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ST72F321J9TCS

STMicroelectronics

ST72F321J9TCS by STMicroelectronics

ST72F321J9TCS by STMicroelectronics is an 8-bit microcontroller with 44 terminals, operating at a max frequency of 16 MHz. Ideal for automotive applications, it features 2048 bytes of RAM, 61440 ROM words, and connectivity options like I2C, SCI, SPI.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,871 parts In-Stock

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6,871

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Digiode

USA . 3,717 parts In-Stock

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3,717

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Anansix

USA . 1,056 parts In-Stock

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1,056

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Distributors (Availability)

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AZTECH Wire

Italy . 862 parts In-Stock

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$9.700

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-

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862

$9.700

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IDEA Electronic Components Group

UK . 1,807 parts In-Stock

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$66.161

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-

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$59.545

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1,807

$66.161

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$59.545

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Component Stockers USA

USA . 398 parts In-Stock

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$99.990

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398

$99.990

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MKK Technologies

India . 161 parts In-Stock

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$124.411

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161

$124.411

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DigiPath Technology Company

USA . 161 parts In-Stock

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$124.411

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161

$124.411

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Corphita

USA . 4,529 parts In-Stock

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4,529

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Microchip USA

USA . 2,889 parts In-Stock

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Vigor

Singapore . 1,382 parts In-Stock

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1,382

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Parana Technologies

USA . 529 parts In-Stock

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$79.105

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529

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$79.105

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Assy Fe

Spain . 17 parts In-Stock

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Overview

Unlock endless possibilities with the ST72F321J9TCS microcontroller by STMicroelectronics. This high-quality product offers unparalleled value with its innovative features and reliable performance. Ideal for a wide range of applications, this microcontroller boasts 8-bit processing power, 2048 RAM bytes, and 61440 ROM words. With 12-channel 10-bit ADC, 5 timers, and connectivity options including I2C, SCI, and SPI, this versatile device is perfect for automotive and industrial use. Trust STMicroelectronics to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material PLASTIC/EPOXY

Plastic/Epoxy material provides durability and resistance to environmental factors, making it suitable for a variety of applications.

Surface Mount YES

Surface mount technology allows for compact design and easy integration into PCBs, saving valuable space in electronic devices.

Maximum Supply Voltage 5.5 V

With a maximum supply voltage of 5.5V, this microcontroller can handle a wide range of input voltages, providing flexibility in power supply options.

Package Shape SQUARE

Square package shape helps in easy mounting and alignment during PCB assembly, minimizing errors and ensuring proper connections.

Bit Size 8

8-bit architecture provides a good balance between performance and cost, making it suitable for a wide range of embedded applications.

No. of Terminals 44

With 44 terminals, this microcontroller offers plenty of I/O options for connecting external peripherals and sensors, enhancing its functionality.

Minimum Operating Temperature -40 °C

With a minimum operating temperature of -40 °C, this microcontroller can withstand extreme cold environments, making it ideal for automotive and industrial applications.

ADC Channels YES

Analog-to-digital converter channels enable the microcontroller to read and process analog sensor data, providing accurate measurement and control capabilities.

Maximum Clock Frequency 16 MHz

High clock frequency allows for fast data processing and real-time operation, making it suitable for applications that require quick response times.

RAM Bytes 2048

With 2048 bytes of RAM, this microcontroller can store and process a significant amount of data, enabling complex algorithms and multitasking.

Connectivity I2C, SCI, SPI

Support for I2C, SCI, and SPI communication protocols enables seamless integration with a wide range of devices, enhancing connectivity and interoperability.

ROM Programmability FLASH

Flash programmable ROM allows for easy firmware updates and customization, ensuring flexibility and future-proofing for the product.

Technical Specifications

Microcontrollers ST72F321J9TCS attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G44

Length:

10 mm

No. of I/O Lines:

32

No. of Terminals:

44

No. of Timers:

5

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

2048

ROM Words:

61440

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SCI, SPI

Peripherals:

TIMER(5)

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

ST72F321J9TCS Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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