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ST72F324J4B5

STMicroelectronics

ST72F324J4B5 by STMicroelectronics

ST72F324J4B5 microcontroller from STMicroelectronics features an 8-bit CPU with a max clock frequency of 16 MHz, operating b/w 3.8V and 5.5V. It includes 32 I/O lines and supports ADC and PWM channels, making it ideal for embedded applications. Its compact design ensures efficient integration in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,292 parts In-Stock

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8,292

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Anansix

USA . 2,618 parts In-Stock

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2,618

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Digiode

USA . 2,535 parts In-Stock

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2,535

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Zilex Electronics Inc.

Canada . 117 parts In-Stock

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117

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Distributors (Availability)

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Vigor

Singapore . 1,434 parts In-Stock

1+ parts

$5.160

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1,434

$5.160

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Microchip USA

USA . 498 parts In-Stock

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$7.396

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498

$7.396

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AZTECH Wire

Italy . 188 parts In-Stock

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$21.000

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188

$21.000

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IDEA Electronic Components Group

UK . 586 parts In-Stock

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$29.897

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$26.908

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586

$29.897

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$26.908

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MKK Technologies

India . 795 parts In-Stock

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$56.220

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795

$56.220

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DigiPath Technology Company

USA . 795 parts In-Stock

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$56.220

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795

$56.220

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Component Stockers USA

USA . 557 parts In-Stock

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$99.990

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557

$99.990

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A-Z Elektronik GmbH

Germany . 4,559 parts In-Stock

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Corphita

USA . 4,209 parts In-Stock

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Parana Technologies

USA . 1,407 parts In-Stock

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$35.747

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1,407

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$35.747

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Perfect Parts

USA . 379 parts In-Stock

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Overview

Unlock the power of innovation with the ST72F324J4B5 microcontroller from STMicroelectronics, a leader in embedded solutions. Designed for reliability and versatility, this 8-bit wonder excels in a wide range of applications, from industrial automation to consumer electronics. With its robust performance at low power consumption, you’ll enjoy faster development cycles and reduced costs, ensuring your projects stay ahead of the curve. Trust in STMicroelectronics’ legacy of quality to drive your success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material ensures reliability and protection against environmental factors, enhancing the lifespan of the microcontroller.

Maximum Supply Voltage: 5.5 V

Allows for flexibility in power supply design, accommodating various applications while ensuring stability.

Package Shape: RECTANGULAR

Rectangular shapes facilitate efficient space utilization on PCBs, making this microcontroller suitable for compact designs.

Bit Size: 8

An 8-bit architecture is optimal for simple control tasks and basic processing, ideal for entry-level applications.

Power Supplies (V): 3.3

The microcontroller operates at 3.3V, which is standard for many digital circuits, allowing for compatibility with modern devices.

No. of Terminals: 42

A higher number of terminals provides extensive connectivity options for interfacing with other components and peripherals.

Package Style (Meter): IN-LINE, SHRINK PITCH

This package style maximizes layout efficiency, making it easier to integrate into various designs, especially where space is critical.

Minimum Supply Voltage: 3.8 V

A lower minimum supply voltage expands the range of powering options, making it versatile for battery-operated devices.

Maximum Operating Temperature: 85 °C

This temperature rating ensures reliable operation in a wide range of environments, suitable for various industrial applications.

CPU Family: ST72

The ST72 family offers a rich set of features and support, making it a reliable choice among developers familiar with this architecture.

Minimum Operating Temperature: -10 °C

This allows the microcontroller to function in harsh conditions, expanding its use in outdoor or industrial applications.

ADC Channels: YES

Built-in ADC channels simplify the design process for applications requiring analog signal processing, enhancing versatility.

Terminal Position: DUAL

Dual terminal positioning aids in easier mounting and connection, ensuring better assembly practices in production.

ROM Words: 16384

A substantial amount of ROM allows for more complex applications and the storage of multiple programs or configurations.

Maximum Seated Height: 5.08 mm

The relatively low seated height enables more compact arrangements with other components on a PCB.

Width: 15.24 mm

This width design helps in maintaining a compact footprint while offering adequate space for connections.

Maximum Clock Frequency: 16 MHz

Supports moderate processing needs and allows for faster data handling compared to lower frequency counterparts.

Length: 36.83 mm

The length offers a balance between size and functionality, maintaining compatibility with various circuit layouts.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it integrates processing, memory, and I/O capabilities, reducing the need for additional components.

RAM Bytes: 512

Adequate RAM allows for efficient operation and the ability to handle multiple tasks or processes simultaneously.

Technology: CMOS

CMOS technology ensures low power consumption while offering high noise immunity and good performance characteristics.

Terminal Form: THROUGH-HOLE

Through-hole mounting provides strong physical stability, making it ideal for prototyping and rugged applications.

Nominal Supply Voltage: 5 V

A common voltage level simplifies design and makes this microcontroller compatible with many existing modules and shields.

PWM Channels: YES

The availability of PWM channels enables various applications such as motor control and dimming for LEDs, enhancing functionality.

ROM Programmability: FLASH

The use of FLASH ROM allows for easy updates and changes to firmware, ideal for evolving projects or applications.

Terminal Pitch: 1.778 mm

This pitch is suitable for compact designs while ensuring ease of soldering and connection with other components.

Speed: 8 rpm

While low, this speed setting can be suitable for specific applications that do not require rapid processing.

No. of I/O Lines: 32

The presence of 32 I/O lines offers ample flexibility for connecting sensors, motors, and other peripherals in diverse applications.

Technical Specifications

Microcontrollers ST72F324J4B5 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDIP-T42

Length:

36.83 mm

No. of I/O Lines:

32

No. of Terminals:

42

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-10 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SDIP42,.6

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

512

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

5.08 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.778 mm

Terminal Position:

DUAL

Width:

15.24 mm

Peripheral IC Type:

Trade Compliance

ST72F324J4B5 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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