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ST72F324K2TA

STMicroelectronics

ST72F324K2TA by STMicroelectronics

ST72F324K2TA microcontroller from STMicroelectronics features an 8-bit CPU with a max clock frequency of 16 MHz, operating b/w 3.8V and 5.5V. It includes 24 I/O lines and supports ADC/PWM channels, ideal for industrial applications. Its compact design ensures efficient performance in space-constrained environments.

Median Price

-

Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 8,542 parts In-Stock

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8,542

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Digiode

USA . 660 parts In-Stock

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660

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Anansix

USA . 118 parts In-Stock

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118

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 60 parts In-Stock

1+ parts

$12.471

100+ parts

$12.471

1k+ parts

$12.471

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-

60

$12.471

$12.471

$12.471

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AZTECH Wire

Italy . 904 parts In-Stock

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$14.180

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904

$14.180

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Microchip USA

USA . 127 parts In-Stock

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$14.817

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127

$14.817

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IDEA Electronic Components Group

UK . 1,181 parts In-Stock

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$64.352

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$57.917

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1,181

$64.352

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$57.917

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MKK Technologies

India . 1,638 parts In-Stock

1+ parts

$121.010

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1,638

$121.010

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DigiPath Technology Company

USA . 1,638 parts In-Stock

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$121.010

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1,638

$121.010

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Vigor

Singapore . 8,931 parts In-Stock

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8,931

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Corphita

USA . 1,744 parts In-Stock

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1,744

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Parana Technologies

USA . 135 parts In-Stock

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$76.943

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$76.943

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Overview

Elevate your projects with the ST72F324K2TA microcontroller from STMicroelectronics, a trusted leader in innovation. Designed for versatility and efficiency, this compact powerhouse delivers high performance across various applications, from industrial automation to consumer electronics. Enjoy seamless integration, robust reliability, and superior processing capabilities. With ST’s commitment to quality, you can trust that the ST72F324K2TA will enhance your designs and drive success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making it reliable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of space on PCBs, enhancing design flexibility.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V provides compatibility with a wide range of power supply options.

Package Shape: SQUARE

The square package shape simplifies layout planning and allows for efficient use of PCB real estate.

Bit Size: 8

An 8-bit architecture is ideal for cost-sensitive applications where low power consumption is essential.

Power Supplies (V): 3.3

Operating at a nominal power supply of 3.3 V means lower heat generation and energy efficiency in applications.

No. of Terminals: 32

With 32 terminals, this microcontroller offers ample GPIO pins for versatile interfacing and control capabilities.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack design allows easy integration into compact systems, ensuring this product fits in tight spaces.

Minimum Supply Voltage: 3.8 V

The minimum supply voltage of 3.8 V allows for reliable operation in environments where power supply variation is expected.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this microcontroller is suitable for industrial applications with high thermal demands.

CPU Family: ST72

The ST72 CPU family is known for its robustness and performance, making it ideal for a variety of embedded applications.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C enables this microcontroller to function in extreme environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish provides excellent corrosion resistance and long-term reliability in various applications.

ADC Channels: YES

The inclusion of ADC channels allows for accurate analog signal processing, making it suitable for sensor-based applications.

Terminal Position: QUAD

Quad terminal positioning facilitates efficient PCB layout and soldering processes, improving production efficiency.

ROM Words: 8192

With 8192 ROM words, this microcontroller provides sufficient memory for large embedded applications.

Maximum Seated Height: 1.6 mm

A maximum seated height of 1.6 mm enables compact stacking of multiple components, optimizing space in design.

Width: 7 mm

The 7 mm width contributes to a smaller footprint, making it an excellent choice for space-constrained applications.

Maximum Clock Frequency: 16 MHz

A high clock frequency of 16 MHz allows for faster processing, essential for performance-sensitive tasks.

Length: 7 mm

With a length of 7 mm, this microcontroller fits well in compact design layouts, enhancing usability.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature grades, this microcontroller guarantees reliable performance in demanding environments.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it integrates processing and control functionalities, providing a complete solution for embedded applications.

RAM Bytes: 384

384 bytes of RAM offer enough memory for simple data handling, suitable for basic control tasks.

Technology: CMOS

Utilizing CMOS technology enhances power efficiency and reduces heat generation, making it suitable for battery-powered applications.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and manufacturing, improving yield rates in production.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V ensures versatility in powering from standard sources, increasing application options.

PWM Channels: YES

The presence of PWM channels allows for precise control over motors and lights, enabling advanced applications in automation.

ROM Programmability: FLASH

Flash programmability allows for easy updates and versatility, making it adaptable to various application requirements.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm offers good density for connections, optimizing layout while maintaining manufacturability.

Speed: 8 rpm

With a speed of 8 rpm, this microcontroller is suitable for applications requiring moderate reaction speeds.

No. of I/O Lines: 24

24 I/O lines provide extensive interfacing options, allowing for a variety of peripherals and devices to be connected.

Technical Specifications

Microcontrollers ST72F324K2TA attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e4

Length:

7 mm

No. of I/O Lines:

24

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

384

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Trade Compliance

ST72F324K2TA Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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