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ST72F324K2T6

STMicroelectronics

ST72F324K2T6 by STMicroelectronics

ST72F324K2T6 microcontroller from STMicroelectronics features an 8-bit CPU with a max clock frequency of 16 MHz, operating b/w -40 °C to 85°C. It supports 8 ADC channels and has 8192 ROM words for versatile applications in industrial settings. Its compact design includes a low-profile flatpack package with 32 terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,414 parts In-Stock

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8,414

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Anansix

USA . 1,727 parts In-Stock

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1,727

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Digiode

USA . 838 parts In-Stock

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838

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J2 Sourcing AB

Sweden . 8 parts In-Stock

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8

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Distributors (Availability)

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Vigor

Singapore . 1,094 parts In-Stock

1+ parts

$3.580

100+ parts

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1,094

$3.580

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AZTECH Wire

Italy . 339 parts In-Stock

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$15.500

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339

$15.500

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Microchip USA

USA . 430 parts In-Stock

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$21.932

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430

$21.932

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IDEA Electronic Components Group

UK . 62 parts In-Stock

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$68.658

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$61.792

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62

$68.658

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$61.792

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MKK Technologies

India . 1,340 parts In-Stock

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$129.106

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1,340

$129.106

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DigiPath Technology Company

USA . 1,340 parts In-Stock

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$129.106

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1,340

$129.106

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A-Z Elektronik GmbH

Germany . 5,069 parts In-Stock

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5,069

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Perfect Parts

USA . 4,006 parts In-Stock

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Corphita

USA . 1,605 parts In-Stock

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1,605

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Parana Technologies

USA . 1,510 parts In-Stock

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$82.091

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$82.091

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Kepictronics

USA . 1,500 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Overview

Unlock the power of innovation with the ST72F324K2T6 microcontroller from STMicroelectronics! Renowned for its reliability and performance, this 8-bit gem is perfect for a wide range of industrial applications—from automation to consumer electronics. With low power consumption and robust features, it ensures efficiency without compromising on quality. Trust in STMicroelectronics’ legacy and elevate your projects with unparalleled precision and capability!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliability and longevity in various environmental conditions.

Surface Mount: YES

Surface mount technology allows for compact designs, making it suitable for space-constrained applications.

Maximum Supply Voltage: 5.5 V

A higher supply voltage threshold provides flexibility in power supply options.

Package Shape: SQUARE

The square shape facilitates uniform heat distribution and is commonly used for efficient PCB layout.

Bit Size: 8

An 8-bit architecture is ideal for simple control applications and low-power devices.

Power Supplies (V): 3.3

The ability to operate on 3.3V optimizes power consumption and is compatible with many modern digital devices.

No. of Terminals: 32

A higher number of terminals allows for increased connectivity and functionality in designs.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile design enables design in compact spaces, enhancing overall product design.

Minimum Supply Voltage: 3.8 V

Operating efficiently from a minimum voltage of 3.8V supports a wider range of applications.

Maximum Operating Temperature: 85 °C

A high maximum operating temperature ensures performance in demanding environments.

CPU Family: ST72

The ST72 family CPU is known for its versatility in various embedded applications.

Minimum Operating Temperature: -40 °C

Working at -40 °C allows deployment in extreme conditions, making it suitable for industrial applications.

Terminal Finish: Matte Tin (Sn)

The matte tin finish provides excellent solderability and corrosion resistance.

ADC Channels: YES

Integrated ADC channels enhance the microcontroller's capability to interface with analog sensors.

Terminal Position: QUAD

Quad terminal position provides a stable connection and improves soldering reliability.

ROM Words: 8192

With 8192 ROM words, it offers sufficient memory for many embedded applications.

Maximum Seated Height: 1.6 mm

The low height allows for slimmer designs, which is advantageous for portable devices.

Width: 7 mm

A compact width contributes to space efficiency in PCB design.

Peripherals: TIMER(4)

Multiple timers allow for versatility in scheduling and precise control in applications.

Maximum Clock Frequency: 16 MHz

16 MHz clock frequency ensures responsive performance for most control applications.

Maximum Time At Peak Reflow Temperature (s): 30

A longer peak reflow time allows for better solder joint integrity during assembly processes.

Peak Reflow Temperature °C: 235

A peak reflow temperature of 235 °C is standard for many surface-mounted electronic assemblies.

Length: 7 mm

The compact length enhances design flexibility and contributes to miniaturized products.

Temperature Grade: INDUSTRIAL

Industrial temperature grading guarantees reliable operation in harsh environments.

Peripheral IC Type: MICROCONTROLLER

Dedicated microcontroller capabilities ensure efficient performance in control applications.

RAM Bytes: 384

384 bytes of RAM allow for reasonable data handling in embedded applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and handling during assembly.

Analog To Digital Converters: 8-Ch 10-Bit

Having 8 channels of 10-bit ADC enables detailed sensor data capture and processing.

Nominal Supply Voltage: 5 V

5V nominal supply is standard across many devices, enhancing compatibility.

PWM Channels: YES

PWM channels allow for precise control in motor and LED applications.

Connectivity: SCI, SPI

Support for SCI and SPI protocols enhances communication capabilities with other devices.

ROM Programmability: FLASH

Flash programmability allows for easy updates and firmware changes, increasing product lifetimes.

Terminal Pitch: 0.8 mm

The 0.8 mm terminal pitch is suitable for high-density applications in compact designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates moderate sensitivity to moisture, providing guidance for storage and handling.

Speed: 8 rpm

8 rpm speed is adequate for applications requiring consistent, controlled motion.

On Chip Program ROM Width: 8

An 8-bit ROM width supports efficient programming and memory utilization.

No. of I/O Lines: 24

24 I/O lines provide ample connectivity for various peripherals and sensors.

Technical Specifications

Microcontrollers ST72F324K2T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

24

No. of Terminals:

32

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

235

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

384

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SCI, SPI

Peripherals:

TIMER(4)

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

ST72F324K2T6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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