMER(4)

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

ST72F324LJ2T5 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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