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ST72F324BK4T6

STMicroelectronics

ST72F324BK4T6 by STMicroelectronics

ST72F324BK4T6 microcontroller from STMicroelectronics features an 8-bit architecture, operates at a max voltage of 5.5V, and includes 8 ADC channels. With a compact flatpack design, it's ideal for industrial applications requiring reliable performance in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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ComSIT Distribution GmbH

Germany . 6,548 parts In-Stock

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Vyrian

USA . 6,029 parts In-Stock

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Prism Electronics

USA . 4,877 parts In-Stock

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Digiode

USA . 2,646 parts In-Stock

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Anansix

USA . 2,330 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 315 parts In-Stock

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$12.380

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315

$12.380

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IDEA Electronic Components Group

UK . 894 parts In-Stock

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$44.473

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$40.026

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894

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$40.026

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MKK Technologies

India . 2,016 parts In-Stock

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$83.628

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2,016

$83.628

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DigiPath Technology Company

USA . 2,016 parts In-Stock

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$83.628

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Component Stockers USA

USA . 512 parts In-Stock

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$99.990

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512

$99.990

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Perfect Parts

USA . 11,370 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 7,321 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,572 parts In-Stock

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Microchip USA

USA . 4,760 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Metaverse IC Inc.

Canada . 2,989 parts In-Stock

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Vigor

Singapore . 2,421 parts In-Stock

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Kepictronics

USA . 1,500 parts In-Stock

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GreenTree Electronics

Israel . 1,500 parts In-Stock

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1,500

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Parana Technologies

USA . 1,459 parts In-Stock

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$53.174

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ChipstoGo Electronic ltd

UK . 1,224 parts In-Stock

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Corphita

USA . 818 parts In-Stock

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Overview

Elevate your projects with the ST72F324BK4T6 microcontroller from STMicroelectronics, a leader in innovation and quality. This compact powerhouse offers exceptional performance, ideal for industrial applications where reliability is paramount. With advanced features like multiple ADC channels and robust connectivity, it empowers engineers to create efficient, high-performing designs. Trust STMicroelectronics to deliver unmatched value, ensuring your solutions stand out in today’s competitive market!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The robust plastic/epoxy material ensures durability and protects the microcontroller from environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and easier integration into printed circuit boards, enhancing manufacturing efficiency.

Maximum Supply Voltage: 5.5 V

The wide voltage range accommodates various power supply options, making it versatile for different systems.

Package Shape: SQUARE

The square shape optimizes board space utilization, facilitating better layout and design options.

Bit Size: 8

An 8-bit architecture is ideal for low power consumption applications, making it energy efficient while handling basic control tasks.

Power Supplies (V): 5

Operating at 5V ensures compatibility with standard logic levels and simplifies design considerations.

No. of Terminals: 32

With 32 terminals, this microcontroller provides ample connectivity options for various peripherals and I/O lines.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile design ensures compact integration in space-constrained applications, ideal for portable devices.

Minimum Supply Voltage: 3.8 V

The low minimum supply voltage enhances energy efficiency, enabling operation in battery-powered applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows this microcontroller to function reliably in industrial environments.

CPU Family: ST72

Being part of the ST72 family means it benefits from a well-established support ecosystem and optimized performance.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40 °C makes this microcontroller suitable for harsh environments.

Terminal Finish: Matte Tin (Sn)

The matte tin finish provides good solderability and reduces the risk of oxidation, ensuring reliable connections.

ADC Channels: YES

With ADC channels, this microcontroller can handle analog signals directly, making it suitable for sensor interfacing.

Terminal Position: QUAD

Quad terminal position enhances the stability and connection reliability of the microcontroller on PCBs.

ROM Words: 16384

A significant amount of ROM allows for the storage of complex programs and data, suitable for advanced applications.

Maximum Seated Height: 1.6 mm

The low seated height is advantageous for designs requiring thin profiles, further enhancing compactness.

Width: 7 mm

At 7 mm width, it fits comfortably in small form factor designs while still maintaining a good number of I/O options.

Peripherals: POR, TIMER(4)

Built-in peripherals, including power-on reset and timers, streamline design and reduce the need for additional components.

Maximum Clock Frequency: 16 MHz

A maximum clock speed of 16 MHz provides sufficient processing power for many applications while balancing power consumption.

Maximum Time At Peak Reflow Temperature (s): 30

A peak reflow time of 30 seconds ensures compatibility with standard surface mount assembly processes.

Peak Reflow Temperature °C: 235

Operating at a peak reflow temperature of 235 °C allows for reliable production using common soldering techniques.

Length: 7 mm

The compact length makes it suitable for mobile and embedded systems where space is a premium.

Temperature Grade: INDUSTRIAL

Industrial temperature grading indicates high reliability for applications in harsh environments, ensuring long-term performance.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it is designed specifically for embedded control applications, making it a targeted solution for developers.

RAM Bytes: 512

With 512 bytes of RAM, it provides adequate temporary storage for variables and data handling in embedded applications.

Technology: CMOS

CMOS technology enables low power consumption and high noise immunity, making it ideal for battery-operated and sensitive applications.

Terminal Form: GULL WING

Gull wing leads facilitate easy soldering and are widely used in surface mount technology, enhancing manufacturing flexibility.

Analog To Digital Converters: 8-Ch 10-Bit

The presence of 8-channel 10-bit ADCs allows simultaneous sensor monitoring and data acquisition, enhancing versatility.

Maximum Supply Current: 5.5 mA

A maximum supply current of 5.5 mA ensures low power consumption, making it suitable for power-sensitive applications.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V is standard and ensures compatibility in diverse electronic circuits.

PWM Channels: YES

The inclusion of PWM channels enables precise control of motors and other devices, enhancing its application scope.

Connectivity: SCI, SPI

Built-in communication interfaces like SCI and SPI facilitate efficient data transfer with other devices, broadening application possibilities.

ROM Programmability: FLASH

Flash memory allows for easy reprogramming of the microcontroller, giving flexibility during development and updates.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm allows for denser packing of components on a PCB, a key advantage in space-sensitive designs.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates reasonable handling precautions, helping to protect the microcontroller from moisture during assembly.

Speed: 8 rpm

This speed specification suggests the microcontroller can comfortably handle control tasks, providing reliable performance for various applications.

On Chip Program ROM Width: 8

An 8-bit ROM width allows compatibility with various programming environments and ease of coding for developers.

No. of I/O Lines: 24

With 24 I/O lines, the microcontroller can effectively interact with multiple external devices, making it highly versatile.

Technical Specifications

Microcontrollers ST72F324BK4T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

24

No. of Terminals:

32

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

235

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

512

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

5.5 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SCI, SPI

Peripherals:

POR, TIMER(4)

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

ST72F324BK4T6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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