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ST72F324J4T6

STMicroelectronics

ST72F324J4T6 by STMicroelectronics

ST72F324J4T6 microcontroller from STMicroelectronics features a 16 MHz CPU, 512 bytes of RAM, and supports up to 12 ADC channels. With a supply voltage range of 3.8-5.5 V, it’s ideal for industrial applications requiring reliable performance in harsh environments. Its compact design ensures efficient integration into various electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Vyrian

USA . 2,823 parts In-Stock

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Digiode

USA . 901 parts In-Stock

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Anansix

USA . 491 parts In-Stock

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Sensible Micro Corp

USA . 439 parts In-Stock

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ComSIT Distribution GmbH

Germany . 176 parts In-Stock

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Microchip USA

USA . 321 parts In-Stock

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$3.091

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321

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Vigor

Singapore . 2,395 parts In-Stock

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$7.880

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$7.880

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AZTECH Wire

Italy . 1,188 parts In-Stock

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$20.450

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IDEA Electronic Components Group

UK . 955 parts In-Stock

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$62.393

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$56.153

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MKK Technologies

India . 368 parts In-Stock

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$117.325

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DigiPath Technology Company

USA . 368 parts In-Stock

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Perfect Parts

USA . 12,914 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,182 parts In-Stock

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Kepictronics

USA . 4,350 parts In-Stock

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Corphita

USA . 4,245 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Parana Technologies

USA . 349 parts In-Stock

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$74.600

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GreenTree Electronics

Israel . 50 parts In-Stock

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Overview

Elevate your projects with the ST72F324J4T6 microcontroller from STMicroelectronics, a name synonymous with excellence and reliability in the industry. Designed for versatility, this compact powerhouse excels in automotive, industrial, and consumer applications, delivering efficient performance in demanding environments. With advanced peripherals and robust features, it offers unmatched value, ensuring your designs are not only innovative but also dependable. Trust STMicroelectronics to power your next breakthrough!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy makes the microcontroller durable and lightweight, suitable for various environmental conditions.

Surface Mount: YES

Surface mount technology allows for compact design and easier integration into modern electronic assemblies.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V provides flexibility in power supply options, compatible with many systems.

Package Shape: SQUARE

The square package shape maximizes space efficiency on circuit boards.

Bit Size: 8

8-bit architecture is ideal for simple control applications, allowing for easy programming and understanding.

Power Supplies (V): 3.3

Operating with a nominal voltage of 3.3 V balances performance and power efficiency, reducing energy consumption.

No. of Terminals: 44

A higher number of terminals ensures that the microcontroller can interface with a variety of peripherals and sensors.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack design enhances thermal performance and reduces board space requirements.

Minimum Supply Voltage: 3.8 V

The minimum supply voltage of 3.8 V ensures consistent performance in lower-power applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this microcontroller is suitable for industrial applications that experience heat.

CPU Family: ST72

Being part of the ST72 family means it benefits from proven architecture and support, enhancing reliability.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C makes this microcontroller ideal for extreme environmental conditions.

Terminal Finish: Matte Tin (Sn) - annealed

Annealed matte tin terminal finish offers good solderability and corrosion resistance, ensuring reliable connections.

ADC Channels: YES

Integrated ADC channels allow for direct processing of analog signals, simplifying design requirements.

Terminal Position: QUAD

The quad terminal position provides efficient dual-sided mounting capabilities, optimizing PCB layouts.

ROM Words: 16384

A generous ROM size of 16384 words accommodates complex program storage, providing design flexibility.

Maximum Seated Height: 1.6 mm

The low seated height supports space-constrained applications and enhances the aesthetics of the design.

Width: 10 mm

At a width of 10 mm, this microcontroller offers a compact size that fits well in portable devices.

Peripherals: TIMER(4)

Four timers provide versatile timing solutions, which are critical for many embedded tasks such as event scheduling.

Maximum Clock Frequency: 16 MHz

With a 16 MHz clock frequency, the microcontroller delivers a good balance of performance and power efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

This specification ensures compatibility with standard soldering processes, vital for manufacturing efficiency.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C ensures this microcontroller can withstand high-temperature solder processes.

Length: 10 mm

The compact length of 10 mm makes this product suitable for space-sensitive applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade indicates robustness, making it suitable for harsh working conditions.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it integrates various functionalities, reducing the need for multiple separate components.

RAM Bytes: 512

512 bytes of RAM provide adequate temporary memory for operations, enabling efficient execution of tasks.

Technology: CMOS

CMOS technology enhances energy efficiency and allows for high density of components on the chip.

Terminal Form: GULL WING

Gull wing terminals ensure reliable connections and are favored for their excellent solderability.

Analog To Digital Converters: 12-Ch 10-Bit

With 12 channels of 10-bit ADC, it can process multiple sensors simultaneously, making it suitable for complex applications.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V is standard in the industry, enabling easy integration with existing systems.

PWM Channels: YES

Supporting PWM channels is excellent for motor control and other applications requiring variable power.

Connectivity: SCI, SPI

Support for SCI and SPI connectivity enables seamless communication with other devices and peripherals.

ROM Programmability: FLASH

The flash ROM allows for easy reprogramming, making updates and modifications convenient during development.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm allows for high-density designs, making it suitable for modern electronic devices.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates that proper handling and storage are vital, ensuring long-term reliability.

Speed: 8 rpm

At 8 rpm, it is well suited for applications that require precise, low-speed control, such as robotics.

On Chip Program ROM Width: 8

An 8-bit program ROM width simplifies coding and allows effective handling of various control tasks.

No. of I/O Lines: 32

With 32 I/O lines, this microcontroller offers extensive interfacing capabilities for various applications.

Technical Specifications

Microcontrollers ST72F324J4T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

32

No. of Terminals:

44

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

512

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SCI, SPI

Peripherals:

TIMER(4)

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

ST72F324J4T6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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