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ST72F321R9T6

STMicroelectronics

ST72F321R9T6 by STMicroelectronics

ST72F321R9T6 microcontroller from STMicroelectronics features a 16 MHz CPU, operates b/w 3.8-5.5 V, and includes 16 ADC channels. Its low-profile design and industrial temperature range (-40 °C to 85°C) make it ideal for embedded applications in harsh environments. With 64 terminals and versatile connectivity options like I2C and SPI, it's perfect for complex control tasks.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Vyrian

USA . 8,745 parts In-Stock

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Digiode

USA . 2,370 parts In-Stock

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2,370

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Anansix

USA . 672 parts In-Stock

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672

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ACDS - Activité Composants Distribution Service

France . 40 parts In-Stock

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40

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ComSIT Distribution GmbH

Germany . 28 parts In-Stock

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28

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Martec Srl

Italy . 13 parts In-Stock

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Distributors (Availability)

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Component Stockers USA

USA . 4,929 parts In-Stock

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$7.420

100+ parts

$7.050

1k+ parts

$6.830

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4,929

$7.420

$7.050

$6.830

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Vigor

Singapore . 408 parts In-Stock

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$14.150

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408

$14.150

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AZTECH Wire

Italy . 1,116 parts In-Stock

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$19.900

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1,116

$19.900

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IDEA Electronic Components Group

UK . 1,719 parts In-Stock

1+ parts

$34.564

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-

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$31.108

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1,719

$34.564

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$31.108

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MKK Technologies

India . 188 parts In-Stock

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$64.996

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188

$64.996

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DigiPath Technology Company

USA . 188 parts In-Stock

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$64.996

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188

$64.996

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QUARKTWIN TECHNOLOGY LTD

USA . 27,596 parts In-Stock

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Kepictronics

USA . 13,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,507 parts In-Stock

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Microchip USA

USA . 4,668 parts In-Stock

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Corphita

USA . 4,486 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Perfect Parts

USA . 1,493 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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GreenTree Electronics

Israel . 708 parts In-Stock

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Parana Technologies

USA . 595 parts In-Stock

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$41.327

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595

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$41.327

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Overview

Unlock the potential of your projects with the ST72F321R9T6 microcontroller from STMicroelectronics, a leader in innovation and quality. Designed for versatility, this robust 8-bit powerhouse excels in industrial applications, offering exceptional performance at temperatures ranging from -40 °C to 85°C. Experience reliability and efficiency with advanced features such as multiple ADC channels and flexible connectivity options, ensuring seamless integration into your designs. Elevate your solutions with STMicroelectronics—where excellence meets ingenuity!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material enhances durability and provides good protection for the microcontroller.

Surface Mount: YES

Surface mount technology allows for a compact design and ease of integration into modern PCB layouts.

Maximum Supply Voltage: 5.5 V

This voltage range provides flexibility for various applications while ensuring the microcontroller operates safely.

Package Shape: SQUARE

The square package shape allows for efficient space utilization on the PCB.

Bit Size: 8

An 8-bit architecture is suitable for simpler, cost-effective applications.

Power Supplies (V): 3.8/5.5

Support for a wider supply voltage range makes it adaptable to different system requirements.

No. of Terminals: 64

The 64 terminals offer extensive connectivity options for various peripherals and inputs/outputs.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack design aids in saving space and contributes to a sleeker product design.

Minimum Supply Voltage: 3.8 V

The minimum voltage requirement facilitates energy-efficient applications.

Maximum Operating Temperature: 85 °C

High-temperature tolerance makes this microcontroller suitable for industrial applications.

CPU Family: ST72

Being part of the ST72 family ensures reliability and familiarity for developers.

Minimum Operating Temperature: -40 °C

This extreme temperature range can operate in harsh environments, making it versatile.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The premium terminal finish enhances corrosion resistance and improves solderability.

ADC Channels: YES

The presence of ADC channels allows for efficient analog signal processing.

Terminal Position: QUAD

Quad terminal positioning maximizes connectivity options.

ROM Words: 61440

A significant amount of ROM supports complex applications with substantial code requirements.

Maximum Seated Height: 1.6 mm

This low height profile contributes to a compact assembly and reduced production costs.

Width: 14 mm

14 mm width allows for efficient use of PCB space.

Peripherals: POR, TIMER(5)

Integrated peripherals enhance functionality and simplify design complexities.

Maximum Clock Frequency: 16 MHz

A clock frequency of 16 MHz provides sufficient processing power for many applications.

Maximum Time At Peak Reflow Temperature (s): 30

Short peak reflow time minimizes thermal stress during assembly.

Peak Reflow Temperature (°C): 260

High peak reflow temperature compatibility ensures reliable soldering in manufacturing.

Length: 14 mm

Compact length is advantageous for designs requiring space efficiency.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures reliability in demanding operating environments.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it is specifically optimized for embedded applications.

RAM Bytes: 2048

2048 bytes of RAM supports moderate data handling capabilities.

Technology: CMOS

CMOS technology ensures low power consumption and high-speed operation.

Terminal Form: GULL WING

Gull wing terminals enhance the ease of soldering and improve assembly yield.

Analog To Digital Converters: 16-Ch 10-Bit

16-channel 10-bit ADCs provide flexibility for diverse sensor applications.

Maximum Supply Current: 15 mA

Low power consumption makes it suitable for battery-powered applications.

Nominal Supply Voltage: 4 V

A nominal supply voltage of 4V indicates energy efficiency and stability.

PWM Channels: YES

PWM channels allow for efficient motor control and other signal modulation applications.

Connectivity: I2C, SCI, SPI

Multiple connectivity options enable easy integration with various devices and protocols.

ROM Programmability: FLASH

Flash programmability allows for easy updates and enhancements to firmware.

Terminal Pitch: 0.8 mm

A smaller terminal pitch accommodates more connectivity in limited spaces.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity, ensuring careful handling and storage during manufacturing.

Speed: 8 rpm

This speed specification indicates suitability for low speed applications, enhancing efficiency.

On Chip Program ROM Width: 8

An 8-bit ROM width is ideal for applications requiring simple processing.

No. of I/O Lines: 48

48 I/O lines facilitate extensive interfacing capabilities for various peripheral devices.

Technical Specifications

Microcontrollers ST72F321R9T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

48

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.66SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.8/5.5

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

61440

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

15 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

4 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SCI, SPI

Peripherals:

POR, TIMER(5)

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

ST72F321R9T6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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