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ST72F321M9T6

STMicroelectronics

ST72F321M9T6 by STMicroelectronics

ST72F321M9T6 microcontroller from STMicroelectronics features an 8-bit CPU, operates at a max voltage of 5.5V, and includes 64 I/O lines. It’s ideal for industrial applications due to its -40 °C to 85°C temp range and low-profile package design. With 61440 ROM words and PWM channels, it supports versatile control tasks.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,029 parts In-Stock

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5,029

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Anansix

USA . 2,234 parts In-Stock

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2,234

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Digiode

USA . 1,245 parts In-Stock

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1,245

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Distributors (Availability)

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Microchip USA

USA . 119 parts In-Stock

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$10.137

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119

$10.137

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AZTECH Wire

Italy . 294 parts In-Stock

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$15.560

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294

$15.560

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IDEA Electronic Components Group

UK . 65 parts In-Stock

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$60.880

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-

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$54.792

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65

$60.880

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$54.792

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MKK Technologies

India . 1,865 parts In-Stock

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$114.481

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1,865

$114.481

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DigiPath Technology Company

USA . 1,865 parts In-Stock

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$114.481

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1,865

$114.481

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Vigor

Singapore . 2,500 parts In-Stock

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2,500

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Parana Technologies

USA . 1,049 parts In-Stock

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$72.791

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$72.791

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Corphita

USA . 847 parts In-Stock

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Perfect Parts

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Overview

Unlock exceptional performance with the ST72F321M9T6 microcontroller from STMicroelectronics. Renowned for its reliability and innovation, STMicroelectronics equips this compact powerhouse for diverse applications, whether in consumer electronics or industrial automation. With its low power consumption and robust design, it ensures efficiency without compromise. Experience seamless integration and enhanced functionality that boosts your projects to the next level while delivering unmatched value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers a robust and lightweight construction, ensuring durability and reliability in various applications.

Surface Mount: YES

Surface mount capability allows for compact PCB designs, improving space utilization and facilitating automated manufacturing processes.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V ensures compatibility with a wide range of power sources and applications.

Package Shape: SQUARE

The square package shape aids in uniform heat dissipation and simplifies board layout during design.

Bit Size: 8

An 8-bit architecture supports efficient processing for many embedded applications.

Power Supplies (V): 3.5/5

Supports a dual voltage supply, offering flexibility for different circuit designs.

No. of Terminals: 80

With 80 terminals, it provides ample I/O options for interfacing with a variety of peripherals and sensors.

Package Style (Meter): FLATPACK, LOW PROFILE

The low profile flatpack style saves space in compact designs and allows for easier integration.

Minimum Supply Voltage: 3.8 V

A minimum supply voltage of 3.8 V enhances system design flexibility by accommodating a broader range of components.

Maximum Operating Temperature: 85 °C

An operating temperature of 85 °C makes it suitable for industrial environments, ensuring reliable operation under thermal stress.

CPU Family: ST72

Part of the ST72 family, known for its efficiency and performance in various embedded applications.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C makes this microcontroller viable for harsh environmental conditions.

Terminal Finish: MATTE TIN

A matte tin finish enhances solderability and minimizes the risk of oxidation over time.

ADC Channels: YES

Integrated ADC channels allow for direct interfacing with analog signals, enhancing measurement capabilities.

Terminal Position: QUAD

Quad terminal positioning improves PCB layout flexibility, making routing easier.

ROM Words: 61440

With 61440 ROM words, it provides substantial memory for program storage, accommodating complex applications.

Maximum Seated Height: 1.6 mm

A low seated height of 1.6 mm contributes to a thinner profile in designs, ideal for portable applications.

Width: 14 mm

A compact width of 14 mm facilitates space-constrained applications without sacrificing functionality.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz supports fast processing, suitable for time-sensitive applications.

Maximum Time At Peak Reflow Temperature: 30 s

A long time at peak reflow temperature ensures reliable soldering without damaging the component.

Peak Reflow Temperature: 250 °C

A peak reflow temperature of 250 °C provides compatibility with standard soldering processes.

Length: 14 mm

A length of 14 mm keeps the footprint compact, making the microcontroller suitable for dense electronic designs.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, ensuring reliability and performance in demanding environments.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it integrates processing power with peripheral management, streamlining embedded system design.

RAM Bytes: 2048

With 2048 bytes of RAM, it supports adequate data handling for a range of applications.

Technology: CMOS

CMOS technology delivers low power consumption, making it efficient for battery-operated devices.

Terminal Form: GULL WING

The gull wing terminal form ensures firm solder joints and simplifies the assembly process.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V is widely utilized in various electronic systems, facilitating integration.

PWM Channels: YES

The inclusion of PWM channels allows for precise control of motors, lights, and other actuators.

ROM Programmability: FLASH

Flash ROM programmability enables easy updates and flexible use in evolving applications.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for tighter packing on PCBs, optimizing layout design.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates the product is suitable for surface mount technology and can withstand typical soldering processes.

Speed: 8 rpm

Though the speed specification might seem low, it demonstrates the device's suitability for low-speed, precise applications.

No. of I/O Lines: 64

With 64 I/O lines available, it provides flexibility and high connectivity for interfacing with multiple devices.

Technical Specifications

Microcontrollers ST72F321M9T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

64

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.64SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

250

Power Supplies (V):

3.5/5

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

61440

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

ST72F321M9T6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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