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ST72F321J9TA

STMicroelectronics

ST72F321J9TA by STMicroelectronics

ST72F321J9TA microcontroller from STMicroelectronics features a 16 MHz CPU, 32 I/O lines, and operates within a supply voltage of 3.8-5.5 V. Its industrial-grade design supports applications requiring reliable performance in harsh environments. Ideal for embedded systems with ADC and PWM capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,659 parts In-Stock

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5,659

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Digiode

USA . 2,372 parts In-Stock

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2,372

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Anansix

USA . 611 parts In-Stock

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611

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Distributors (Availability)

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Microchip USA

USA . 246 parts In-Stock

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$10.203

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246

$10.203

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AZTECH Wire

Italy . 1,107 parts In-Stock

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$20.510

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1,107

$20.510

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IDEA Electronic Components Group

UK . 837 parts In-Stock

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$25.437

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$22.893

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837

$25.437

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$22.893

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MKK Technologies

India . 606 parts In-Stock

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$47.833

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606

$47.833

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DigiPath Technology Company

USA . 606 parts In-Stock

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$47.833

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606

$47.833

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Corphita

USA . 2,930 parts In-Stock

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Vigor

Singapore . 2,193 parts In-Stock

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Parana Technologies

USA . 635 parts In-Stock

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$30.414

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635

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$30.414

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Overview

Unlock the potential of your designs with the ST72F321J9TA microcontroller from STMicroelectronics! Renowned for its quality and reliability, this versatile 8-bit powerhouse is perfect for industrial applications, delivering robust performance in compact spaces. Enjoy seamless connectivity options and advanced peripherals that simplify integration and enhance functionality. Elevate your projects with a dependable partner that embodies innovation and excellence—experience the ST difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body ensures a lightweight and durable design, making it ideal for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs, facilitating easier integration into smaller circuits.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V makes this microcontroller versatile for many applications without the risk of over-voltage damage.

Package Shape: SQUARE

The square package shape optimizes PCB space and layout, making it easier to implement in various configurations.

Bit Size: 8

With an 8-bit size, this microcontroller is suitable for control-oriented applications where lower complexity is beneficial.

Power Supplies (V): 3.8/5.5

Dual power supply options provide flexibility, accommodating various circuit designs and requirements.

No. of Terminals: 44

A larger number of terminals allows for extensive I/O connectivity, enabling complex applications with multiple input and output requirements.

Package Style (Meter): FLATPACK, LOW PROFILE

The low profile flatpack style aids in reducing the overall height of the assembly, which is ideal for compact devices.

Minimum Supply Voltage: 3.8 V

A minimum supply voltage of 3.8 V allows it to operate efficiently under various conditions, enhancing its applicability.

Maximum Operating Temperature: 85 °C

The ability to operate at high temperatures allows this microcontroller to function reliably in demanding industrial environments.

CPU Family: ST72

Part of the ST72 family, this microcontroller benefits from proven architecture and a strong support ecosystem.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, it is well-suited for extreme environments, ensuring reliability.

Terminal Finish: NICKEL PALLADIUM GOLD

The premium terminal finish enhances conductivity and resistance to corrosion, improving longevity and performance.

ADC Channels: YES

Analog-to-Digital Conversion capabilities increase the versatility of this microcontroller in interfacing with analog sensors.

Terminal Position: QUAD

The quad terminal position provides good mechanical stability and ease of soldering in assembly processes.

ROM Words: 61440

A generous ROM size of 61440 words allows for the implementation of complex programs and functionalities.

Maximum Seated Height: 1.6 mm

A maximum seated height of 1.6 mm enables compatibility with low-profile applications and space-critical designs.

Width: 10 mm

A compact width of 10 mm facilitates easy placement on PCBs without taking up excessive space.

Peripherals: TIMER(5)

Multiple timers enhance the microcontroller's capability to manage time-critical tasks effectively.

Maximum Clock Frequency: 16 MHz

Operating at 16 MHz ensures sufficient processing speed for most applications, providing a balance between performance and power consumption.

Length: 10 mm

A standard length of 10 mm makes layout design straightforward and compatible with standard PCB components.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, ensuring reliability and performance in harsh environments.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it integrates key components offering efficiency and simplification in design.

No. of Timers: 5

Five timers enable sophisticated timing functions, crucial for many control applications.

RAM Bytes: 2048

With 2048 bytes of RAM, adequate memory is provided for temporary storage of data and efficient processing.

Technology: CMOS

CMOS technology supports low power consumption, which is essential for battery-operated devices and energy-efficient designs.

Terminal Form: GULL WING

Gull wing terminals offer excellent solderability and are widely used in surface mount applications.

Analog To Digital Converters: 12-Ch 10-Bit

A 12-channel, 10-bit ADC enables a wide range of sensor interfaces, making the microcontroller versatile and adaptable.

Maximum Supply Current: 15 mA

A low maximum supply current of 15 mA contributes to better battery life in portable applications.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage is a standard in many devices, making it easy to integrate with existing systems.

PWM Channels: YES

Pulse Width Modulation channels support motor control and other applications requiring varying signal levels.

Connectivity: I2C, SCI, SPI

Multiple connectivity options including I2C, SCI, and SPI enhance communication capabilities with other devices.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and modifications to firmware, enhancing product lifespan and versatility.

Terminal Pitch: 0.8 mm

The 0.8 mm terminal pitch provides compatibility with various soldering techniques, improving manufacturability.

Speed: 8 rpm

An operational speed of 8 rpm is adequate for many control applications that do not require faster processing.

On Chip Program ROM Width: 8

An 8-bit program ROM width simplifies the architecture and can result in energy-efficient applications.

No. of I/O Lines: 32

Having 32 I/O lines allows the microcontroller to interface with a significant number of peripherals, enhancing flexibility.

Technical Specifications

Microcontrollers ST72F321J9TA attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e4

Length:

10 mm

No. of I/O Lines:

32

No. of Terminals:

44

No. of Timers:

5

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

3.8/5.5

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

61440

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

15 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SCI, SPI

Peripherals:

TIMER(5)

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

ST72F321J9TA Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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