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ST72F321J7T6

STMicroelectronics

ST72F321J7T6 by STMicroelectronics

ST72F321J7T6 microcontroller from STMicroelectronics features a 16 MHz CPU, operates b/w 3.8V and 5.5V, and includes 12 ADC channels. Its compact design with a low-profile flatpack makes it ideal for industrial applications. With 49152 ROM words and robust connectivity options, it's versatile for embedded systems.

Median Price

$4.780

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

American Microsemiconductor Inc.

USA . 110 parts In-Stock

1+ parts

$4.780

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110

$4.780

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Chip Stock

USA . 9,200 parts In-Stock

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9,200

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Vyrian

USA . 7,047 parts In-Stock

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7,047

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Digiode

USA . 3,173 parts In-Stock

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3,173

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Anansix

USA . 1,422 parts In-Stock

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1,422

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 345 parts In-Stock

1+ parts

$7.553

100+ parts

-

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345

$7.553

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AZTECH Wire

Italy . 551 parts In-Stock

1+ parts

$12.530

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-

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551

$12.530

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IDEA Electronic Components Group

UK . 491 parts In-Stock

1+ parts

$78.191

100+ parts

-

1k+ parts

$70.372

10k+ parts

-

491

$78.191

-

$70.372

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Component Stockers USA

USA . 382 parts In-Stock

1+ parts

$99.990

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382

$99.990

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MKK Technologies

India . 1,677 parts In-Stock

1+ parts

$147.033

100+ parts

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1,677

$147.033

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DigiPath Technology Company

USA . 1,677 parts In-Stock

1+ parts

$147.033

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1,677

$147.033

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Authorized Procurement Solutions

USA . 20,000 parts In-Stock

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20,000

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Vigor

Singapore . 9,000 parts In-Stock

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9,000

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A-Z Elektronik GmbH

Germany . 5,631 parts In-Stock

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5,631

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Corphita

USA . 2,374 parts In-Stock

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2,374

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Perfect Parts

USA . 2,330 parts In-Stock

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2,330

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Kepictronics

USA . 916 parts In-Stock

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916

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Parana Technologies

USA . 732 parts In-Stock

1+ parts

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100+ parts

$93.489

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732

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$93.489

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Overview

Unlock the power of innovation with the ST72F321J7T6 microcontroller from STMicroelectronics, a trusted name in cutting-edge technology. Designed for durability and versatility, this compact powerhouse operates seamlessly in industrial applications, delivering reliable performance across various environments. With superior connectivity options and efficient power management, it enhances your designs while reducing development time—offering unmatched value and performance for innovators like you.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and efficient use of board space, ideal for modern electronics.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V ensures compatibility with a wide range of power supplies and reduces the risk of damage.

Package Shape: SQUARE

The square shape contributes to a uniform layout on PCBs, simplifying assembly and optimizing space.

Bit Size: 8

An 8-bit architecture allows for easier programming and interfacing with various devices, making it user-friendly.

Power Supplies (V): 3.3/5

Support for both 3.3 V and 5 V power supplies makes this microcontroller versatile for different application needs.

No. of Terminals: 44

With 44 terminals, the microcontroller provides ample connectivity options for various peripherals and sensors.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile design promotes easy integration into space-constrained environments without sacrificing performance.

Minimum Supply Voltage: 3.8 V

A minimum supply voltage of 3.8 V ensures reliable operation in applications with limited power availability.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications, the high maximum operating temperature ensures reliability in harsh conditions.

CPU Family: ST72

The ST72 CPU family is known for robust performance in embedded systems, making it a trusted choice among developers.

Minimum Operating Temperature: -40 °C

The ability to operate in extreme low temperatures expands the microcontroller's application range to outdoor and industrial uses.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish promotes good solderability and corrosion resistance, enhancing reliability in final products.

ADC Channels: YES

Having ADC channels provides the capability to interface with analog signals, broadening the range of potential applications.

Terminal Position: QUAD

Quad terminal positioning allows for better layout flexibility and improves electrical performance in design.

ROM Words: 49152

With a sizeable ROM, this microcontroller can store substantial code, enabling more complex application development.

Maximum Seated Height: 1.6 mm

The low seated height enhances compatibility with various PCBs and allows for compact device designs.

Width: 10 mm

A compact width of 10 mm makes this microcontroller suitable for space-constrained applications.

Peripherals: POR, TIMER(5)

Built-in peripherals like POR and timers enhance functionality, making it easier to manage power and time-sensitive tasks.

Maximum Clock Frequency: 16 MHz

A 16 MHz clock frequency provides adequate processing speed for a variety of applications, ensuring responsiveness.

Maximum Time At Peak Reflow Temperature: 30 s

A reasonable reflow time accommodates most soldering processes, ensuring reliable assembly without damaging components.

Peak Reflow Temperature: 260 °C

The high peak reflow temperature allows for compatibility with lead-free soldering processes, broadening manufacturing options.

Length: 10 mm

This length contributes to the compact form factor, making it ideal for miniaturized electronic devices.

Temperature Grade: INDUSTRIAL

An industrial temperature grade guarantees further reliability in extreme environments, making it suitable for critical applications.

Peripheral IC Type: MICROCONTROLLER

As a dedicated microcontroller, it is optimized for embedded applications, ensuring high efficiency in control tasks.

RAM Bytes: 1536

With 1536 bytes of RAM, there is enough memory for adequate task execution, ensuring smooth operation of embedded applications.

Technology: CMOS

CMOS technology enables low power consumption, extending battery life in portable applications.

Terminal Form: GULL WING

The gull-wing terminal form improves soldering reliability and is compatible with automated placement processes.

Analog To Digital Converters: 12-Ch 10-Bit

The presence of 12-channel, 10-bit ADCs enhances the controller's ability to interface with multiple analog inputs effectively.

Maximum Supply Current: 15 mA

A low maximum supply current ensures energy efficiency, which is essential for battery-operated devices.

Nominal Supply Voltage: 4 V

The nominal voltage of 4 V allows for standard operational conditions, ensuring consistent performance.

PWM Channels: YES

Support for PWM channels offers greater control over motor functions and other applications requiring variable signal outputs.

Connectivity: I2C, SCI, SPI

Multiple connectivity options like I2C, SCI, and SPI ensure easy integration with other components and peripherals.

ROM Programmability: FLASH

Flash programmability enables easy updates and modifications to the software without replacing the hardware.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch facilitates fine-pitch designs, which is essential for high-density applications.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates a higher durability during manufacturing, providing assurance against moisture-related damage.

Speed: 8 rpm

At 8 rpm, the microcontroller can efficiently manage control operations, suitable for various applications.

On Chip Program ROM Width: 8

An 8-bit program ROM width simplifies programming and interfacing, making it easier for developers to work with.

No. of I/O Lines: 32

With 32 I/O lines, this microcontroller provides extensive interfacing capabilities for various peripherals.

Technical Specifications

Microcontrollers ST72F321J7T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

32

No. of Terminals:

44

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

1536

ROM Words:

49152

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

15 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

4 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SCI, SPI

Peripherals:

POR, TIMER(5)

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

ST72F321J7T6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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