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ST72F324J6T6

STMicroelectronics

ST72F324J6T6 by STMicroelectronics

ST72F324J6T6 microcontroller from STMicroelectronics features a 16 MHz CPU, 32 I/O lines, and operates b/w 3.8V to 5.5V. Its compact flatpack design is ideal for industrial applications requiring reliable performance in harsh environments. With integrated ADC and PWM channels, it supports diverse control tasks efficiently.

Median Price

$5.780

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (In-Stock)

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American Microsemiconductor Inc.

USA . 521 parts In-Stock

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$5.780

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521

$5.780

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Vyrian

USA . 7,195 parts In-Stock

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7,195

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Digiode

USA . 3,075 parts In-Stock

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3,075

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Anansix

USA . 1,954 parts In-Stock

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1,954

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Q Components

USA . 1,452 parts In-Stock

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1,452

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A&K Electronics

USA . 980 parts In-Stock

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980

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Rotakorn

Sweden . 960 parts In-Stock

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960

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Chip Stock

USA . 918 parts In-Stock

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918

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K-1 Technologies

USA . 918 parts In-Stock

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918

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Zilex Electronics Inc.

Canada . 106 parts In-Stock

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106

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Infinite Electronics LLP

India . 106 parts In-Stock

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106

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Cyclops Electronics Ltd

UK . 26 parts In-Stock

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26

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ComSIT Distribution GmbH

Germany . 19 parts In-Stock

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Odi Ramu Company

Canada . 12 parts In-Stock

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12

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Connect4Technologies Inc.

Canada . 9 parts In-Stock

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9

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J2 Sourcing AB

Sweden . 5 parts In-Stock

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5

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Distributors (Availability)

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Vigor

Singapore . 3,436 parts In-Stock

1+ parts

$4.630

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3,436

$4.630

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Microchip USA

USA . 189 parts In-Stock

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$7.640

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189

$7.640

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AZTECH Wire

Italy . 574 parts In-Stock

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$21.560

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574

$21.560

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IDEA Electronic Components Group

UK . 2,199 parts In-Stock

1+ parts

$47.190

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$42.471

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2,199

$47.190

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$42.471

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MKK Technologies

India . 956 parts In-Stock

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$88.739

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956

$88.739

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DigiPath Technology Company

USA . 956 parts In-Stock

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$88.739

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956

$88.739

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Component Stockers USA

USA . 240 parts In-Stock

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$99.990

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240

$99.990

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Kepictronics

USA . 37,040 parts In-Stock

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RC Electronics

USA . 9,797 parts In-Stock

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Perfect Parts

USA . 5,416 parts In-Stock

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Corphita

USA . 1,121 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Parana Technologies

USA . 669 parts In-Stock

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$56.423

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669

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$56.423

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GreenTree Electronics

Israel . 500 parts In-Stock

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500

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A-Z Elektronik GmbH

Germany . 231 parts In-Stock

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231

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Cyclops Electronics Ltd (Excess)

UK . 20 parts In-Stock

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Overview

Elevate your designs with the ST72F324J6T6 microcontroller from STMicroelectronics, a leader in high-quality semiconductor solutions. This versatile 8-bit MCU combines robust performance with exceptional reliability, perfect for industrial applications where precision is crucial. Its compact form factor and advanced features streamline integration, ensuring reduced time-to-market and enhanced efficiency. Experience innovation that drives success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers durability and resistance to environmental stresses, making it suitable for various applications.

Surface Mount: YES

The surface mount design allows for compact PCB layouts, saving space and facilitating easy integration into modern electronics.

Maximum Supply Voltage: 5.5 V

Supports a wide range of supply voltages, providing flexibility in power source selection for different applications.

Package Shape: SQUARE

The square package shape is efficient for space-saving and thermal management in compact designs.

Bit Size: 8

An 8-bit architecture is suitable for basic control tasks, making it ideal for low-power and cost-sensitive applications.

Power Supplies (V): 3.3

Operating at 3.3V enhances power efficiency, which is essential for battery-operated devices.

No. of Terminals: 44

A higher number of terminals allows for expanded I/O capabilities and interfacing with various peripheral devices.

Package Style (Meter): FLATPACK, LOW PROFILE

The low profile flatpack style enables easy placement on circuit boards, which is crucial for modern device designs.

Minimum Supply Voltage: 3.8 V

This provides a reliable operating range that can accommodate slight variations in power supply.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this microcontroller is suitable for industrial applications with moderate thermal requirements.

CPU Family: ST72

The ST72 family is known for its reliability and performance, making it a trusted choice in microcontroller applications.

Minimum Operating Temperature: -40 °C

A wide operating temperature range makes this product suitable for harsh environments.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish ensures good solderability and resistance to corrosion over time.

ADC Channels: YES

The presence of ADC channels enables the microcontroller to handle analog signals effectively, allowing for sensor integration.

Terminal Position: QUAD

Dual position configurations make PCB design easier and enhance connectivity with other components.

ROM Words: 32,768

A decent ROM capacity enables the storage of essential code for more complex applications.

Maximum Seated Height: 1.6 mm

Low seated height helps in achieving thinner device designs, appealing to portable electronics.

Width: 10 mm

Compact width allows for more efficient use of PCB space.

Peripherals: TIMER (4)

Multiple timers provide enhanced capabilities for real-time processing and control in various applications.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz offers sufficient processing power for many typical microcontroller tasks.

Maximum Time At Peak Reflow Temperature (s): 30

Supports standard reflow soldering processes, ensuring compatibility with common manufacturing techniques.

Peak Reflow Temperature °C: 260

A high reflow temperature tolerance ensures reliable soldering during assembly.

Length: 10 mm

Compact length contributes to efficient PCB layouts and space conservation in electronic designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures performance stability in demanding applications.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it serves as a versatile solution for control applications in various sectors.

RAM Bytes: 1024

With 1024 bytes of RAM, the product can support moderately complex applications and data handling.

Technology: CMOS

CMOS technology offers low power consumption, making it ideal for battery-operated devices and energy-efficient applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easier handling and improved soldering quality.

Analog To Digital Converters: 12-Ch 10-Bit

The presence of a 12-channel 10-bit ADC allows for a versatile range of sensor input capabilities.

Nominal Supply Voltage: 5 V

Standard nominal supply voltage simplifies circuit design and power supply considerations.

PWM Channels: YES

PWM channels enable effective control of motors and other actuators, making this microcontroller suitable for automation.

Connectivity: SCI, SPI

Support for SCI and SPI connectivity enhances the versatility to interface with various external devices and communication protocols.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and modifications of firmware in the field.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch is commonly used and helps maintain compatibility with standard PCB designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates a moderate sensitivity to moisture, ensuring appropriate handling and storage practices.

Speed: 8 rpm

Although the speed is low, this can be an advantage in applications where slight adjustments and control are required.

On Chip Program ROM Width: 8

An 8-bit ROM width aligns well with the architecture, promoting efficient memory access and management.

No. of I/O Lines: 32

With 32 I/O lines available, this microcontroller can interface with a variety of external components and sensors.

Technical Specifications

Microcontrollers ST72F324J6T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

32

No. of Terminals:

44

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SCI, SPI

Peripherals:

TIMER(4)

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

ST72F324J6T6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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