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ST72F324BK6T6

STMicroelectronics

ST72F324BK6T6 by STMicroelectronics

ST72F324BK6T6 microcontroller from STMicroelectronics features an 8-bit CPU, operates at a max voltage of 5.5V, and includes 8 ADC channels. With a compact low-profile package and industrial temperature range (-40 °C to 85 °C), it's ideal for embedded applications. Its connectivity options include SCI and SPI, making it versatile for various projects.

Median Price

$2.980

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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EBV Elektronik

Germany . 250 parts In-Stock

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250

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Digiode

USA . 4,652 parts In-Stock

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4,652

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Chip Stock

USA . 3,381 parts In-Stock

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Vyrian

USA . 2,056 parts In-Stock

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ComSIT Distribution GmbH

Germany . 504 parts In-Stock

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TME

Poland . 250 parts In-Stock

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$2.980

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$2.980

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Anansix

USA . 94 parts In-Stock

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Microchip USA

USA . 186 parts In-Stock

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$9.074

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186

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AZTECH Wire

Italy . 717 parts In-Stock

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$15.030

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$15.030

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IDEA Electronic Components Group

UK . 2,342 parts In-Stock

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$25.947

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$23.352

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$25.947

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$23.352

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MKK Technologies

India . 641 parts In-Stock

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$48.791

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641

$48.791

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DigiPath Technology Company

USA . 641 parts In-Stock

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$48.791

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641

$48.791

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RC Electronics

USA . 44,527 parts In-Stock

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Authorized Procurement Solutions

USA . 12,258 parts In-Stock

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Perfect Parts

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Vigor

Singapore . 6,049 parts In-Stock

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Corphita

USA . 3,053 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,100 parts In-Stock

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Kepictronics

USA . 1,600 parts In-Stock

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Parana Technologies

USA . 1,307 parts In-Stock

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$31.023

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$31.023

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Overview

Unlock the power of innovation with STMicroelectronics' ST72F324BK6T6 microcontroller. Engineered for precision and reliability, this versatile device offers exceptional performance in a compact design, perfect for industrial applications. Benefit from its robust features like advanced analog-to-digital conversion and multiple connectivity options, ensuring seamless integration into your projects. Experience unmatched quality and support from a leader in semiconductor solutions, empowering you to elevate your designs effortlessly.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and resistance to environmental factors, making the microcontroller suitable for a variety of industrial applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient PCB layout, which is ideal for space-constrained applications.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, this microcontroller can be integrated into systems that require stable and reliable power supply up to this limit.

Package Shape: SQUARE

The square package shape aids in uniform heat dissipation, enhancing the thermal performance of the microcontroller.

Bit Size: 8

An 8-bit architecture is often suitable for simpler embedded applications, providing a balance of performance and ease of use.

Power Supplies (V): 5

Operating at a nominal supply voltage of 5 V makes this microcontroller compatible with a wide range of power sources commonly used in electronics.

No. of Terminals: 32

The 32 terminals offer the flexibility for multiple peripherals and I/O configurations, catering to diverse application needs.

Package Style (Meter): FLATPACK, LOW PROFILE

The flatpack and low-profile design minimizes the overall height of the circuit, facilitating integration into compact devices.

Minimum Supply Voltage: 3.8 V

The low minimum supply voltage enables the microcontroller to operate under lower power conditions, which is useful in battery-powered applications.

Maximum Operating Temperature: 85 °C

An operating temperature of 85 °C ensures reliable performance in moderately challenging thermal environments.

CPU Family: ST72

The ST72 family is well-regarded for its robustness and performance in operating small, efficient control systems.

Minimum Operating Temperature: -40 °C

The capability to function at -40 °C qualifies this microcontroller for use in extreme conditions, making it perfect for industrial and outdoor applications.

Terminal Finish: Matte Tin (Sn)

Matte tin terminal finish provides enhanced solderability, improving assembly reliability and performance.

ADC Channels: YES

Having built-in ADC channels allows for easier integration of analog signals, enhancing the versatility of the microcontroller in varied applications.

Terminal Position: QUAD

Quad terminal positions facilitate easy access to I/O lines, simplifying circuit design and layout.

ROM Words: 32768

A ROM capacity of 32 KB provides ample space for program storage, enabling complex applications and user-defined functionalities.

Maximum Seated Height: 1.6 mm

The low seated height allows for more compact designs, making it ideal for small form-factor applications.

Width: 7 mm

At only 7 mm in width, this microcontroller can easily fit in tight spaces within electronic devices.

Peripherals: POR, TIMER(4)

Integrated peripherals like Power-On Reset (POR) and multiple timers enhance the functionality and enable precise control in system operations.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz supports efficient processing speeds for a variety of applications, from simple to moderately complex tasks.

Maximum Time At Peak Reflow Temperature: 30 s

A maximum reflow time of 30 seconds ensures the microcontroller can endure standard soldering processes without damage.

Peak Reflow Temperature: 235 °C

A peak reflow temperature rating of 235 °C indicates compatibility with modern PCB assembly processes.

Length: 7 mm

The compact length enhances the microcontroller's versatility in various layouts and design configurations.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures reliability and durability in demanding environments, suitable for a variety of industrial applications.

Peripheral IC Type: MICROCONTROLLER

As a dedicated microcontroller, it is optimized for control applications, making it highly efficient in managing tasks.

RAM Bytes: 1024

1 KB of RAM provides sufficient workspace for variable storage and processing needs in embedded applications.

Technology: CMOS

Utilizing CMOS technology contributes to lower power consumption and increased functionality, enhancing battery life in portable applications.

Terminal Form: GULL WING

Gull wing terminal forms facilitate effective soldering, improving manufacturing efficiency and product reliability.

Analog To Digital Converters: 8-Ch 10-Bit

The availability of 8-channel, 10-bit ADCs allows for flexible and precise analog signal processing, expanding application possibilities.

Maximum Supply Current: 7 mA

With a maximum supply current of 7 mA, the microcontroller achieves energy efficiency, suitable for low-power applications.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5 V aligns with standard electronics, allowing for easy integration into existing systems.

PWM Channels: YES

Integrated PWM channels facilitate motor control and signal modulation applications, enhancing the microcontroller's versatility.

Connectivity: SCI, SPI

Support for SCI and SPI connectivity promotes compatibility with a wide range of peripherals and communication protocols.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to the firmware, improving the lifecycle management of applications.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch allows for finer routing on PCBs, catering to modern design requirements.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 means that the microcontroller can withstand moderate moisture exposure during handling and assembly.

Speed: 8 rpm

Support for 8 rpm speed is ideal for applications requiring controlled and precise movement, conducive for various motor control uses.

On Chip Program ROM Width: 8

An 8-bit program ROM width enhances compatibility with typical data sizes, simplifying application design.

No. of I/O Lines: 24

Having 24 I/O lines provides ample flexibility for interfacing with various sensors and devices in embedded systems.

Technical Specifications

Microcontrollers ST72F324BK6T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

24

No. of Terminals:

32

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

235

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

7 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SCI, SPI

Peripherals:

POR, TIMER(4)

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

ST72F324BK6T6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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